JPS60250892A - Laser piercing device - Google Patents

Laser piercing device

Info

Publication number
JPS60250892A
JPS60250892A JP59107419A JP10741984A JPS60250892A JP S60250892 A JPS60250892 A JP S60250892A JP 59107419 A JP59107419 A JP 59107419A JP 10741984 A JP10741984 A JP 10741984A JP S60250892 A JPS60250892 A JP S60250892A
Authority
JP
Japan
Prior art keywords
laser beam
laser
hole
work
piercing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59107419A
Other languages
Japanese (ja)
Inventor
Akihiko No
明彦 能
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59107419A priority Critical patent/JPS60250892A/en
Publication of JPS60250892A publication Critical patent/JPS60250892A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece

Abstract

PURPOSE:To automate a piercing work, also to make it unnecessary to execute a through inspection, and to improve a working efficiency and a piercing accuracy by detecting a penetration of a hole by a laser piercing device without a man's help. CONSTITUTION:A laser beam 2 is irradiated from a laser beam device 1 to a work 4 held by a holding jig 5. As a result, a laser beam spot part of the work 4 is melted and evaporated, and a hole 12 is pierced gradually. In this case, an AE sensor 9 does not catch other abnormal mechanical vibration than a noise vibration. When the hole 12 passes through the work 4, the laser beam 2 irradiates a back plate 6. As a result, a micro-breakdown phenomenon and an elastic vibration are generated by a thermal influence on a photodetecting part of the back plate 6. Subsequently, the elastic vibration is caught by the AE sensor 9, tranceduced to an electric signal SA, amplified by an amplifier 10, and outputted to a comparator 11. Next, a set value VT and a voltage value V of the electric signal SA are compared by a comparator 11. In this case, the set value VT is set so as to be smaller than the voltage value V of the electric signal SA outputted from the AE sensor 9. Accordingly, from the comparator 11, a piercing signal SH is outputted to a control part 1a and a feed device 7, the laser beam 2 is stopped, and by the feed device 7, the work 4 is fed to the next piercing position.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、レーザ光によシ貫通孔を穿設するレーザ穿孔
装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a laser drilling device for drilling through holes using laser light.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

レーザ光は、平行性のよい筒パワーのビームを加工物表
面に微小スポットとして集束することができる。そして
、この微小スポット部分は、レーザ光を吸収して高温に
加熱され、瞬間的に蒸発または溶融する。それゆえ、従
来の方法でけ可能とされた高融点材料、耐熱合金類、セ
ラミックス。
The laser beam can be focused as a well-parallel, cylindrical power beam onto the surface of the workpiece as a minute spot. This minute spot portion absorbs the laser beam, is heated to a high temperature, and instantaneously evaporates or melts. Therefore, high-melting point materials, heat-resistant alloys, and ceramics that can be made using conventional methods.

ダイヤモンド等の硬脆材料の穿孔加工が可能となった。It has become possible to drill holes in hard and brittle materials such as diamond.

ことに、従来すこぶる困難とされていた微細な孔の加工
も容易に行うととができるようになった。
In particular, it has now become possible to easily process minute holes, which had previously been considered extremely difficult.

しかし、レーザ光により貫通孔を穿設する場合、穿孔加
工が終了したかどうかの確認は、目視によらねばならな
い。しかも、レーザ光(d危険であるため、穿孔加工中
は加工部位に検査員が接近することができない。そこで
、従来においては、穿孔加工終了の確認は、穿孔中いっ
たんレーザ光の照射を停止し、なおかつ場合によっては
被加工物を取シはずして孔が貫通しているかどうか目視
検査している。そのため、加工能率が著しく低下すると
ともに、加工精度も悪くなる傾向がある。
However, when drilling a through hole using a laser beam, it is necessary to visually confirm whether or not the drilling process has been completed. Furthermore, due to the danger of the laser beam (d), inspectors are not allowed to approach the machined area during the drilling process.Therefore, in the past, to confirm the completion of the drilling process, the laser beam irradiation was stopped once during the drilling process. In addition, in some cases, the workpiece is removed and visually inspected to see if the hole is penetrating.As a result, machining efficiency tends to drop significantly and machining accuracy also tends to deteriorate.

〔発明の目的〕[Purpose of the invention]

本発明は、上記事情を参酌してなされたもので。 The present invention has been made in consideration of the above circumstances.

レーザ光によシ高精度かつ高能率に被加工物の穿孔を行
うことができるレーザ穿孔装置を提供することを目的と
する。
It is an object of the present invention to provide a laser drilling device capable of drilling a workpiece with high accuracy and efficiency using laser light.

〔発明の概要〕[Summary of the invention]

被加工物にレーザ光を照射して穿孔を行うレーザ穿孔装
置において、被加工物にレーザ光により穿設された孔を
通過したレーザ光を受光する位置に配設された部材に装
着され、レーザ光受光にともなう物理的変化を電気信号
に変換するとともに。
In a laser drilling device that drills holes by irradiating a workpiece with a laser beam, the laser beam is attached to a member placed at a position to receive the laser beam that has passed through a hole drilled in the workpiece by the laser beam. In addition to converting the physical changes that occur when receiving light into electrical signals.

この電気信号に基づきレーザ光の発振を制御するように
したものである。
The oscillation of laser light is controlled based on this electrical signal.

〔発明の実施例〕[Embodiments of the invention]

以下1本発明の一実施例を図面を参照して詳述する。 An embodiment of the present invention will be described below in detail with reference to the drawings.

第1図は、この実施例のレーザ穿孔装置を示している。FIG. 1 shows the laser drilling device of this embodiment.

このレーザ穿孔装置はパルス発振を行うレーザ装置(1
)を有している。このレーザ装置(1)から発振される
レーザ光(2)としては1例えば炭酸ガス(CO3)レ
ーザ光、 YAG (Yttrium Alumini
um Garnet )レーザ光、ルビーレーザ光が好
ましい。とのレーザ装置(1)のレーザ光(2)出光側
には、集光レンズ(3)が配設されている。この集光レ
ンズ(3)の出光III Kは板状の°被加工物(4)
が保持治具(5)により固着されている。この被加工物
(4)の底面と1呆持治具(5)との間には例えば鋼板
、銅板、セラミックス板等からなる裏板(6)が介装さ
れている。また、保持治具(5)は、送り装置(力によ
り矢印(8)方向に所定量ずつ送られるようになってい
る。さらに、裏板(6)の下面には、 AE (Aco
ustic Emission)センサ(9)が接着さ
れている。このAEセンサ(9)は、圧電振動子を本体
とするものであって、裏板(6)へのレーザ光(2)の
照射にともなって発生した微弱な弾性波振動を把捉して
電気信号に変換するものであって、出力側は増幅器0〔
を介して比較器αDに接続されている。この比較器αυ
には、任意の設定値vTを設定できるようになっていて
、入力した電気信号の電圧値VがvTを越えると、穿孔
終了信号SHを出力するようになっている。この比較器
αυは、穿孔信号SHが、レーザ装置(1)の制御部(
1a)及び送り装置(力に出力されるように接続されて
いる。また、上記制御部(1a)は、レーザ光(2)の
出光又は停止、出力エネルギの大きさ、パルス幅等を制
御するものである。
This laser drilling device is a laser device (1
)have. The laser beam (2) oscillated from this laser device (1) includes, for example, carbon dioxide (CO3) laser beam, YAG (Yttrium Aluminum) laser beam, etc.
um Garnet) laser light and ruby laser light are preferred. A condensing lens (3) is disposed on the laser beam (2) output side of the laser device (1). The light output III K of this condensing lens (3) is a plate-shaped workpiece (4)
is fixed by a holding jig (5). A back plate (6) made of, for example, a steel plate, a copper plate, a ceramic plate, etc. is interposed between the bottom surface of the workpiece (4) and the first holding jig (5). Furthermore, the holding jig (5) is fed by a feeding device (force) by a predetermined amount in the direction of the arrow (8).
ustic emission) sensor (9) is glued. This AE sensor (9) has a piezoelectric vibrator as its main body, and captures the weak elastic wave vibrations generated when the back plate (6) is irradiated with the laser beam (2) to generate an electrical signal. The output side is an amplifier 0 [
is connected to the comparator αD via. This comparator αυ
It is possible to set an arbitrary set value vT, and when the voltage value V of the input electric signal exceeds vT, a drilling end signal SH is output. This comparator αυ is connected to the control unit (1) of the laser device (1) when the drilling signal SH is
1a) and the feeding device (power is output to the laser beam).The control unit (1a) controls the output or stop of the laser beam (2), the magnitude of the output energy, the pulse width, etc. It is something.

つぎに、上記構成のレーザ穿孔装置の作動について述べ
る。壕ず、レーザ装置(1)よりレーザ光(2)を保持
治具(5)(で保持されている例えばステンレス鋼でで
きている被加工物(4)に照射する。このときのレーザ
光(2)のパワー密度は、例えば2.5 X 10’ 
W7個。
Next, the operation of the laser drilling apparatus having the above configuration will be described. Without a trench, a laser beam (2) is irradiated from a laser device (1) onto a workpiece (4) made of stainless steel, for example, which is held by a holding jig (5). The power density of 2) is, for example, 2.5 x 10'
7 W.

パルス幅は1msとする。また、焦点(F’)は、被加
工物(4)の表面からやや内部に位置させ、この位置に
て固定する。しかして、レーザ光(2)のパルス状照射
にともない、被加工物(4)のレーザスポット部分が溶
融かつ蒸発し、孔+12が徐々に穿孔される。
The pulse width is 1 ms. Further, the focal point (F') is located slightly inside the surface of the workpiece (4) and fixed at this position. With the pulsed irradiation of the laser beam (2), the laser spot portion of the workpiece (4) melts and evaporates, and the hole +12 is gradually drilled.

このとき、AEセンサ(9)は、ノイズ振動以外、異常
な機械振動は把捉しない。そして1.孔(1つが被加工
物(4)を貫通すると、レーザ光(2)は、裏板(6)
を照射する。すると、裏板(6)のレーザ光(2)受光
部分にては、熱影響によシミクロ的な破壊現象と、これ
に随伴する弾性的振動が発生する。このとき発生した弾
性的振動は、 AEセンサ(9)により把捉されて電気
信号SAに変換される。ついで、この電気信号SAは、
増幅器(10にて増幅され、比較器(11)に出力され
る。この比較器Qυにては、設定値■Tと電気信号8A
の電圧−値■とが比較される。とこで設定値vTは。
At this time, the AE sensor (9) does not detect abnormal mechanical vibrations other than noise vibrations. And 1. When the hole (one penetrates the workpiece (4), the laser beam (2) passes through the back plate (6)
irradiate. Then, in the portion of the back plate (6) that receives the laser beam (2), a micro-destructive phenomenon and accompanying elastic vibration occur due to the thermal influence. The elastic vibrations generated at this time are captured by the AE sensor (9) and converted into an electrical signal SA. Then, this electrical signal SA is
It is amplified by the amplifier (10) and output to the comparator (11).In this comparator Qυ, the set value ■T and the electric signal 8A
The voltage - value ■ is compared. However, the set value vT is.

孔α2の貫通時にAEセンサ(9)から出力されている
電気信号SAの電圧値Vよシも小さくなるように設定さ
れて幼る。したがって、比較器住υからは、穿孔信号S
Hが制御部(辱a)及び送シ装置(7)に出力される。
The voltage value V of the electric signal SA output from the AE sensor (9) when passing through the hole α2 is also set to be smaller. Therefore, the perforation signal S from the comparator S
H is output to the control section (a) and the feeding device (7).

その結果、レーザ光(2)の出光が停止されるとともに
、送り装置(7)が作動して、被加工物(4)は1次の
穿孔位置まで送られる。
As a result, the emission of the laser beam (2) is stopped, and the feeding device (7) is activated to feed the workpiece (4) to the primary drilling position.

このように1本実施例のレーザ穿孔装置は、孔の貫通を
人手を一介することなく検出することができるので、穿
孔作業の完全自動化が可能となシ。
As described above, the laser drilling device of this embodiment can detect the penetration of a hole without any human intervention, and therefore, the drilling work can be completely automated.

穿孔能率が顕著に向上する。また、孔の貫通の検査のた
めに被加工物を取シはずす必要がなくなるので、穿孔精
度も向上する。たとえば、直径3闘の孔をレーザ光によ
シ穿設する場合、ばらつきの範囲は、従来においては±
0.4酩であったのが、±Q、33mに向上した。
Drilling efficiency is significantly improved. Further, since there is no need to remove the workpiece for inspection of hole penetration, drilling accuracy is also improved. For example, when drilling a hole with a diameter of 3mm using a laser beam, the range of variation is ±
The distance was 0.4m, but it improved to ±Q, 33m.

なお、上記実施例においては、 AEセンサ(9)は。In addition, in the above embodiment, the AE sensor (9) is.

裏板(6)に装着しているが、第2図に示すように。It is attached to the back plate (6) as shown in Figure 2.

被加工物(l■に孔Iが貫通したときレーザ光(2)を
直接受光する保持具0句の底板(15a)の裏面に装着
しても、上記実施例と同様の効果を奏する。さらに、送
シ装置(力は、穿孔個所が1個所の場合は省略してよい
。また、集光レンズ(3)の焦点(F)位置は。
Even if it is attached to the back side of the bottom plate (15a) of the holder which directly receives the laser beam (2) when the hole I passes through the workpiece (I), the same effect as in the above embodiment can be obtained. , the feeding device (force) may be omitted if there is only one perforation location. Also, the focal point (F) position of the condenser lens (3).

加工面をはさんだ任意位置に設定してよい。また。It may be set at any position across the machined surface. Also.

焦点(F)を穿孔の進行に追従して被加工物の内部に送
るようにしてもよい。さらにまた、孔の貫通の判定法と
して、増幅器00)から出力された電気信号SAを直ち
に比較演算するのでなく、電気信号SAをフィルタから
なる平滑回路又は実効値(RMS(Root Mean
 5quare) )回路を通した後に比較演算しても
よい。さらに、穿孔信号SHを入力して直ちにレーザ光
の発振を停止するのでなく、あらかじめ設定した遅延時
間後に、レーザ光の発振を停止して加工を終了させるよ
うにしてもよい。このようにすることにより、孔内壁面
に装着している溶融残渣を除去することができる。さら
に、AEセンサの代シに、他の振動検出器9例えばフォ
トダイオード、フォ))ランジスタ等の光電変換器を用
いてもよい。この場合、光電変換器は、レーザ光を直接
又は間接に受光する部位に装着する。
The focal point (F) may be sent into the workpiece following the progress of drilling. Furthermore, as a method for determining the penetration of a hole, instead of immediately comparing and calculating the electrical signal SA output from the amplifier 00), the electrical signal SA is processed using a smoothing circuit consisting of a filter or an effective value (RMS).
5quare)) Comparison calculation may be performed after passing through the circuit. Furthermore, instead of stopping the oscillation of the laser beam immediately after inputting the drilling signal SH, the oscillation of the laser beam may be stopped after a preset delay time to complete the machining. By doing so, it is possible to remove the melted residue attached to the inner wall surface of the hole. Further, instead of the AE sensor, another vibration detector 9 may be used, such as a photoelectric converter such as a photodiode or a transistor. In this case, the photoelectric converter is attached to a part that receives laser light directly or indirectly.

〔発明の効果〕〔Effect of the invention〕

本発明のレーザ穿孔装置は、孔の貫通を人手を介するこ
となく検出することができるので、穿孔作業の完全自動
化が可能となシ、穿孔能率が顕著に向上する。さらに、
穿孔終了まで穿孔検査のために、被加工物を全く動かす
心安がなくなるので。
Since the laser drilling device of the present invention can detect hole penetration without manual intervention, the drilling operation can be completely automated, and the drilling efficiency is significantly improved. moreover,
There is no need to move the workpiece at all for drilling inspection until the drilling is completed.

穿孔精度も向上する。Drilling accuracy is also improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の17−ザ穿孔装置の全体構
成図、第2図は本発明のレーザ穿孔装置の変形例を説明
するだめの図である。 (1):レーザ装置(レーザ発振部)。 (2):レーザ光、 包):被加工物。 (9) : AEセンサ(貫通検出部)。 0υ:比較器(演算処理部)。 α2:孔 代理人 弁理士 則 近 憲 佑 (1’壬か1名) 第1図 第2図
FIG. 1 is an overall configuration diagram of a 17-laser drilling device according to an embodiment of the present invention, and FIG. 2 is a diagram for explaining a modification of the laser drilling device of the present invention. (1): Laser device (laser oscillation unit). (2): Laser light, envelope): Workpiece. (9): AE sensor (penetration detection section). 0υ: Comparator (arithmetic processing unit). α2: Kong agent Patent attorney Kensuke Chika (1'min or 1 person) Figure 1 Figure 2

Claims (3)

【特許請求の範囲】[Claims] (1)被加工物にレーザ光を照射して穿孔するレーザ光
発振部と、上記被加工物に穿設された孔が上記被加工物
を貫通したとき上記孔を通過した上記レーザ光を受光す
る位置に配設された部材に装着され上記レーザ光受光に
ともなう物理的変化を電気信号に変換する貫通検出部と
、この貫通検出部から出力された上記電気信号に基づい
て上記レーザ光発振部からのレーザ光の照射を制御する
演算処理部とを具備することを特徴とするレーザ穿孔装
置。
(1) A laser beam oscillation unit that irradiates a workpiece with a laser beam to make a hole, and receives the laser beam that passes through the hole when the hole drilled in the workpiece passes through the workpiece. a penetration detection unit that is attached to a member disposed at a position where the laser beam is received and converts a physical change caused by the reception of the laser beam into an electrical signal; and a penetration detection unit that converts the physical change caused by the reception of the laser beam into an electrical signal; 1. A laser drilling device comprising: a calculation processing unit that controls irradiation of laser light from the laser drilling device.
(2)貫通検出部は超音波振動検出器であることを特徴
とする特許請求の範囲第1項記載のレーザ穿孔装置。
(2) The laser drilling device according to claim 1, wherein the penetration detection section is an ultrasonic vibration detector.
(3)貫通検出部は光電変換器であることを特徴とする
特許請求の範囲第1項記載のレーザ穿孔装置。
(3) The laser drilling device according to claim 1, wherein the penetration detection section is a photoelectric converter.
JP59107419A 1984-05-29 1984-05-29 Laser piercing device Pending JPS60250892A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59107419A JPS60250892A (en) 1984-05-29 1984-05-29 Laser piercing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59107419A JPS60250892A (en) 1984-05-29 1984-05-29 Laser piercing device

Publications (1)

Publication Number Publication Date
JPS60250892A true JPS60250892A (en) 1985-12-11

Family

ID=14458667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59107419A Pending JPS60250892A (en) 1984-05-29 1984-05-29 Laser piercing device

Country Status (1)

Country Link
JP (1) JPS60250892A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5083006A (en) * 1990-03-02 1992-01-21 Rolls-Royce Plc Laser drilling of components
US7816622B2 (en) * 2007-09-28 2010-10-19 General Electric Company System and method for controlling laser shock peening

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5083006A (en) * 1990-03-02 1992-01-21 Rolls-Royce Plc Laser drilling of components
US7816622B2 (en) * 2007-09-28 2010-10-19 General Electric Company System and method for controlling laser shock peening

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