JPS60251623A - Liquid material discharging device for semiconductor device - Google Patents

Abstract

PURPOSE:To contrive enlargement of the coatable area of a semiconductor device by a method wherein a constitution, with which a liquid can be coated on a semiconductor device by moving a needle not only in vertical direction but also in back and forth and right and left directions, is provided. CONSTITUTION:When the semiconductor device 1 carrying a semiconductor element 2 is conveyed to the dripping position of a liquid, the head part 7 supporting a syringe 5 begins a downward movement by an interlocking operation in the degree set by a vertical stroke 8-1. Air pressure is applied in the tube 6 which is extended from a controlling part and connected to the syringe 5, and the liquid material located in the syringe 5 passes through a needle 4 and discharged. At the same time, the head part 7 is shifted in the range set by the strokes 8-2 and 8-3 in the direction in parallel with the surface of the semiconductor element 2 by the command sent from a controlling mechanism. Subsequently, after a fixed quantity of liquid material 3 has been discharged for a fixed period of time, the head part 7 moves up, the semiconductor device 1 is shifted to the next position, and a series of operation is finished.

Description

Detailed Description of the Invention (1) Technical Field of the Invention The present invention relates to a liquid material discharging device (hereinafter referred to as a dispenser) that forms a fixed amount, constant thickness, and uniform coating film in the process of dropping and applying a liquid material to a semiconductor device. It concerns the structure of (referred to as -).

(2) Prior Art Conventionally, a dispenser has a needle that dispenses a certain amount of liquid material at a certain time using air pressure, and dispenses a certain amount of liquid material at a certain time using air pressure. The needle is fed vertically in a direction perpendicular to the plane to be coated, and the liquid dripped from the needle forms a coating film on the coated surface of the semiconductor device.

However, it is very difficult to obtain a fixed amount, constant thickness, and uniform coating film simply by moving the needle up and down relative to the coating surface as described above, and it is difficult to obtain a uniform coating film with a fixed amount and thickness, and it is difficult to obtain a uniform coating film due to the viscosity of the liquid material itself, titanium properties, and semiconductor elements. Due to factors such as the degree of wetting (contact angle) and the size and shape of the semiconductor elements that form the coating film, it is not possible to completely control the desired coating film, which has the disadvantage of not increasing mass productivity. Ta.

(3) Purpose of the Invention An object of the present invention is to provide a dispenser capable of forming a fixed amount, constant thickness, and uniform coating film of a liquid material on a semiconductor device.

(4) Structure of the Invention The present invention provides a liquid material discharging device that discharges liquid from a needle and applies the liquid to a semiconductor device to form a coating film.
A liquid material discharging apparatus for a semiconductor device is characterized in that it includes a control mechanism that moves the needle in two directions perpendicular and parallel to the liquid application surface of the semiconductor device.

(5) Principle of the invention As a result of observing and investigating the coating film formation process through the use of dispensers according to the prior art, it was found that the liquid material discharged by the dispenser has a viscosity depending on the discharge speed, pressure, time, and vertical stroke speed. It was found that the coating spreads as a fluid over the plane to be applied, and as a result, the resulting coating film has only a limited area and thickness (shape).

Therefore, in order to obtain the desired coating film, in addition to moving the dispensing position, it is necessary to apply lateral force to the liquid material.
It is necessary to move the discharge portion of the dispenser relative to the application surface of the semiconductor device.

Therefore, in the process of applying a liquid material to a semiconductor device under the armpit, the present invention moves not only a part of the mechanism for discharging the liquid material in a direction perpendicular to the plane to be applied, but also in a direction parallel to it. is also made to work.

(6) Examples Hereinafter, embodiments of the present invention will be explained with reference to the drawings.

FIG. 2(α) shows a portion of a conventional dispenser. When the semiconductor device 1 with the semiconductor chip 2 mounted thereon is sent to the dropping position, the head part 7 supporting the syringe 5 begins to lower in a linked motion, and the head part 7 that supports the syringe 5 begins to fall into the tube 6 extending from the control part and connected to the syringe 5. Air pressure is applied and the liquid material 3 in the syringe 5 is expelled through the needle 4.

Next, after the liquid material 3 is discharged (dropped) in a predetermined amount and for a predetermined time, the head portion 7 is raised, the semiconductor device 1 is moved to the next position, and the series of operations is completed.

The vertical stroke 8 of the entire head section 7 is mainly caused by the liquid material 3
It is adjusted appropriately to improve the cutting quality and increase the dripping speed.

FIG. 2(b) is a top view showing the liquid material 9 applied onto the semiconductor element 2 as a result of the above. In this case, only the central portion of the required surface is coated.

Therefore, in FIG. 1 (→), the present invention
8-x and U lines perpendicular to the liquid application surface of the semiconductor device.
A control mechanism C is provided in conjunction with the head section 7 to move it in two directions -2 and 8-3.

In the present invention, a semiconductor device 1 on which a semiconductor element 2 is mounted
When the syringe 5 is delivered to the liquid dropping position, the head part 7 supporting the syringe 5 moves in a vertical stroke 8 in an interlocking motion.
The pressure starts to decrease within the range set by 1 to 1, air pressure builds up in the tube 6 extending from the control section and connected to the syringe 5, and the liquid material 3 in the syringe 5 is discharged through the needle 4. At the same time, the head section 7 moves in a direction parallel to the surface of the semiconductor element 2 within a range set by a stroke 8-2, 8-3 according to a command from the control mechanism C.

Thereafter, after the liquid material 3 is discharged (dropped) in a certain amount and for a certain period of time, the head section 7 is raised, the semiconductor device 1 is moved to the next position, and the series of operations is completed.

The stroke 8-1 of the entire head portion 7 in the direction perpendicular to the semiconductor element 2 cuts the liquid material 3 well.

Increase the dropping speed and stroke in parallel direction 8-2.8
-3 is liquid material 3 which spreads liquid material over a wide range at moderate speed.
It is performed while leaning on the body.

FIG. 1(b) uses a dispenser according to the invention,
FIG. 2 is a top view showing liquid material 9 applied on a semiconductor element 2. FIG. In this case, the coating is applied in a way that suits the surface to be coated, and the locus 1o projected onto the semiconductor element 2 of the needle 4 by the stroke 8-2.8-3 in the parallel direction may be rectangular as shown in the figure. .

(7) Effects of the Invention As explained above, in the present invention, the liquid is applied to the semiconductor device by moving the needle not only in the vertical direction but also in the front and back and left and right directions on the upper part of the plane to be applied.
The area that can be coated onto a semiconductor device can be expanded, and the range of the area is not affected by the inherent properties of the liquid material such as viscosity, thixotropy, contact angle, etc., unlike conventional techniques, and
This coating has the advantage of not being restricted by the size, shape, etc. of the semiconductor device to be coated.

[Brief explanation of drawings]

FIG. 1(α) is a side view of a portion of the dispenser according to the present invention, FIG. 1(b) is a top view showing a semiconductor device after coating in the dispenser according to the present invention, and FIG. 2(α) is a dispenser according to the prior art. Side view of part of the , Figure 2 (
b) is a top view of a conventional dispenser showing a semiconductor device after coating; DESCRIPTION OF SYMBOLS 1... Semiconductor device, 2... Semiconductor element, 3... Liquid material, 4... Needle, 5... Syringe, 6... Tube, 7 Head portion supporting syringe, 8-1...・
Stroke in the direction perpendicular to the semiconductor element, 8-2... Stroke in the direction parallel to the semiconductor element, 8-3... Stroke in the direction parallel to the semiconductor element, 9... Applied liquid material , IO Needle Trajectory Patent Applicant: NEC Corporation Figure 1 (α) (b) 2nd Group (α) (b)

Claims (1)

[Claims] (1) In a liquid material discharging device that discharges liquid from a needle and applies it to a semiconductor device to form a coating film, the needle is moved in two directions perpendicular and parallel to the liquid application surface of the semiconductor device. A liquid material discharging device for a semiconductor device, comprising a control mechanism.