JPS6040100U - magnetic bubble memory device - Google Patents

magnetic bubble memory device

Info

Publication number
JPS6040100U
JPS6040100U JP12942583U JP12942583U JPS6040100U JP S6040100 U JPS6040100 U JP S6040100U JP 12942583 U JP12942583 U JP 12942583U JP 12942583 U JP12942583 U JP 12942583U JP S6040100 U JPS6040100 U JP S6040100U
Authority
JP
Japan
Prior art keywords
bubble memory
memory device
magnetic bubble
chip
resin plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12942583U
Other languages
Japanese (ja)
Inventor
助田　俊明
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP12942583U priority Critical patent/JPS6040100U/en
Publication of JPS6040100U publication Critical patent/JPS6040100U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のメモリチップの基板装着例を示す断面図
、第２図は本考案のメモリチップ装着実施例を示す断面
図、及び第３図は第２固装着基板の全体斜視図である。 図中、１はバブルメモリチップ、２はチップ装着の担体
基板、３は接続のボンディングワイヤ、４と７はチップ
１のグイ接着部、５は回転磁界成生用Ｘコイル、６はグ
イ接着用樹脂板、８は基板央部の窓、９はコイル５の挿
入溝、１２は回転磁界成生用Ｙコイルの挿入方向である
。FIG. 1 is a sectional view showing a conventional example of mounting a memory chip on a board, FIG. 2 is a sectional view showing an example of mounting a memory chip of the present invention, and FIG. 3 is an overall perspective view of a second fixed mounting board. . In the figure, 1 is a bubble memory chip, 2 is a carrier substrate on which the chip is attached, 3 is a bonding wire for connection, 4 and 7 are the adhesive parts of the chip 1, 5 is an X coil for generating a rotating magnetic field, and 6 is for adhesive adhesives. In the resin plate, 8 is a window in the center of the board, 9 is an insertion groove for the coil 5, and 12 is the direction in which the Y coil for generating a rotating magnetic field is inserted.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）回転磁界生成のコイル挿入部を有するバブルメモ
リチップ装着の配線パターンを具えるチップ担体基板の
構成に於いて、メモリチップのグイ接着部が少なくとも
、樹脂板で構成されてなることを特徴とする磁気バブル
メモリデバイス。(1) In the configuration of a chip carrier substrate having a wiring pattern for attaching a bubble memory chip having a coil insertion part for generating a rotating magnetic field, the memory chip's adhesive part is at least made of a resin plate. magnetic bubble memory device. （２）前記配線パターン形成部はセラミック基板よりな
り、グイ接着部が樹脂板からなる複合の担体基板となっ
ている前記実用新案登録請求の範囲第１項記載の磁気バ
ブルメモリデバイス。(2) The magnetic bubble memory device according to claim 1, wherein the wiring pattern forming portion is made of a ceramic substrate, and the goo bonding portion is a composite carrier substrate made of a resin plate.
JP12942583U 1983-08-22 1983-08-22 magnetic bubble memory device Pending JPS6040100U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12942583U JPS6040100U (en) 1983-08-22 1983-08-22 magnetic bubble memory device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12942583U JPS6040100U (en) 1983-08-22 1983-08-22 magnetic bubble memory device

Publications (1)

Publication Number Publication Date
JPS6040100U true JPS6040100U (en) 1985-03-20

Family

ID=30293258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12942583U Pending JPS6040100U (en) 1983-08-22 1983-08-22 magnetic bubble memory device

Country Status (1)

Country Link
JP (1) JPS6040100U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61132598U (en) * 1985-02-05 1986-08-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61132598U (en) * 1985-02-05 1986-08-19

Similar Documents

Publication Publication Date Title
JPS6040100U (en) magnetic bubble memory device
JPS6025159U (en) lead frame
JPS6117751U (en) Tape carrier semiconductor device
JPS617874U (en) terminal
JPS6049662U (en) Chip component mounting structure
JPS59185794U (en) magnetic bubble memory device
JPS5820559U (en) Electronic components for mounting
JPS6083242U (en) electronic circuit element
JPS5942097U (en) Heat sink mounting structure
JPS59107139U (en) IC chip mounting structure on circuit board
JPS59182926U (en) electronic components
JPS5897848U (en) Outer lead bonding structure
JPS6066003U (en) composite parts
JPS5952662U (en) printed wiring board
JPS59173014U (en) Optical component mounting device
JPS60149172U (en) flexible circuit board
JPS6020096U (en) Bubble memory chip mounted board
JPS58133958U (en) Electronic component support device
JPS5852699U (en) Substrate for magnetic bubble memory module
JPS59123369U (en) Multi-board mounting equipment
JPS606241U (en) Hybrid integrated circuit device
JPS6076040U (en) semiconductor equipment
JPS5829868U (en) integrated circuit mounting structure
JPS6054355U (en) Electrical component mounting equipment
JPS58142944U (en) semiconductor parts