JPS6030542U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6030542U
JPS6030542U JP12335983U JP12335983U JPS6030542U JP S6030542 U JPS6030542 U JP S6030542U JP 12335983 U JP12335983 U JP 12335983U JP 12335983 U JP12335983 U JP 12335983U JP S6030542 U JPS6030542 U JP S6030542U
Authority
JP
Japan
Prior art keywords
container
semiconductor equipment
projecting portion
top lid
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12335983U
Other languages
Japanese (ja)
Inventor
篤 丸山
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP12335983U priority Critical patent/JPS6030542U/en
Publication of JPS6030542U publication Critical patent/JPS6030542U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体装置の容器の断面図、第２図は金
型の断面図、第３図は本考案の一実施例の容器の断面図
である。 １・・・・・・容器側壁、３・・・・・・蓋、４・・・
・・・蓋突出部、５・・・・・・爪、９・・・・・・側
壁張り出し部、１０・・・・・・容器底板。FIG. 1 is a sectional view of a conventional container for a semiconductor device, FIG. 2 is a sectional view of a mold, and FIG. 3 is a sectional view of a container according to an embodiment of the present invention. 1... Container side wall, 3... Lid, 4...
...Lid protrusion, 5...Claw, 9...Side wall protrusion, 10...Container bottom plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を収容する容器を上蓋によって閉塞するもの
において、容器の上縁に容器の内方への、　　　　張り
出し部が設けられ、上蓋の下面に該張り出し部の端面お
よび下面に嵌合する爪を有する突出部が設けられたこと
を特徴とする半導体装置。A container that houses semiconductor devices is closed with a top lid, and the top edge of the container is provided with a projecting portion extending inward from the container, and the bottom surface of the top lid has claws that fit into the end and bottom surfaces of the projecting portion. A semiconductor device characterized by being provided with a protrusion.
JP12335983U 1983-08-09 1983-08-09 semiconductor equipment Pending JPS6030542U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12335983U JPS6030542U (en) 1983-08-09 1983-08-09 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12335983U JPS6030542U (en) 1983-08-09 1983-08-09 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6030542U true JPS6030542U (en) 1985-03-01

Family

ID=30281623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12335983U Pending JPS6030542U (en) 1983-08-09 1983-08-09 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6030542U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022249558A1 (en) * 2021-05-24 2022-12-01 日立Astemo株式会社 Vehicle control device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022249558A1 (en) * 2021-05-24 2022-12-01 日立Astemo株式会社 Vehicle control device

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