JPS6031593B2 - soldering equipment - Google Patents

Description

[Detailed description of the invention] The present invention relates to a soldering device.

Conventional soldering equipment has a pair of vertically movable rails above a fixed solder tank, which move up and down while supporting a holder, and move the board to be soldered held by the holder against the fixed solder tank. A conveyance pin is provided upwardly protruding from a conveyance drive chain that is provided parallel to the outside of the vertical movement rail and is forcibly driven at a constant level, and a part of the holder is moved up and down on this conveyance pin. The holder is movably aligned and is thereby forcibly conveyed above the fixed solder bath along with the vertically movable rail, but the vertically movable rail and the conveyance drive chain at a certain level are separated. If the holder is forcibly conveyed using a conveyor pin installed on the body, it is difficult to align the conveyor pin and the holder, and the holder alone cannot be stopped or moved independently of the conveyor chain. . For this reason, it is conceivable to place the holder on a pair of endless belts and transport them directly, but in that case, it is necessary to drive the pair of endless belts that move up and down in synchronization with the up and down movement. Previously, such a difficult task had not been attempted. The present invention has been made in view of these points, and is intended to enable a holder to be directly conveyed in synchronization with the vertical movement by a pair of endless bands that move up and down.

Next, one embodiment of the present invention will be described based on the drawings.

The solder bath 1 is fixedly installed on the stereotaxic layer by a support frame (not shown), and a pair of supports 2 and 3 for supporting holder transportation are installed above both sides of the solder bath 1 via front and rear supports 2 and 3, which are separate from the solder bath 1. An endless chain 4 as an endless belt is provided.

Both ends of this endless chain 4 are supported by sprocket wheels 6 and 7 which are pivotally supported on the supports 2 and 3, and the middle part of this end chain 4 is supported by a support rail provided between the supports 2 and 3. Supported by 8. Further, the supports 2 and 3 are guided and supported so as to be vertically movable by a guide 9 provided on a support frame (not shown). Also, front and rear cams 12 are provided below the supports 2 and 3 via cam followers 11 provided on the supports 2 and 3, and the front and rear cams 12 cause the supports 2,
3, the endless bands 4 on both sides are moved up and down.

The rotating shafts 13 of the front and rear cams 12 are connected to the motor 17 of the stereotactic layer via a gear mechanism 14, a rotating shaft 15, and a gear mechanism 16.
It is provided so that it can be rotated by. Further, a synchronous drive mechanism 22 is interposed between the motor 17 and a drive shaft 21 serving as a rotating drive section for the pair of shapeless chains 4.

This synchronous drive mechanism 22 extracts rotational force from the rotating shaft 15 driven by the motor 7 to the rotating shaft 26 of the stereotaxic layer via a chain 23, a rotating shaft 24, and a chain 25, and also outputs rotational force from the rotating shaft 26 of the stereotactic layer. A gearbox 32 is fixed to the gearbox 32 via a mounting plate 31, and a telescoping shaft 34 and universal joints 35, 3 at both ends of the telescoping shaft 34 are installed between the input shaft 33 to the gearbox 32 and the rotating shaft 26.
6 is provided. The telescoping shaft 34 expands and contracts only in all directions by splinting one shaft 37 and the other shaft 38 in all directions, thereby making them integral in the direction of rotation. Then, by driving the motor 17, the front and rear cams 12 move the supports 2 and 3 up and down, and the endless chains 4 on both sides
At the same time, the rotating shaft 2 is moved up and down using the chain 25, etc.
6, take out the rotation, universal joint 36, telescopic shaft 34, universal joint 35, gear box 32
, chain 41, drive shaft 21 and drive chains 42 on both sides
The endless chains 4 for conveying holders on both sides are synchronously driven through the holder.

As a result, the holder 4 transferred from the carry-in compare chain 43 on the left side of the figure onto the pair of endless chains 4 is lowered above the solder bath 1 and forcibly transferred, and the soldering target board gripped by this holder 14 45 is lowered and forcibly transferred, and after the lower surface of the board 45 to be soldered is immersed in the melted solder in the solder bath 1, the holder 1 is removed.
4 is lifted up, and this holder 14 is transferred onto the carry-out conveyor chain 46 on the right side in the figure and carried out. At this time, the gearbox 32 moves up and down together with the support 2 on the endless chain 4, and the angles between the rotating shaft 26, the input shaft 33, and the telescopic shaft 34 change, and the distance between the ends of the shafts 26, 33 changes. changes, but universal joints 35, 36
Since the rotational axis angle of the rotary shaft 34 freely changes and the telescopic ratchet 34 freely expands and contracts, the synchronous rotational force is transmitted from the rotational shaft 26 of the stereotactic layer to the input shaft 33 that moves up and down together with the gear box 32 without any hindrance.

Note that the endless chains 4 on both sides may move up and down simultaneously at both the left and right ends in the figure, or the right end in the figure may be lowered first, and then the left end in the figure may be lowered to move both left and right ends. It may be arranged to descend horizontally, then rise at the right end in the figure, then rise at the left end in the figure, and then rise horizontally at both left and right ends.

Such movement is determined by the relative shape relationship of both cams 12. As described above, according to the present invention, in a soldering device, the rotation shaft of another localization layer is rotated by a motor that rotates a cam that moves a pair of endless bands up and down via a support, and this localization layer A telescoping shaft capable of transmitting rotation and two universal joints provided at both ends of this telescoping shaft are interposed between the rotation shaft of the belt and the input shaft that is moved up and down together with the rotating drive section of the endless band. , a pair of inorganic bands are moved up and down by the outside of one motor through a cam, and the endless band that is moved up and down is moved up and down without any trouble by the above-mentioned telescopic shaft and universal joints at both ends. It can be rotated synchronously.

Therefore, the board to be soldered can be directly conveyed by a pair of endless bands that move up and down in synchronization with the up and down movement, providing a new conveying means that was previously thought to be impossible in soldering in which the board to be soldered is moved up and down. Now you can.

[Brief explanation of the drawing]

The figure is a perspective view showing an embodiment of the soldering device of the present invention. 1...Solder bath, 2, 3...Support, 4.
...Mendless chain as an endless belt, 12...
・Cam, 17. ．．・．． ... Motor, 21 ... Drive shaft as rotation drive unit, 26 ... Rotation shaft at fixed position, 33 ... Input shaft, 34 ... Telescopic shaft ,
35, 36... Universal joint, 44
...Holder, 45...Plate to be soldered.

Claims (1)

[Claims] 1. A solder tank fixedly installed in a fixed position, a pair of endless bands provided above both sides of the solder tank via vertically movable supports, and a support provided below the supports of the pair of endless bands. A cam that moves the pair of endless bands up and down through the body, a motor that rotates the cam, a rotating shaft at a fixed position that is rotated by the motor, and a rotating drive unit of the pair of endless bands that move the cam up and down. It is provided with a telescopic shaft that is interposed between the moving input shaft, expands and contracts only in the axial direction, and is integral in the rotational direction, and two universal joints provided at both ends of the telescopic shaft, and is located above the solder bath. A soldering device characterized in that the board to be soldered, which is transported by the pair of endless bands, is moved up and down by a cam that is driven in synchronization with the transport speed.