JPS6033359A - Composition for forming copper film - Google Patents

Abstract

PURPOSE:To provide the titled composition with good efficiency which is prevented from flowing due to heating, forms a copper film only to a desired part and enabled in the easy removal of residue after heating by washing, obtained by containing a Ca- or Mg-compound, copper halide and an org. vehicle as effective components. CONSTITUTION:A copper film forming composition contains Ca- or Mg-halide, an inorg. acid or an org. acid, at least one of a calcium compound and a magnesium compound, a copper halide such as cupprous chloride, cuppric chloride or ammonium cuppric chloride and an org. vehicle such as vaseline and laminated to the surface of aluminum or an aluminum alloy and heated to about 350- 500 deg.C to form a copper film. In the above mentioned composition, it is pref. to bring the amount of at least one of the calcium compound and the magnesium compound to 0.5-20wt%, and to adjust the ratio of copper halide to 99.5-80% while it is proper to use the org. vehicle in an amount of about 0.2-2pts.wt. to one pt.wt. of the composition.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composition used to form a copper coating on the surface of aluminum or its alloys.

There are various methods for forming a copper film on the surface of aluminum or aluminum alloys. One method is to apply adhesive hydrocarbon such as vaseline or liquid paraffin to the aluminum surface, and then coat the aluminum surface with copper halide. A method is known in which a powder is applied and heated to form a copper coating on the aluminum surface.

However, in this method, heating reduces the viscosity of the sticky hydrocarbon and causes it to flow, and at this time, the copper halide also flows together. For this reason, the copper halide flows to areas other than the desired locations, and a copper film is also formed in undesired locations. In addition, in this method, a completely uniform coating of C copper is formed by heating the copper halide above its melting point, and after the heat treatment, the remaining 7jf is removed by washing with water, but the residue cannot be easily removed by washing with water alone. , it is necessary to perform brushing and ultrasonic cleaning. For this reason, currently aluminum or aluminum alloys are heated to a high temperature and then poured into water to be rapidly cooled to remove the residue.However, rapid cooling leaves distortions in the aluminum material, and in severe cases, the molded product becomes deformed. There are cases where

The purpose of the present invention is to solve the problems of the conventional methods, and the purpose of the present invention is to apply at least one kind of μsium compound and magnesium compound to the surface of aluminum or aluminum alloy. This is achieved by applying a composition comprising copper halide and organic vehicle (V) as active ingredients and heating to form a copper coating.

A major feature of the present invention is that at least one of a calcium compound and a magnesium compound is used in combination with copper halide. By using this combination, it is possible to effectively prevent the flow of copper dihalide, and as a result, it is possible to form a copper coating only at desired locations. Further, it is possible to form a uniform copper coating even at a temperature below the melting point of copper halide, and when removing the residue after heating, the residue can be easily removed by simply washing with water.

As the copper halide used in the present invention, those that have been conventionally used in this field and have a "C" name can be widely used, and representative examples thereof include cuprous chloride, cupric chloride, cupric ammonium chloride, etc. .

In addition, the magnesium compounds and calcium compounds used in the present invention include inorganic compounds and plate compounds, and the former include halides of magnesium and calcium, such as fluorides, chlorides, oxides,
Examples include sulfates, nitrates, phosphates, silicates, carbonates, and the latter and organic carboxylates such as L'-(I!I): e salts, propionates, and stearates. I can do it. Among these compounds, halides, sulfates,
Phosphates and silicates are particularly preferred.

As the organic vehicle, those which have been conventionally used in this field can be used in a wide range of applications, and not only those which are liquid at room temperature but also those which are solid such as waxes are also applicable. For example, hydrocarbons such as vaseline, rough-in, etc., alcohols such as methanol, ethanol, glopanol, butanol, nutaryl alcohol μ, polyhydric alcohols such as ethylene glycol and chrycerin, methyl isobutyl ketone, acetylacetone, etc. Ketones, ethers such as ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, esters such as ethyl acetate, butyl acetate, butyl acetate, benzene, toluene,
Aromatic hydrocarbons such as fenugreek, terpene oils such as pine oil and terpineol, and mixtures thereof, or solvents thereof, and celluloses such as ethyl cellulose, hydroxyl cellulose, acetyl cellulose, etc.
]L Examples include those in which acrylic resins such as methyl methacrylate and butyl methacrylate, vinyl resins such as vinyl acetate and vinyl butifur, and copolymers thereof are dissolved.

The usage ratio is 0.5 to 20% by weight for the former and 99.5 to 8% for the latter.
If the former is less than 0.5% by weight, the effect of the present invention will not be fully exhibited, and if it exceeds 20% by weight, the formation of the copper coating will be uneven. This tends to be undesirable.

The proportion of the organic vehicle to be used is 0.2 to 2 parts per 1 part of the mixture. It's about the same level as Tobe.

When forming a copper film on aluminum or its alloy using the composition of the present invention, the composition of the present invention is laminated on the surface of aluminum or its alloy, and heated to usually 350 to 50
All you have to do is heat it to about 0.008C and wash it with water.

The present invention will be described in detail below with reference to Examples.

EXAMPLE A mixture of a predetermined amount of cuprous chloride shown in Table 1 and a psium compound or a magnesium compound at a predetermined strength was added to an organic vehicle/I/(Turbineo/l/96% by weight).
, 5% by weight of ethyl cellulose and 1% by weight of butyl methacrylate) and the mixture: organic vehicle t&=2. : l
(Mfik ratio) to produce a paste-like composition, and this is applied to an aluminum plate (JIS A 108
0; 50X50X0.4111m) on 0.3 i/
It was applied at a rate of 100m2. This was dried at a temperature of 10,000° C., then heat-treated at 400° C. for 15 minutes in an electric furnace, and washed with water to obtain a C copper coating.

Table 1 (that's all)

Claims (1)

[Scope of Claims] (1) A composition for forming a copper coating comprising at least one of a calcium compound and a magnesium compound, a copper halide, and an organic vehicle as active ingredients. (2) The composition according to claim 1, wherein the proportions of at least one of a calcium compound and a magnesium compound and copper halide are 0.5 to 20% by weight for the former and 99.5 to 80% by weight for the latter. thing.