JPS6031519A - Epoxy resin composition - Google Patents

Abstract

PURPOSE:An epoxy resin composition excellent in moisture resistance, rust prevention, adhesion, etc., and suitable for sealing semiconductor devices, obtained by mixing an epoxy resin with a curing agent and lanolin (derivative). CONSTITUTION:The purpose epoxy resin composition is obtained by mixing (A) an epoxy resin selected from the group consisting of glycidyl ether epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, etc., with (B) a curing agent (e.g., phthalic anhydride or m-phenylenediamine), and (C) 0.1-10pts.wt., per 100pts.wt. component A, lanolin and/or its derivative (e.g., calcium lanolate or magnesium lanolate). When this resin composition is used as a sealant or the like, component C intervenes between the resin composition and an adherend to exhibit an effect of preventing penetration of external moisture, ionic impurities, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an epoxy resin composition used as a sealing resin for semiconductor devices and other electronic accessories.

Generally, epoxy resins are made of amines or acid anhydrides.

When cured using a curing agent such as Tsuunol resin, a product with excellent electrical, mechanical, and thermal repellency properties is produced, making it possible to protect semiconductor devices and other electronic circuit components from the external atmosphere and mechanical shock. It is used as a sealing resin for greeting cards. Furthermore, resin sealing using epoxy resin has many advantages in terms of productivity and economy compared to sealing using ceramic or metal (and is often used).

By the way, due to the recent increase in the density of semiconductor devices and changes in the usage environment due to the diversification of the uses of sub-circuit components, epoxy resin compositions are becoming less reliable in maintaining the functionality of electrical components under high temperature and high humidity conditions. I do it as requested. However, conventional compositions have the following fundamental problems, making it difficult to satisfy the required electrical properties at high temperatures and high humidity.

In other words, the low moisture resistance and low 11it corrosion resistance of resin sealing with conventional epoxy resin compositions are due to the direct contact between the resin and electrical components and the fact that the resin seal is not airtight. Therefore, it was extremely difficult to improve it. Epoxy resin absorbs or permeates moisture due to the polar groups remaining in the cured product. Furthermore, epoxy resin contains ionic impurities such as chlorine derived from epichlorohydrin used as a raw material during synthesis or sodium derived from sodium hydroxide used for desalination. A large amount of the ionic impurity is mixed into the raw material. However.

The interaction between the absorbed or permeated moisture and ionic impurities causes a decrease in the insulation properties of resin-sealed WL electrical parts, an increase in leakage current, and other functional deterioration, and furthermore, This corrodes the aluminum wiring and electrodes that are connected to the wire, eventually leading to wire breakage.

In addition, at high temperatures, ionic impurities and other polar substances contained in the resin become more mobile due to activation of thermal motion, and when an electric field is generated in a component such as an element, this occurs at the interface between the resin and the component such as an element. Ionic impurities are further activated, locally reducing electrical properties, and corrosion rapidly progresses in the presence of moisture.

Adversely affect.

Therefore, in order to deal with these problems, it has recently been proposed to reduce the ionic impurities in the epoxy resin and to improve the adhesiveness with the fi electrical component resin to block the infiltration of moisture. There is.

However, it is still difficult to completely remove ionic impurities from the resin, and furthermore, problems with preformability during resin sealing arise due to improved adhesion between electrical parts and the resin.

In view of the above-mentioned shortcomings, the inventors of the present invention have conducted intensive studies and found that the epoxy resin composition contains a component that forms an anti-rust film that prevents the infiltration of moisture and ionic impurities. During or after resin sealing, components that form a rust-preventive film are exuded.

The idea was to form a countermeasure on the surface of electrical parts.

The purpose of the present invention is to provide an epoxy resin composition with excellent moisture resistance and rust prevention properties.

That is, 1 the epoxy resin composition of the present invention has epoxy Vt
It is characterized by consisting of a fat, a curing agent, and one or both of a ynoline or a fluorine derivative.

According to the present invention, it is possible to provide an epoxy resin composition having excellent moisture resistance, anti-fading properties, and adhesive properties.

In the present invention, such an effect can be obtained when the Lahan or Lahan derivative/conductor mixed with an epoxy resin and a nitrogen-containing compound are used as the epoxy resin composition as a resin sealant.
It is thought that this is because it is present between the composition and the object to be treated and exhibits the effect of preventing external moisture and ionic impurities from penetrating into the surface of the object to be coated. As described above, the resin composition of the present invention prevents moisture and ionic impurities from entering the interface with the object to be coated, so it has excellent moisture resistance, rust prevention, and adhesiveness.

Furthermore, since the epoxy resin composition of the present invention has the above-mentioned effects, it can be used in addition to resins for sealing electrical parts.

It can also be used in paints, adhesives, etc.

Next, when the resin composition of the present invention is used as an encapsulant for electrical components, ') Norin or its derivatives are prevented at the interface between the surface of the electrical components and the epoxy resin during or after the resin encapsulation. It is thought that a rust film is formed.

As a result, moisture from the outside and ionic impurities in the epoxy resin are blocked from entering the electronic component surface, and W! , it is possible to prevent functional deterioration such as deterioration of insulation properties of gas components or increase of leakage current.
This can extend the life of parts.

Furthermore, since the epoxy resin composition contains a glue or fluorine derivative as a rust-preventive film-forming component as described above, the step of applying a rust-preventive film to the surface of the gas component is completely unnecessary.

Epoxy resins that can be used in the present invention are commonly known ones and are not particularly limited. For example, glycidyl ether type 2L? Examples include epoxy resin, phenol borac type epoxy resin, Talesol novofook type epoxy resin, alicyclic epoxy resin, glycidyl ester thread epoxy resin, filamentous aliphatic epoxy resin, halogenated epoxy resin and the like.

However, these epoxy resins may be used in a mixture of [+ or 211° or more. Among the above epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, and cresol novolac epoxy resins are the most popular in terms of electrical properties and heat resistance. Xyl resin is preferred and provides the best properties. These epoxy resins undergo a curing reaction and are solidified by the curing agent shown below.

Next, as curing agents, phthalic anhydride, succinic anhydride,
Acid anhydrides such as methylnadic anhydride, aromatic amines such as metaphenylene diamine, diamyl diphenyl sulfone, aromatic amine γ-duct, aliphatic or alicyclic amines such as polymethylene diamine and menthanediamine, phenolic resins, cresols Examples include initial composites of synthetic resins such as resins, but are not particularly limited. However, among the above curing agents, pheno-J
Initial composites of synthetic resins such as V resins and Vsol resins are preferred.

In the present invention, the compounding ratio of the epoxy resin and the curing agent is such that the chemical equivalent ratio between the number of functional groups in the curing agent and the number of epoxy groups in the epoxy resin is within the range of 0.5 to L5. It is preferable to blend them in terms of curing properties such as storage stability, curing speed, and thermal and mechanical properties after curing. Furthermore, excellent curing properties can be obtained when the chemical equivalent ratio is within the range of 0.8-12.

Furthermore, in the present invention, when the above curing agent is used, a curing accelerator may be used to accelerate the curing speed.

The curing accelerator is not particularly limited, but examples thereof include imidaglu, 2-methylimidazo-μ, and 2-phenylimidazo/L'.

2. Imidazoles such as 4-dimethylimida l-p, triethylamine, diethylaminoprobylamine, N-
Examples include amines such as aminoethyl bipefudine, and complex compounds of triethylamine and 11F3. Also,
These curing accelerators may be used in a mixture of 1 ffl or 28 or more. However, the blending ratio of the curing accelerator is generally 0.05 to 100 parts by weight of the epoxy resin.
It may be within the range of 5 parts by weight.

The fluorine and fluorine derivatives according to the present invention do not react with the epoxy resin and the curing agent, and ooze out from the resin to the outside during or after sealing the electrical component with the epoxy resin.

This lanolin or lanolin derivative component reaches the surface of the sealed electrical and electrical parts and prevents fi'! 3 The anti-f # film that forms the J film has # excellent moisture properties, prevents the infiltration of ionic impurities, and... I! Air parts can be protected.

The lanolin is a mixture of wool fat, fatty acids and monohydric higher alcohols9, and its type is not particularly limited, but it is preferably deodorized in order to form a rust-preventing film that does not contain impurities.・It is best to use purified products such as dehydration and decolorization. Also, applicable? /Qn, rA conductors include thunolin fatty acid obtained by removing alcohol from lanolin, barium lanolinate, magnesium lanolinate, zinc lanolinate, +51 aluminum nolinate, calcium lanophosphate, sodium lanophosphate, etc. Norrin fatty acid metal salts, etc. In the present invention, one or both of cutulin and rhinoline derivatives are used.

The blending amount of the above lanolin or lanolin derivative is as follows:
It is desirable to use 01 to 10 parts by weight per 100 parts by weight of the epoxy resin. When the amount is less than 0.1, the moisture and rust prevention effect of the present invention is exhibited; on the other hand, 1
If it exceeds the 0-fold claw part.

There is little improvement in the effect due to the addition of lβ, and there is a risk that the composition will become more concentrated.

The present invention may be composed of only one or both of the above components (all Devon resin, (b) curing agent, (C) tunoline or rhinoline derivative, but by further adding and blending an inorganic filler. It is possible to obtain an epoxy resin composition with improved one-dimensional stability, one-dimensional stability, thermal properties, etc.

Examples of inorganic fillers include diil/fair, alumina, talc, clay, magnesia, fused silica, etc. Examples include crystalline silica, calcium silicate, calcium chloride, barium sulfate, gas fiber, milled fiber, etc.
Among these is fused silica.

Crystal V11 strength is most preferred.

In addition, the epoxy resin composition according to the present invention may optionally be molded with 1 natural waxes, 1 synthetic waxes, gold R salts of linear fatty acids, acid amides, varnishes, or mixtures thereof. Chlorinated paraffin, brominated bisphenol A type epoxy resin, brominated phenol novolac type epoxy resin.

Flame retardants such as bromotoluene, hexabromobenzene, antimony trioxide, V ranka, and bling agents.

A surface treatment agent such as a titanium coupling agent, a coloring agent such as a car pump hook, etc. may be appropriately added and blended.

A general method for preparing the epoxy resin composition according to the present invention as a molding material is to thoroughly mix the above raw material components using a mixer such as a Henschel mixer, and then use a mixer such as a hot roll machine or a kneader. A molding material of an epoxy resin composition can be easily obtained by melting, mixing, cooling and pulverizing.

Next, the present invention will be explained in detail.

Examples Orthocresol Novofook epoxy resin alone or together with bisphenol A type epoxy resin as epoxy resin, purified lanolin as 'F/phosphorus or glue/calcium II phosphate as lanophosphate metal salt were mixed in the proportions shown in Table 1, and 5% of Phenol Novobook as an Ic@+8 converting agent was added.
0 parts, 1v31Wi parts of 2-phenolimidaglu as curing accelerator.

1 part by weight of fused silica SBO as an inorganic filler, 12 parts by weight of epoxy sif as a surface treatment agent, and 72 parts by weight of Karuna Power as a mold release agent were added.

Mixed. Next, this material was melt-kneaded in a low/L' machine at a temperature of 80 to 90° C. for 5 minutes, immediately cooled to solidify, and pulverized. Thereafter, this pulverized product was molded into a tablet shape to prepare five types of epoxy resin compositions according to the present invention (Tests 1 to 6 in Table 1).

For comparison, as shown in Table 1, purified lanolin and calcium lanophosphate were included.

A comparative epoxy resin composition was prepared under the same ingredients and formulation r (9 conditions) as above (sample i6).

Above 61! For a model/I/element using an epoxy resin composition of type i and having aluminum wiring and grooves.

Sealing was performed using a transfer molding machine at 176° C. for 8 minutes, and the resin was further heated for curing at 1f15'c and BR to perform resin sealing. In order to test the performance of these sealed samples, these samples were heated at 121°C.
A pressure puller test was conducted in water vapor at 2 atm with a bias of 19V applied. Thereby, the average lifespan of each sample was measured and its moisture resistance was evaluated. The results are shown in Table 2. The average life here refers to the time it takes for aluminum wiring or electrodes to corrode and lose their air conductivity.

It is clear from Table 2 that the epoxy resin composition according to the present invention exhibits higher performance even under high temperature and high humidity compared to conventional comparative compositions.

The average lifespan has been significantly improved, and it can be seen that the resin composition of the present invention is extremely useful as a resin for sealing electrical parts.

wc1 table

Claims (2)

[Claims] (1) An epoxy resin composition comprising an epoxy resin, a curing agent, and one or both of lanolin and a lanolin derivative. (2) Epoxy resins include glycidyl ether-based epoxy resins, phenol nopowac-based epoxy V resins, creso μ novophuc-based epoxy resins, alicyclic epoxy resins,
The epoxy resin composition according to claim 11, which is at least one of glycidyl, ester μ-based epoxy resin, linear aliphatic epoxy resin, and non-rogenated epoxy resin. +31 The epoxy resin composition according to claim @(1), wherein the '5 nolin derivative is at least one p-nolin fatty acid pranolin fatty acid metal salt. +41 The lanolin fatty acid metal salt is barium lanolin acid, '?Magnesium linolinate, zinc linolinate, aluminum lanolinate, calcium lanophosphate.Claims that are sodium lanophosphate!fi1