JPS60249500A - Production for two-dimensional array transducer - Google Patents
Production for two-dimensional array transducerInfo
- Publication number
- JPS60249500A JPS60249500A JP59105725A JP10572584A JPS60249500A JP S60249500 A JPS60249500 A JP S60249500A JP 59105725 A JP59105725 A JP 59105725A JP 10572584 A JP10572584 A JP 10572584A JP S60249500 A JPS60249500 A JP S60249500A
- Authority
- JP
- Japan
- Prior art keywords
- jig
- plate
- elements
- columnar
- dimensional array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000005304 joining Methods 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 9
- 238000003908 quality control method Methods 0.000 abstract description 3
- 240000002853 Nelumbo nucifera Species 0.000 abstract 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 abstract 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 238000003491 array Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012285 ultrasound imaging Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
Abstract
Description
【発明の詳細な説明】
（技術分野）
本発明は、超音波イメージング装置に使用する２次元ア
レイトランスデユーサの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method for manufacturing a two-dimensional array transducer for use in an ultrasound imaging device.
このトランスデユーサは平面又は２次曲面ないしコンフ
ォーマルアレイとしての任意の形状の曲面のアレイとし
て、超音波パルス・エコ一方式あるいはＣＴ Ｆ Ｍ
（Ｃｏｎｔｉｎｕｏｕｓ丁ｒａｎｓｍｉｓｓｉｏｎＦ
ｒｅｑｕｅｎｃＶ Ｍ ０ｄｌｌｌａｔｉＯｎ ＞方式
、又はパルスあるいはＣＷのドプラシステムの用途に好
ましく用いられ、ホログラフィ−的あるいは音線順次の
Ａ。This transducer can be used as an array of curved surfaces of any shape as a plane or a quadratic curved surface or a conformal array, an ultrasonic pulse echo type or CT F M
(Continuous mission F
holographic or ray-sequential A, preferably used for pulsed or CW Doppler system applications.
Ｂ又はＣモード的エコー画像などあらゆる用途に応用さ
れ得るものである。It can be applied to all kinds of uses such as B or C mode echo images.
（従来技術）
従来方式はいずれも平板トランスデユーサ（例えばＰＺ
Ｔ素板）をバッキング材又はアパーチュア板に接着した
後これをダイシングする方式による。即ち、薄刃の回転
刃式ダイＡ７モンドカツターで溝を切り込み、この場合
下地の台座まで切り込んで切断する場合もあるが、この
ようにして行う溝切りにより分離されかつ整列したエレ
メント群を得る手法であった。１次元アレイも２次元ア
レイも同様な手法で作られる。(Prior art) All conventional methods use flat plate transducers (for example, PZ
This method involves adhering a T blank plate to a backing material or an aperture plate and then dicing it. That is, a groove is cut with a thin rotary blade die A7 cutter, and in this case, the cut may be made even to the pedestal of the base, but this groove cutting is a method to obtain separated and aligned element groups. Ta. Both one-dimensional and two-dimensional arrays are created using similar techniques.
しかしながら、このような手法には次のような欠点があ
る。However, such a method has the following drawbacks.
■事前にエレメント即圧電素子の品質管理かてさな・い
。■Perform quality control of the piezoelectric element in advance.
■従って、欠陥の無いアレイとすることははなはだ困難
である。(2) Therefore, it is extremely difficult to create a defect-free array.
■事後にエレメントを修理又は交ａ することはできな
い。■Elements cannot be repaired or replaced after the fact.
■更に、アレイの形状として平面以外は作り８１＜、特
に２次以上の曲面は不可能に近い。縮退形の面で直線の
群によって成立し得るものまでしかできない。(2) Furthermore, it is almost impossible to create an array with a shape other than a flat surface, especially a quadratic or higher curved surface. It is possible only to the extent that it can be established by a group of straight lines on a surface of a degenerate form.
■エレメントの分布として、ずれた状態又は基盤の目状
、あるいは放射状等の制約があり、ただ切り込まれる溝
と略直交する方向の力■工刃の送り方向に関してビッヂ
又は幅の分布の自由度が残されるのみである。ランダム
アレイは事実上不可能である。たｌピし、一旦基盤の目
状に切った後、その中ての取捨選択により実現すること
はできる。■The distribution of the elements is constrained by the misaligned state, the pattern of the base, or the radial shape, but the force in the direction approximately perpendicular to the groove to be cut ■The degree of freedom in the distribution of bits or widths with respect to the feeding direction of the cutting blade is left behind. Random arrays are virtually impossible. It can be realized by cutting the base plate into the shape of the base plate and then making a selection from among them.
以上）ホべたような欠点があり、エレメント数をまひさ
かつ開口の実効寸法の大なるを維持しようとづる場合、
ランダムアレイは非常に有効な手法であるが、これは従
来のダイシング法によっては極めて実現性に乏しい。(above) When trying to maintain the number of elements and the effective size of the aperture large due to the drawbacks mentioned above,
Although random arrays are a very effective technique, they are extremely difficult to implement using traditional dicing methods.
（発明の目的）
本発明は、このような欠点を解決するもので、その目的
とするところは、ダイシング技法の制約を取り除くこと
にあり、特に圧電素子エレメントの事前の品質管理を可
能にし、又高価なダイシングソーの助けを借りることな
く少ない設備で無手勝流に試みても成功率の高い２次元
アレイの実現技法を提供することにある。OBJECTS OF THE INVENTION The present invention solves these drawbacks, and its purpose is to remove the limitations of dicing techniques, in particular to enable preliminary quality control of piezoelectric elements, and to The object of the present invention is to provide a technique for realizing a two-dimensional array that has a high success rate even if it is attempted manually with a small amount of equipment without the aid of an expensive dicing saw.
（発明の禍成）
このような目的を達成する本発明は、多数の凹状の穴を
有する治具表面より一部が治具表面より露出した状態に
なるようにして治具の各穴に振動子素子を嵌め込む工程
と、導体膜の設りられた正面板を振動子素子の突出した
全上端面に導体膜を対向させて接合する工程と、前記接
合の工程の後治具を取り去り振動子素子の嵌め込まれて
いた部分の各下端面にバッキング材を接合する工程から
なることを特徴とづ゛るものである。(Disadvantage of the Invention) The present invention achieves the above object by applying vibration to each hole of the jig so that a part of the jig surface having a large number of concave holes is exposed from the jig surface. A step of fitting the element element, a step of joining the front plate provided with the conductor film with the conductor film facing the entire protruding upper end surface of the vibrator element, and a step of removing the jig after the above joining step to avoid vibration. This method is characterized by the step of joining a backing material to each lower end surface of the part where the element was fitted.
（実施例）
以下図面を用いて本発明方法の実施例を詳しく説明する
。第１図の（イ）に示すようにハチの果状又はれんこん
状の凹部２を設（プた冶具１を準備する。第２図はその
凹部断面を示すもので、図示のようにこの凹部は円筒状
凹部とする。(Example) Examples of the method of the present invention will be described in detail below with reference to the drawings. As shown in FIG. 1(a), a jig 1 is prepared in which a bee-shaped or lotus-shaped recess 2 is formed. FIG. 2 shows a cross section of the recess. is a cylindrical recess.
次に、事前に品質管理された円柱状の振動子素子、例え
ばｒ−’ Ｚ ｌ−素子３を第１図（ロ）に示づように
治具１の凹部２にそれぞれ嵌め込む。この円柱状ＰＺＴ
素子はその上下端面に予め電極を接合したものとするこ
ともできる。円柱状のＰＺＴ素子は、例えば共振周波数
「０が略Ｉ Ｍ ｌ−（ｚのものを実現する場合には、
直径１ｍｍ、長さ１．８〜２゜１ｍｍの円柱とづるのが
好適である。ただし、本発明では円柱の大きさを特に限
定するものではない。Next, cylindrical transducer elements whose quality has been controlled in advance, for example, the r-'Z l-element 3, are fitted into the recesses 2 of the jig 1, as shown in FIG. 1(b). This cylindrical PZT
The element may also have electrodes bonded to its upper and lower end surfaces in advance. For example, when realizing a cylindrical PZT element with a resonance frequency of "0 is approximately I M l-(z,
A cylinder having a diameter of 1 mm and a length of 1.8 to 2.1 mm is suitable. However, the present invention does not particularly limit the size of the cylinder.
円柱嵌め込みの後、第１図（ハ）に示すように正面板４
を円柱３上面に接合する。板４は全円柱上面に接合づる
幅広の一枚板で、材質としてはアクリル、ガラス又はプ
リント基板でもよく、又マツチング層であってもよい。After fitting the cylinder, as shown in Figure 1 (c), the front plate 4
is joined to the top surface of the cylinder 3. The plate 4 is a wide single plate bonded to the top surface of the entire cylinder, and may be made of acrylic, glass, or a printed circuit board, or may be a matching layer.
円柱３と板４の接合は接着剤による接着あるいはハンダ
付けでもよい。The cylinder 3 and the plate 4 may be joined by adhesive or soldering.
尚、板４の接合側の面には導体膜５を設けてｄ５き、こ
れを共通電極として利用する。Incidentally, a conductive film 5 is provided on the surface of the plate 4 on the joining side, and is used as a common electrode.
第１図（ハ）の接合完了後、冶具１を取り除き、振動子
素子に電極が予め接合されていない場合には同図（ニ）
に示すように各円柱ＰＺＴ素子の下端面に電極６を接合
する。これらの電極６にはリード線７を接続し、又共通
電極５にもリード線８を接続する。After completing the bonding shown in Figure 1 (c), remove the jig 1, and if the electrode is not bonded to the vibrator element in advance, the same figure (d)
An electrode 6 is bonded to the lower end surface of each cylindrical PZT element as shown in FIG. Lead wires 7 are connected to these electrodes 6, and lead wires 8 are also connected to the common electrode 5.
このようにしで作成したトランスデユーサに対し、例え
ば第１図−〈二）に示づ円柱ＰＺＴ素子３の下側にバッ
キング材を接合すれば上面側が超音波の送受する面とな
る。If a backing material is bonded to the lower side of the cylindrical PZT element 3 as shown in FIG. 1-(2) for the transducer thus prepared, the upper surface side becomes a surface for transmitting and receiving ultrasonic waves.
尚、治具に設ける凹部は必ずしも一定の間隔てなくても
よく、必要に応じてランタムな間隔とづることも可能で
ある。これによりランダムアレイが容易に実現できる。Note that the recesses provided in the jig do not necessarily have to be spaced at regular intervals, and may be arranged at random intervals if necessary. With this, a random array can be easily realized.
又、品種ないし定格値の眉なるいくつかの種類のエレメ
ント毎混在させるような場合にも治具に設ける凹部の穴
の形、径、深さを適宜用意することで実現できる。In addition, even in the case where several types of elements, such as different types or rated values, are mixed, this can be achieved by appropriately preparing the shape, diameter, and depth of the hole in the recess provided in the jig.
更に、ＰＺＴ素子は円柱状に限らず、角柱エレメントで
もよく、治具１の穴の形状をそれに合わせてお（プばよ
い。Further, the PZT element is not limited to a cylindrical shape, but may be a prismatic element, and the shape of the hole in the jig 1 may be adjusted accordingly.
又、バッキング材（又はアパーチュア板）を接合づる場
合において、そのバッキング材接合表面を所望の曲面と
することにより容易に所望の曲面アレイを作製すること
ができる。Furthermore, when bonding backing materials (or aperture plates), a desired curved surface array can be easily produced by forming the bonding surface of the backing materials into a desired curved surface.
第３図は本発明の他の実施例を示す図で、治具１の凹部
の穴の中にバネ３１を挿入しておき、この上から円柱状
ＰＺＩ−エレメントを嵌め込み、上述した如き製造工程
を実施する方法である。この方法によれば、板４に対す
るエレメント３０当接圧を一定化でき、又より均一に高
さの精度をだして接層することかできるという利点があ
る。FIG. 3 is a diagram showing another embodiment of the present invention, in which a spring 31 is inserted into the hole of the recess of the jig 1, a cylindrical PZI element is fitted from above, and the manufacturing process as described above is carried out. This is a method of implementing This method has the advantage that the contact pressure of the element 30 against the plate 4 can be made constant, and that the contact can be made more uniformly and with higher accuracy.
以−Ｆ述べた実施例の他に更に次のようにすることもて
きる。In addition to the embodiments described below, the following may also be implemented.
■マツチング層（板４）を複数層にする。■Multiple matching layers (plate 4) are used.
■バッキング材の上にエレメントを並べ、その上にマツ
チング層を重ねる。又、この状態のものをエレメント毎
又は複数エレメント毎に独立化す・＼くダイシングする
。■Arrange the elements on the backing material and layer the matching layer on top. Further, the product in this state is separated into individual elements or multiple elements and diced.
■第３図に示すハネの代りに穴の奥から圧サク空気を吹
き出すようにしてもよい。■ Instead of the spring shown in Fig. 3, compressed air may be blown out from the back of the hole.
■治具１に設けた穴は貫通孔としておき、下から順次Ｐ
ＺＩ−エレメントが送り出されるような構造の冶具とし
てもよい。■The holes made in jig 1 should be made as through holes, and the holes made in jig 1 should be
The jig may have a structure such that the ZI-element is sent out.
■アレイの一部、又はエレメント配列の一列あるいは一
行を上述のような技法で作り、これを何回か繰り返し、
位置をずらし、アレイを完成させることもできる。■Create part of the array or one column or row of element array using the technique described above, repeat this several times,
You can also move the positions to complete the array.
〈発明の効果）
以上説明したように、本発明によれば、平面又は２次曲
面あるいはコンフォーマルアレイとしての任意の形状の
曲面を有づ−る２次元アレイトランスデユーサを安定に
再現性良く、失敗率が低く又事後にも修理可能であって
、エレメント配置の規制性への拘束や要求を本質的に持
ｌ〔ず、特ＴＡ、な又は大型高価な設備を用いることな
く製造することができる。<Effects of the Invention> As explained above, according to the present invention, a two-dimensional array transducer having a flat surface, a quadratic curved surface, or a curved surface of any shape as a conformal array can be stably and reproducibly produced. , has a low failure rate, can be repaired after the fact, has no inherent restrictions or requirements on the regulatory nature of element placement, and can be manufactured without using special TA or large and expensive equipment. I can do it.
第１図は本発明の詳細な説明するための図、第２図は冶
具の穴の断面図、第３図は本発明の他の実施例の説明図
である。
１・・・治具 ２・・・穴
３・・・振動子素子 ４・・・正面板
５・・・共通電極 ６・・・電極
３１・・・バネ
特許出願人 横河メディカルシステム株式会社尼１図
つ
尼２図
’＜１
荊３図
？
／FIG. 1 is a diagram for explaining the present invention in detail, FIG. 2 is a sectional view of a hole in a jig, and FIG. 3 is an explanatory diagram of another embodiment of the present invention. 1... Jig 2... Hole 3... Vibrator element 4... Front plate 5... Common electrode 6... Electrode 31... Spring patent applicant Yokogawa Medical System Co., Ltd. 1 figure Tsuni 2 figure'<1 荊3 figure? /
Claims (4)
表面より露出した状態になるようにして治具の各穴に振
動子素子を嵌め込む工程と、導体膜の設りられた正面板
を振動子素子の突出した全上端面に導体膜を月面させて
接合づ−る工程と、前記接合の工程の後治具を取り去り
振動子素子の嵌め込まれていた部分の各下端面にバッキ
ング材を接合する工程からなる２次元アレイトランスデ
ユーサの製造方法。(1) The process of fitting the vibrator element into each hole of the jig so that a part of the jig surface is exposed from the jig surface, which has a large number of concave holes, and the process of installing a conductor film. A process of bonding the front plate with the conductor film on the entire protruding upper end surface of the transducer element, and removing the jig after the bonding process and removing the bottom of each part where the transducer element had been fitted. A method for manufacturing a two-dimensional array transducer comprising the step of bonding a backing material to the end face.
が接合されたものであって、前記バッキング材を接合す
る工程はバッキング材接合前に各電極にリード線を接合
する工程を含むことを特徴とする特許請求の範囲第１項
記載の２次元アレイトランスデユーサの製造方法。(2) Electrodes are bonded to the upper and lower end surfaces of the vibrator element in advance, and the step of bonding the backing material includes the step of bonding lead wires to each electrode before bonding the backing material. A method for manufacturing a two-dimensional array transducer according to claim 1.
底に振動子素子の下端面が当接するように振動子素子を
嵌め込むようにしたことを特徴とする特許請求の範囲第
１項記載の２次元アレイトランスデユーサの製造方法。(3) The hole in the jig is formed to have a uniform depth, and the vibrator element is fitted into the hole so that the lower end surface of the vibrator element contacts the bottom of the hole. A method for manufacturing a two-dimensional array transducer according to item 1.
た振動子素子をバネ又は圧縮空気により押し出す力を与
えて行われるようにしたことを特徴とする特許請求の範
囲第１項記載の２次元アレイトランスデユーサの製造方
法。(4) The step of joining the front plate is performed by applying force to push out the vibrator element fitted into the jig using a spring or compressed air. A method for manufacturing a two-dimensional array transducer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59105725A JPS60249500A (en) | 1984-05-25 | 1984-05-25 | Production for two-dimensional array transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59105725A JPS60249500A (en) | 1984-05-25 | 1984-05-25 | Production for two-dimensional array transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60249500A true JPS60249500A (en) | 1985-12-10 |
Family
ID=14415281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59105725A Pending JPS60249500A (en) | 1984-05-25 | 1984-05-25 | Production for two-dimensional array transducer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60249500A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2607631A1 (en) * | 1986-11-28 | 1988-06-03 | Thomson Cgr | PROBE FOR AN ULTRASONIC APPARATUS HAVING A CONCEIVED ARRANGEMENT OF PIEZOELECTRIC ELEMENTS |
-
1984
- 1984-05-25 JP JP59105725A patent/JPS60249500A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2607631A1 (en) * | 1986-11-28 | 1988-06-03 | Thomson Cgr | PROBE FOR AN ULTRASONIC APPARATUS HAVING A CONCEIVED ARRANGEMENT OF PIEZOELECTRIC ELEMENTS |
| EP0272960A1 (en) * | 1986-11-28 | 1988-06-29 | Thomson-Cgr | Probe for an ultrasonic apparatus with an concave arrangement of piezoelectric elements |
| US5042492A (en) * | 1986-11-28 | 1991-08-27 | General Electric Cgr Sa | Probe provided with a concave arrangement of piezoelectric elements for ultrasound apparatus |
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