JPS6040964A - Resistance value measuring probe for laser trimming - Google Patents

Resistance value measuring probe for laser trimming

Info

Publication number
JPS6040964A
JPS6040964A JP58149054A JP14905483A JPS6040964A JP S6040964 A JPS6040964 A JP S6040964A JP 58149054 A JP58149054 A JP 58149054A JP 14905483 A JP14905483 A JP 14905483A JP S6040964 A JPS6040964 A JP S6040964A
Authority
JP
Japan
Prior art keywords
laser beam
resistor
resistance value
transparent
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58149054A
Other languages
Japanese (ja)
Inventor
Shiro Ezaki
江崎 史郎
Norio Kasai
笠井 則男
Shigetaka Tamura
田村 成敬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58149054A priority Critical patent/JPS6040964A/en
Publication of JPS6040964A publication Critical patent/JPS6040964A/en
Pending legal-status Critical Current

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  • Measurement Of Resistance Or Impedance (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To reduce the beam path obstacle of laser beam, by providing such a structure that a contact pin for the electrical continuity with the electrode part of a resistor is erected on a transparent insulating base plate pervious to laser beam and wiring is performed to a transparent film conductor pervious to laser beam. CONSTITUTION:In trimming a film resistance base plate 13 having a resistor 11 and an electrode part 12 formed thereto, a transparent insulating base plate 14 easily transmitting laser beam is used and holes are provided to the base plate 14 at the positions corresponding to the electrode part 12 while contact pins 15 having springiness are planted to the holes in an upright state. In the next step, the pins and external connection terminals 16 are connected by transparent thin film conductors transmissive to laser beam, for example, a thin film pattern 17 formed of indium oxide to which about 5wt% of tin is added. By using thus constituted resistance value measuring probe, the resistor 11 can be trimmed and the beam path obstacle of laser beam can be reduced because laser beam 18 is transmitted even if the conductor 17 is present on the beam path of said beam 18.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、抵抗体のレーザトリミングの際、レーザ光線
の障害となる部分が少いレーザトリミング用抵抗値測定
プローブに関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a resistance value measuring probe for laser trimming that has fewer parts that obstruct the laser beam during laser trimming of a resistor.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

最近電子機器の小型軽量化の為に混成集積回路や抵抗モ
ジュールが多用される様になった力ζこの混成集積回路
や抵抗モジュール中の印刷もしくは蒸着などによって形
成される抵抗体の抵抗値を設定した値に一致させて製作
することは非常に困雑である。このため、通常は設定値
よりも低い抵抗素子を形成し、その後、サンドブラスト
、レーザ光線あるいはドリルによってこの抵抗体をトリ
ミングして設定イばへの調整が行われる。トリミングに
レーザ光線を使用すると、サンドブラストやドリルを使
う方法などと比較して高精度、高速度のトリミングが可
能であり量産向きである。
Recently, hybrid integrated circuits and resistance modules have come into widespread use to make electronic devices smaller and lighter.ζ Sets the resistance value of the resistor formed by printing or vapor deposition in hybrid integrated circuits and resistance modules. It is extremely difficult to manufacture products that match these values. For this purpose, it is customary to form a resistive element with a lower value than the set value, and then trim this resistor to the set point by sandblasting, laser beams or drilling. Using a laser beam for trimming allows for higher precision and faster trimming than methods that use sandblasting or a drill, making it suitable for mass production.

レーザトリミングは通常トリミングしようとする抵抗体
にレーザ光を照射し、この抵抗体の抵抗値を計画しなが
ら抵抗体の一部を切断し、抵抗値が設定値に達した時点
で切断を停止することにより行われる。
Laser trimming usually involves irradiating a laser beam onto the resistor to be trimmed, cutting part of the resistor while planning the resistance value of the resistor, and stopping cutting when the resistance value reaches the set value. This is done by

上述したレーザトリミングにおいて、抵抗体の抵抗値測
定に用いられる従来の抵抗値測定プローブを第1図に示
す。即ち、厚膜又は薄膜抵抗体よりなる抵抗体1及びそ
の電極部2が形成された絶縁基板3に対して、それより
大きなプローブカード4に固定された抵抗値測定プロー
ブ5を取り付け、プローブ5の先端を抵抗体の電極部2
まで斜に延はす。この様にして一枚の基板3内の抵抗体
の電極部2に多数のプローブ5を立てて抵抗値を計測し
ながら上方よりレーザ光線6を照射してトリミングする
。この時グローブ5の材質は一般的にべIJ IJニー
ム銅や黄銅等の金属材料を使用している為に、グローブ
5の影になった抵抗体lはレーザ光線6でトリミングで
きないことになる。従って、近年の抵抗体の高密度実装
化は、レーザトリミングにおける抵抗値測定プローブが
空間を占める割合の増加を必要とするが、レーザ光線の
光路の確保のため抵抗値測定プローブを一度に設置でき
る数量は限られてくる。従って抵抗体が高密度実装化さ
れた混成集積回路や抵抗モジュールにおける抵抗体のレ
ーザト、リミングでは、例えばプローブカードを複数個
用い、抵抗体を複数回に分けてトリミングすることが必
要になる。
FIG. 1 shows a conventional resistance value measuring probe used for measuring the resistance value of a resistor in the laser trimming described above. That is, a resistance value measuring probe 5 fixed to a larger probe card 4 is attached to an insulating substrate 3 on which a resistor 1 made of a thick-film or thin-film resistor and its electrode part 2 are formed, and the resistance value measuring probe 5 fixed to a larger probe card 4 is attached. Connect the tip of the resistor to the electrode part 2
Spread diagonally until the end. In this way, a large number of probes 5 are set up on the electrode portion 2 of the resistor in one substrate 3, and the resistance value is measured while trimming is performed by irradiating the laser beam 6 from above. At this time, since the material of the globe 5 is generally a metal material such as neem copper or brass, the resistor l in the shadow of the globe 5 cannot be trimmed by the laser beam 6. Therefore, the recent high-density mounting of resistors requires an increase in the space occupied by the resistance measurement probes in laser trimming, but it is possible to install the resistance measurement probes all at once to ensure the optical path of the laser beam. Quantity will be limited. Therefore, when laser cutting and trimming resistors in a hybrid integrated circuit or a resistor module in which resistors are mounted at high density, it is necessary to use, for example, a plurality of probe cards and trim the resistors in multiple steps.

〔発明の目的〕[Purpose of the invention]

本発明は上記の欠点を解決するためになされたものであ
り、レーザ光線の光路の障害となる部分が少ないレーザ
トリミング用抵抗値測定プローブを提供することを目的
とする。
The present invention has been made in order to solve the above-mentioned drawbacks, and an object of the present invention is to provide a resistance value measuring probe for laser trimming that has fewer parts that obstruct the optical path of the laser beam.

〔発明の概−安〕[Summary of the invention]

本発明はレーザ光線を透フIfi l、やすい透明絶縁
基板に、抵抗体の電極部と接する為のばね性を有するコ
ンタクトピンをほぼ垂直に立てると共に、このコンタク
トピンと外部接続端子間はレーザ光線を透過しやすい透
明薄)トカ導体で配線された構造を有することを%徴と
する。
In the present invention, a contact pin having a spring property for making contact with an electrode part of a resistor is erected almost vertically on a transparent insulating substrate that is easily transparent to a laser beam, and the laser beam is transmitted between the contact pin and an external connection terminal. It is characterized by having a structure wired with a transparent thin conductor that is easy to pass through.

〔発明の実施し11〕 以下図面を参照して本発明の実施例を詳イ10に説明す
る。
[Embodiment 11 of the Invention] Embodiments of the present invention will be described in detail below with reference to the drawings.

第2図は本発明に係るレーザトリミング用抵抗値測定グ
ローブの一実施例を示す概略構成図である。即ち、抵抗
体11及びその電極部12の形成された膜抵抗基板13
をレーザトリミングする場合、レーザ光線を透過しやす
い透明絶縁基板14例えばガラス板又は透明アクリル樹
脂板などを用い電極部12に対応する位置の絶縁基板1
4に穴をあけて、この穴にばね性を有するコンタクトピ
ン151FIえは金又はロジウムメーツキ等を施したベ
リリュム銅又は黄銅等のピンを植立する。次に、このコ
ンタクトピン15と外部接続端子16間はレーザ光線を
透過する透明薄膜導体例えば酸化インジウムにスズを添
加したもの、酸化スズにアンチモンを添加したもの等を
蒸着法、気相合成法などで形成した薄11! ハターン
17で接続する。この薄膜パターン17の形成方法は必
要なパターン形状に形成しても良いし、絶縁基板14に
予め全面に被色して必要ハターン形状にエツチング法等
で形成しても良い。また、コンタクトピン75とi膜パ
ターン17は導電性塗料等(図示せず)で接着した方が
接続は確実である。上記の如き本発明によるレーザトリ
ミング用抵抗値…1]定プローブの構造に於て、透明f
Ig−膜導体による薄膜パターンZ7の材質として例え
ば酸化インジウムを用いた場合、酸化インジウム導体で
は高抵抗であるのに対し、スズを適鍍添加することによ
り低抵抗になると同時にレーザ光の透過特性も変化する
。し11えばYAGレーザ発振器を用いる場合、酸化イ
ンジウムにスズ約5¥X匍−%添加するのが好ましく、
膜抵抗が低下すると共に波長1.06μmのYA()レ
ーザ光を最も透過しゃすくなる。
FIG. 2 is a schematic diagram showing an embodiment of a resistance value measuring glove for laser trimming according to the present invention. That is, a film resistance substrate 13 on which a resistor 11 and its electrode portion 12 are formed.
When performing laser trimming, a transparent insulating substrate 14, such as a glass plate or a transparent acrylic resin plate, through which laser beams can easily pass, is used to remove the insulating substrate 1 at a position corresponding to the electrode part 12.
4, and a contact pin 151FI having spring properties is planted in the hole, and a pin made of beryllium copper or brass plated with gold or rhodium plating is planted in the hole. Next, between the contact pin 15 and the external connection terminal 16, a transparent thin film conductor that transmits the laser beam is formed using a vapor deposition method, a vapor phase synthesis method, etc., such as indium oxide with tin added or tin oxide with antimony added. Thin 11 formed with! Connect with Hataan 17. The thin film pattern 17 may be formed into a required pattern shape, or the entire surface of the insulating substrate 14 may be colored in advance and formed into a required pattern shape by an etching method or the like. Further, the connection is more reliable if the contact pin 75 and the i-film pattern 17 are adhered with a conductive paint or the like (not shown). Resistance value for laser trimming according to the present invention as described above...1] In the structure of the constant probe, the transparent f
For example, when indium oxide is used as the material for the thin film pattern Z7 made of an Ig-film conductor, indium oxide conductors have high resistance, but by adding an appropriate amount of tin, the resistance becomes low and at the same time the laser beam transmission characteristics are also improved. Change. For example, when using a YAG laser oscillator, it is preferable to add about 5% tin to indium oxide.
As the film resistance decreases, it becomes most transparent to YA ( ) laser light with a wavelength of 1.06 μm.

スズの添加による酸化インジウムの抵抗の低下は、一般
的には、インジウムの酸化物構造のところどころにスズ
が不純物として入り込みスズイオンとなり、電子供掬体
として電導に寄与するためである。なお、透明1(J膜
2゛f体はj皮厚を増せば面抵抗がさらに低下すること
は当然である。
Generally, the resistance of indium oxide decreases due to the addition of tin because tin enters the indium oxide structure as an impurity here and there and becomes tin ions, which contribute to electrical conduction as electron scoops. In addition, it is natural that the sheet resistance of the transparent 1 (J film 2) body will further decrease as the skin thickness increases.

次に、一本発明の具体的な一実カ:651Jを説明する
Next, a specific implementation of the present invention: 651J will be explained.

flJえば、3 mm厚のガラス板(透明絶縁基板)に
スズ5重量係入りの酸化インジウム全全面に約3000
に蒸着し、このガラス板に超音波加工機により所定の位
置に穴をあけ、紫外線硬化型のレジストでパターンを描
き硬化させた後、塩酸でエツチングし、レジストを洗い
落してから所定の位置にあけた穴に金メッキを施したベ
リリュウム銅製のコンタクトビンを立て導電性接着材で
固定し、室温乾燥型の銀ペーストで薄膜パターンとの電
気的導通を行なった。
For example, approximately 3,000 ml of indium oxide with 5 weight tin of tin is applied to the entire surface of a 3 mm thick glass plate (transparent insulating substrate).
This glass plate is then vapor-deposited, holes are drilled at predetermined positions on this glass plate using an ultrasonic processing machine, a pattern is drawn with ultraviolet curing resist, and after it is cured, it is etched with hydrochloric acid, the resist is washed off, and then it is placed in the predetermined position. A contact bottle made of gold-plated beryllium copper was placed in the hole, fixed with conductive adhesive, and electrically connected to the thin film pattern using silver paste that dried at room temperature.

上記のような構造をもつ抵抗値測定グローブを用いると
、レーザ光線18の光路上に透明薄膜導体17が存在し
ても、レーザ光線18を透過する為、下の抵抗体12を
トリミングできムつまり、レーザ光18が透過できない
部分は導体ビン15が立っている部分だけであり、レー
ザ光線18の光路の障害となる部分が極めて少いことに
なる。
If a resistance value measuring glove with the above structure is used, even if the transparent thin film conductor 17 is present on the optical path of the laser beam 18, the lower resistor 12 can be trimmed because the laser beam 18 will pass through. The only part through which the laser beam 18 cannot pass is the part where the conductor bottle 15 stands, and there are very few parts that will obstruct the optical path of the laser beam 18.

〔発明の効果〕〔Effect of the invention〕

以上述べたように本発明によれは、レーザ光線の光路の
障害となる部分が極めて少なく、従って抵抗体が高密度
に実装された基板における抵抗体のレーザトリミングの
際、一度に数多くの抵抗値測定が可能になり、−回のプ
ローブの設置でレーザトリミングできる抵抗体の数が著
しく増加する。すなわち、非常に高密度に抵抗体が実装
された基板でもプローブの設置回航を犬11]に減らす
ことができ、トリミング時間の短縮が可能となる。
As described above, according to the present invention, the number of parts that obstruct the optical path of the laser beam is extremely small, and therefore, when laser trimming a resistor on a board on which resistors are densely mounted, many resistance values can be processed at once. The number of resistors that can be laser trimmed with -1 probe installations is significantly increased. That is, even on a board on which resistors are mounted at a very high density, the number of probe installation turns can be reduced to 11 times, and the trimming time can be shortened.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のレーザトリミング用抵抗値測定グローブ
の使用列を示す斜視図、第2図は本発明の一実施しリ’
fc示す斜視図である。 II・・・抵抗体、12・・・電極部、13・・・膜抵
抗基板、14・・・透明絶縁基板、I5・・・コンタク
トビン、16・・・外部接続端子、17・・・薄膜パタ
ーン、18・・・レーザ光線。 出願人代理人 弁理士 鈴 江 武 彦第1図 38 第2図
FIG. 1 is a perspective view showing a row of conventional resistance value measuring gloves for laser trimming, and FIG.
It is a perspective view showing fc. II...Resistor, 12...Electrode portion, 13...Membrane resistance substrate, 14...Transparent insulating substrate, I5...Contact bottle, 16...External connection terminal, 17...Thin film Pattern, 18...Laser beam. Applicant's agent Patent attorney Takehiko Suzue Figure 1 38 Figure 2

Claims (2)

【特許請求の範囲】[Claims] (1)抵抗体をレーザトリミングする際、抵抗体の抵抗
値を測定するレーザトリミング用抵抗値測定グローブに
おいて、レーザ光線を透過する透明絶縁基板に、抵抗体
の電極部と電気的導通をするだめのコンタクトピンを立
て、前記透明基板上で前記コンタクトピンと外部接続端
子間はレーザ光線を透過する透明薄膜導体により配線が
行なわれた構造を有することを特徴とするレーザトリミ
ング用抵抗値測定プローブ。
(1) When laser trimming a resistor, in the laser trimming resistance measuring glove that measures the resistance value of the resistor, the transparent insulating substrate that transmits the laser beam must be electrically connected to the electrode part of the resistor. A resistance value measuring probe for laser trimming, characterized in that the probe has a structure in which contact pins are erected, and wiring is formed between the contact pins and external connection terminals on the transparent substrate using a transparent thin film conductor that transmits laser beams.
(2)透明薄膜導体として、スズ約5重量係添加の酸化
インジクムを用いたことを特徴とする特許請求の範囲第
1項記載のレーザトリミング用抵抗値測定プローブ。
(2) The resistance value measuring probe for laser trimming according to claim 1, characterized in that indicium oxide doped with about 5% tin by weight is used as the transparent thin film conductor.
JP58149054A 1983-08-15 1983-08-15 Resistance value measuring probe for laser trimming Pending JPS6040964A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58149054A JPS6040964A (en) 1983-08-15 1983-08-15 Resistance value measuring probe for laser trimming

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58149054A JPS6040964A (en) 1983-08-15 1983-08-15 Resistance value measuring probe for laser trimming

Publications (1)

Publication Number Publication Date
JPS6040964A true JPS6040964A (en) 1985-03-04

Family

ID=15466648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58149054A Pending JPS6040964A (en) 1983-08-15 1983-08-15 Resistance value measuring probe for laser trimming

Country Status (1)

Country Link
JP (1) JPS6040964A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110716089A (en) * 2019-11-27 2020-01-21 合肥学院 Method and device for quickly and accurately measuring resistance of conductive adhesive for bonding bare chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110716089A (en) * 2019-11-27 2020-01-21 合肥学院 Method and device for quickly and accurately measuring resistance of conductive adhesive for bonding bare chip
CN110716089B (en) * 2019-11-27 2021-08-20 合肥学院 Method and device for quickly and accurately measuring resistance of conductive adhesive for bonding bare chip

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