JPS60213389A - Scratching device by carbon dioxide laser - Google Patents

Abstract

PURPOSE:To perform stable and uniform working by providing polygonal mirrors which reflect plural laser beams split by beam splitters and irradiate the beams to work and scanning the laser beam by the rotation thereof. CONSTITUTION:The laser beam 2 from a CO2 laser oscillator 1 is split down to a required number of beams by the beam splitters 3 and bender mirrors 4. The laser beams condensed by lenses 5 are reflected by the polygonal mirrors 6 under rotation and focus at the surface of the work 8, by which the beam scanning is executed. Since the work 8 is passed in the direction 11 perpendicular to the scanning direction 12, the scratch pattern of the turnback is formed on the surface of the work 8. The stable and uniform high-speed scratching is thus made possible by the above-mentioned method.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a carbon dioxide gas (hereinafter referred to as Co2) laser scratch processing device, in particular, a device that splits a laser beam and simultaneously scratches a workpiece such as a silicon steel plate at several locations. This relates to a device that performs uniform high-speed scratch processing.

[Prior art]

For example, in the process of scratching silicon steel sheets to reduce iron loss, the conventional processing equipment used for this purpose is a thin steel brush, scribing needle, shot blast, and ballpoint pen.

YAG lasers and the like have been used, but these have slow processing speeds and there is still room for improvement in processing performance.

[Summary of the invention]

This invention was developed in order to eliminate the drawbacks of the conventional ones as described above, and is based on CO emitted from one oscillator. A full beam splitter that divides the laser beam into a plurality of laser beams, a condensing lens that condenses each of the plurality of L/-saheems, and reflects the upper F laser beam from each of the condensing lenses onto the surface of the workpiece. A polygon mirror that irradiates the laser beam, a rotational drive mechanism that rotates each of the polygon mirrors, a rotational drive mechanism that controls the rotational speed of these rotational drive mechanisms, and δ by the rotation of the polygon mirror. By configuring the apparatus with a moving I#1 movement that moves the workpiece in a direction perpendicular to the direction in which the beam is scanned, it is intended to provide a stable and uniform high-speed scratch processing equipment.

[Embodiments of the invention]

An embodiment of the present invention will be described below. Fig. 11 is a configuration diagram showing a CO2 laser scratch processing apparatus according to IK, an embodiment of the invention, and Fig. 2 is a diagram showing an embodiment of the invention.
FIG. 3 is an explanatory diagram showing a state of scanning by a polygon mirror according to lVc. Note that FIG. 1(a) shows the overall configuration of the Hco2 laser scratch processing apparatus, and FIG. 1(Φ) is a side view showing the configuration of a part of the polygon mirror. Also,
FIG. 2(a) shows the state of scanning by a polygon mirror, and FIG. 2(a) shows a scanning pattern processed on the surface of a workpiece by a laser beam.

In the figure, (1) is a CO2 laser oscillator that generates a 002 laser beam (2), +3) is a beam splitter that splits the carboxylic gas laser beam emitted from the oscillator (1) into multiple laser beams, and 1416 laser beam (21). (5) is a condensing lens that condenses each of the plurality of laser beams (2).
6) reflects the laser beams from each condenser lens (5) and collects the workpiece +81. In this case, a polygon mirror that irradiates a silicon steel plate with a trap laser beam +21 (7 city bo 1
A rotary drive that rotates the Nogon mirror (6) and controls its rotation speed! 11 mechanism and rotation control mechanism. In addition.

Polygon mirror +61 tit direction perpendicular to the axis of the incident laser beam, as shown in Figures 1 and 2.

The rotation is controlled by a silicon steel plate (having a rotation axis in a direction parallel to 81, a one-rotation drive mechanism and a rotation control mechanism), and the condensed laser beam is scanned onto the silicon steel plate (8). At the same time, silicon steel plate + 81tj, steel plate holding jig (
u3t'j is held in a predetermined position by 91 and is flowed in the direction αυ perpendicular to the scanning direction α2 of the laser beam by the moving @ structure QIK that moves the workpiece (8).
The actual processing machine is shown. The operation will be explained below. C.O.
The laser beam (2) from the two laser oscillators (1) is divided into the required number by a beam splitter (3) and a bender mirror (41), and the optical axis is adjusted to make each beam parallel. As shown in Figure 2, the laser beam focused by the condensing lens (5) is reflected by the rotating polygon mirror (6), and is reflected near the surface of the silicon steel plate and then scanned. be done.

The elements are arranged so that the entire width of the silicon steel plate is covered by the divided beams that are scanned.

In this state, one silicon copper plate part is scanned in the scanning direction Q2 at the same time.
Since the steel is flowed in the direction 011Vc perpendicular to the direction 011Vc, a folded scratch crease as shown in Fig. 2 Φ) is formed on the steel plate.

Since the optical path length from the condensing lens (5) to the silicon steel plate (8) changes during scanning, the beam diameter near the focal point should be uniformly processed. I) is an absolute condition. For example, when the incident beam of the condensing lens (5) is single mode and condensed by a plano-convex lens with a radius of 15 m, the depth of focus (1.5 m of the diameter of the beam at the focal point)
1 interval between two positions that have a diameter of 1 times) and the voice point yf
Table 1 shows the relationship with 2 distance.

Table 1 20 inch (508 g) 3.6 0.2330 inch (762 mm) 8.0 0.34 *Diffraction theory When the voice point distance is 10 inches or more, the depth of focus is about 1 degree or more, and scratch processing in such a system KFi
It can be seen that a condensing lens with a pointless distance of 10 inches or more is absolutely necessary.

In addition, when reducing iron loss by scratching a silicon copper plate, the direction (scratch direction) perpendicular to the moving direction (threading direction) of the workpiece and the actual processing [113] are 30 degrees.
It has been found that the best properties will not be obtained if the liquid is diluted below. Therefore, the angle of inclination shown by VC, the number of mirror surfaces n, the rotational speed of the polygon mirror, ie, the angular velocity W (red/sec), the distance J from the laser beam irradiation position of the polygon mirror to the workpiece, (m ), the moving speed of the workpiece (threading speed) V (m/m1n), and this must be kept below 30 degrees by appropriately setting the combination of Although the rotation axis Vi is parallel to the surface of the silicon plate 81, similar scratch processing is possible even if the rotation axis Vi is at a certain angle with the surface of the silicon copper plate Km as shown in No. 30.

3rd magazine + (a) and (b) are a plan view and a 911I side view showing a part of a CO2 laser scratch processing apparatus according to another embodiment of the present invention, respectively.

In addition, although the above description described scratch processing of a silicon steel plate, the workpiece is not limited to an 81D silicon copper plate.

In addition, in the above embodiment, a case is shown in which a condenser lens (51 is a condenser lens with a long edge point of 10 inches or more is used, and the workpiece (8) is installed near the focal point of the condenser lens (5). ,
It does not necessarily have to be used under such conditions.

〔Effect of the invention〕

As described above, according to the present invention, 4 oscillators are emitted from 9 oscillators.
A beam splitter that splits a C02 laser beam into multiple laser beams, and a once condenser that focuses each of the multiple laser beams. A polygon mirror that reflects the laser beam from each optical lens and irradiates the upper if+' laser beam onto the surface of the workpiece, a rotation control mechanism that rotates each polygon mirror, and controls the rotation speed of this rotation drive machine. Rotation control mechanism.

The 002 laser scratch processing equipment was constructed using a mechanism that moves the workpiece in a direction perpendicular to the direction in which the upper 6-pillar laser beam is scanned by the rotation of the polygon mirror, so stable and uniform high-speed scratch processing can be achieved. can be done.

[Brief explanation of the drawing]

Fig. 1 (a), (b)Vi An implementation of this invention? llK
An explanatory diagram showing the state of scanning by a polygon mirror according to one embodiment, an explanatory diagram showing the state of scanning by a polygon mirror according to an embodiment, and a diagram showing the scanning process using a polygon mirror according to an embodiment, were prepared that night.
al and ) are respectively 0 according to other embodiments of this invention.
02 A plan view and a side view showing a part of the laser scratch processing device. Optical lens, (6)... Polygon mirror, (7)... Rotation control mechanism and rotation control mechanism. (8)... Workpiece, 11 (1... Transfer #I mechanism,
03...Processed wire force 0 In the figures, the same reference numerals indicate the same or equivalent parts. Agent Masuo Oiwa

Claims (1)

[Claims] +11 A beam splitter that splits a carbon dioxide laser beam emitted from an oscillator into a plurality of laser beams, a condensing lens that condenses each of the plurality of laser beams, and the laser beam from each of the condensing lenses. a polygon mirror that reflects each of the laser beams and irradiates the surface of the workpiece with the laser beam, a rotation drive mechanism that rotates each of the polygon mirrors, a rotation control mechanism that controls the rotation speed of the rotation drive mechanism, and rotation of the polygon mirror. A carbon dioxide laser scratch processing device # including a moving mechanism that moves the workpiece in a direction perpendicular to the direction in which the laser beam is scanned. (2. In the device wVc described in claim 1. A condenser lens with a focal point of 10 inches or more is used, and the workpiece is placed near the hot spot of the condenser lens. (3) In the device according to claim 1 or Vi 2, the direction in which the laser beam is scanned by the polygon mirror and the actual processing line are 30 degrees. The trap, the moving speed of the workpiece, the number of faces of the polygon mirror, the rotation speed of the polygon mirror, and the distance from the laser beam irradiation position of the polygon mirror to the workpiece are set so as to be as follows. Carbon dioxide laser scratch processing equipment featuring -0