JPS60242996A - Dust-free gripper - Google Patents
Dust-free gripperInfo
- Publication number
- JPS60242996A JPS60242996A JP10104984A JP10104984A JPS60242996A JP S60242996 A JPS60242996 A JP S60242996A JP 10104984 A JP10104984 A JP 10104984A JP 10104984 A JP10104984 A JP 10104984A JP S60242996 A JPS60242996 A JP S60242996A
- Authority
- JP
- Japan
- Prior art keywords
- dust
- gripping
- cover
- wafer
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は精密製品製造工場等にある無塵室内で使用する
ロボットの無塵把持装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a dust-free gripping device for a robot used in a dust-free room in a precision product manufacturing factory or the like.
従来例の構成とその問題点
一般に無塵室内でロボットを使用する際、ロボットの関
節や構造材から発生する塵埃が、高度な精密性を必要と
するワークに付着し、不良品を出してしまうことがある
。このため関節の密閉化。Conventional configuration and its problems Generally, when a robot is used in a dust-free room, dust generated from the robot's joints and structural materials adheres to workpieces that require a high degree of precision, resulting in defective products. Sometimes. For this reason, the joints are sealed.
構造材の表面処理等によって塵埃の発生を抑えるように
している。しかし、関節の可動範囲が大きく密閉が不可
能であったり、構造材からの塵埃の飛散等どうしても塵
埃の発生は避けられない場合がある。Dust generation is suppressed by surface treatment of structural materials. However, there are cases where the range of movement of the joint is large and sealing is impossible, or where the generation of dust cannot be avoided, such as the scattering of dust from structural materials.
発明の目的
本発明はロボット本体から塵埃が発生した場合でもワー
クへの塵埃の付着を防ぐものである。OBJECTS OF THE INVENTION The present invention prevents dust from adhering to a workpiece even when dust is generated from a robot body.
発明の構成
本発明は、気流が一定方向に制御された無塵室において
ワークを把持する把持部と、前記把持部に設けられたカ
バ〜とからなり、前記カバーを前記把持部がワークを把
持したときにワーク上に前記気流が当たらないように形
成し、ロボット本体から発生した塵埃が把持を行なうワ
ーク上に付着するのを防ぐものである。Structure of the Invention The present invention comprises a gripping part that grips a workpiece in a dust-free chamber in which airflow is controlled in a certain direction, and a cover provided on the gripping part, and the gripping part grips the workpiece while the cover is connected to the gripping part. It is formed so that the airflow does not hit the workpiece when the robot body grips the workpiece, thereby preventing dust generated from the robot body from adhering to the workpiece being gripped.
実施例の説明
以下本発明の一実施例について図面を参照しながら説明
する。図において１はウェハー、２はつエバー１を格納
するウェハーキャリー、３はウェハーキャリー２にはい
ったウェハー１を搬送するロボット、４はロボット３の
先端に設けられ、ウェハーキャリー２を把持する把持部
、５は把持部４に固定され、把持部４がウェハーキャリ
ー２を把持したときにウェハーキャリー２を上部から覆
うカバーである。このカバー５は、下部に開口部を有し
、把持部４によってウェハーキャリー２の上部から、ウ
ェハーキャリー２を把持しに行くものである。６はウェ
ハーキャリー２を把持するだめの把持爪で、カバー５内
に設けられ、把持部４に内蔵されたモータによって駆動
される。ただし、上記ウェハー１．ウェハーキャリー２
．ロボット３、把持部４．カバー６は気流が上から下へ
と一定方向に制御された無塵室内におかれている。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In the figure, 1 is a wafer, 2 is a wafer carrier that stores the Ever 1, 3 is a robot that transports the wafer 1 that has entered the wafer carrier 2, and 4 is a grip part provided at the tip of the robot 3 that grips the wafer carrier 2. , 5 is a cover fixed to the gripping part 4 and covering the wafer carrier 2 from above when the gripping part 4 grips the wafer carrier 2. This cover 5 has an opening at the bottom, and is used to grip the wafer carrier 2 from the upper part of the wafer carrier 2 using the gripping part 4. Reference numeral 6 denotes a holding claw for holding the wafer carrier 2, which is provided inside the cover 5 and is driven by a motor built into the holding part 4. However, the above wafer 1. wafer carry 2
．． Robot 3, gripping unit 4. The cover 6 is placed in a dust-free chamber in which airflow is controlled in a fixed direction from top to bottom.
上記のように構成されたウェハー搬送ロボットにおいて
、ロボット３の関節や構造材から発生した塵埃は下方に
向かう気流によって下方に落ちていく。しかし、第２図
のようにウェハーキャリー２を把持部４で把持したとき
に、ウェハーキャリー２がカバー６によって上部から覆
われるため、塵埃はウェハー１に付着することがなくな
る。In the wafer transfer robot configured as described above, dust generated from the joints and structural materials of the robot 3 falls downward due to the downward airflow. However, when the wafer carrier 2 is gripped by the gripper 4 as shown in FIG. 2, the wafer carrier 2 is covered from above by the cover 6, so that dust does not adhere to the wafer 1.
なお、把持部４においてはカバー５内にウェハーキャリ
ー２を把持するだめの可動部をもつため、その可動部か
ら発生した塵埃がウェハー１に付着する恐れがあるが、
この場合第３図に示すように無塵布を用いた伸縮自在な
カバー５ａを、把持部４の可動部をカバー内に含まない
ように覆うことも考えられる。Note that since the gripping section 4 has a movable part inside the cover 5 for gripping the wafer carrier 2, there is a risk that dust generated from the movable part may adhere to the wafer 1.
In this case, as shown in FIG. 3, it is conceivable to cover the movable part of the grip part 4 with a retractable cover 5a made of dust-free cloth so as not to include the movable part within the cover.
発明の効果
このように本発明は把持部にカバーを設けるという簡単
な構造で、把持したワークへの塵埃の付着を防ぐことが
でき、その実用的効果は大なるものがある。Effects of the Invention As described above, the present invention has a simple structure in which a cover is provided on the gripping portion, and can prevent dust from adhering to the gripped workpiece, and has great practical effects.
第１図は本発明の一実施例におけるウェハー搬送ロボッ
トを示す斜視図、第２図は把持装置の斜視図、第３図は
他の実施例における把持装置の斜視図である。
１・・・・・・ウェハー、２・・・・・・ウェハーギヤ
ｌｊ−，３・・・・ロボット、４・・・・・・把持部、
５，５ａ・・・・・・カバー、６・・・・・・把持爪。FIG. 1 is a perspective view of a wafer transfer robot in one embodiment of the present invention, FIG. 2 is a perspective view of a gripping device, and FIG. 3 is a perspective view of a gripping device in another embodiment. 1...Wafer, 2...Wafer gear lj-, 3...Robot, 4...Gripper,
5, 5a...Cover, 6...Gripping claw.
Claims (1)
埃からワークを保護可能なカバーとからなり、気流が一
定方向に制御された無塵室に設けられた把持装置であっ
て、前記カバーは、前記把持部によシ把持されたワーク
が前記無塵室の塵埃を有した気流に当たらないよう設け
られた無塵把持装置。A gripping device comprising a gripping portion for gripping a workpiece and a cover provided on the gripping portion and capable of protecting the workpiece from dust, the gripping device being installed in a dust-free chamber in which airflow is controlled in a certain direction, The dust-free gripping device is provided with a cover so that the workpiece gripped by the gripping portion does not come into contact with airflow containing dust in the dust-free chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10104984A JPS60242996A (en) | 1984-05-18 | 1984-05-18 | Dust-free gripper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10104984A JPS60242996A (en) | 1984-05-18 | 1984-05-18 | Dust-free gripper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60242996A true JPS60242996A (en) | 1985-12-02 |
| JPH0327350B2 JPH0327350B2 (en) | 1991-04-15 |
Family
ID=14290263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10104984A Granted JPS60242996A (en) | 1984-05-18 | 1984-05-18 | Dust-free gripper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60242996A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5790956A (en) * | 1980-11-28 | 1982-06-05 | Hitachi Ltd | Gripper for wafer |
| JPS5848914A (en) * | 1981-09-18 | 1983-03-23 | Toshiba Corp | Wafer pincette |
-
1984
- 1984-05-18 JP JP10104984A patent/JPS60242996A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5790956A (en) * | 1980-11-28 | 1982-06-05 | Hitachi Ltd | Gripper for wafer |
| JPS5848914A (en) * | 1981-09-18 | 1983-03-23 | Toshiba Corp | Wafer pincette |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0327350B2 (en) | 1991-04-15 |
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