JPS6020474B2 - Manufacturing method of pure copper products - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing inexpensive pure copper products such as steel sheet products, particularly molded products with a low degree of processing such as pen trays and ashtrays.

Processed steel products are usually produced by forming rolled steel plates into the desired shape by press working or chipping, but in order to manufacture raw rolled plates with a thickness of 1 shelf or less, First, the electrolytic copper obtained by electrolytic refining is once melted, and the cross section is, for example, 160 m in length and 37 m in width, and has a length of 140 W.
Manufactures cakes (referred to as cakes) of the same size.

This cake is heated to 800 to 90 mm, hot rolled to reduce the skin thickness to about 10 to 15 mm, and the acid eaves on both surfaces are removed. Then, cold rolling and annealing are repeated to obtain the desired result. Manufacture rolled plates with a thickness of .

It is well known that this process involves large-scale equipment and a large number of steps, and therefore involves considerable costs.

Copper is soft on its own, but is often used in mechanical parts by adding other elements to increase its hardness or in the form of various alloys to improve heat resistance. In many fields, pure steel is used for decorative items and parts that do not require much mechanical strength.

Therefore, in order to obtain an alloy plate, it is necessary to melt the fin steel, add alloying ingredients, produce a cake with the alloy composition, and then plate it in the above process. The present invention provides a method for obtaining a low-cost copper molded product by omitting the above steps. That is, in the early stage of electrolysis in energy-saving shark refining, electric steel is deposited relatively uniformly on the cathode surface, and its thickness is proportional to the amount of current applied.After applying electricity in advance to a desired amount, A raw material is obtained by peeling the boxed steel plate from the cathode mother plate, and the raw material plate is cut into an appropriate shape and then subjected to plastic working using a press or the like to obtain a product.

The above-mentioned helmet-coated thin plate is produced in a similar manner to the so-called seed plate material used in ordinary electrolytic refining.

That is, the seed plate used for normal electrolytic refining uses the mother plate as the cathode, for example, at a current density of 200 A/that, a copper concentration of 45/day, an acid concentration of 190/day, a liquid temperature of 60°C, and a small amount of pork added. A steel plate with a thickness of approximately 0.6 mm, which has been electrodeposited using an electrolytic solution, is used after being peeled off from the base plate.

However, the thin plate obtained by this method has pores and tends to have uneven thickness, so although it can be used as a seed plate for electrolysis, there are problems in using it as it is for general processing. When a soap solution is applied as a remover to the frosted surface of the base plate, fine air bubbles are generated on the exposed surface, and the spots remain as pores without frosting. Therefore, in the present invention, it is important to once apply the release agent solution to the base plate and then wipe it to eliminate air bubbles. This step can be omitted when using a titanium base plate, and it is easier to obtain a uniform turtle signboard.

In addition, additives to improve the adhesion are not only pork but also thiourea, etc., used in ordinary electrolytic refining, but in the case of the present invention, the debonded metal is plastically processed to form a molded product. In order to give the obtained electrodeposited plate appropriate workability, it was decided to use additives only in the sides.

That is, if thiourea or the like is used in combination, the hardness of the turtle signboard will increase, making it difficult to process, requiring a large amount of pressure, or returning to its original shape after being processed. It cannot be used for this purpose.

The desired plate thickness can be obtained by increasing the amount of current applied, but if the current density is too high, the electrodeposition will be rough, and if it is too low, the efficiency will be poor, usually 250-15mm, preferably 210-15mm.
The level of 8 peaks A' is good. For example, when electrolyzing for 2 hours at a current density of 20M/that, an electrodeposited layer of about 0.6 thickness can be obtained.

Therefore, in order to obtain a plate with a desired thickness, it is possible to obtain a considerably thick plate by extending the electrolysis time. Non-uniform electrodeposition due to the growth of electrodeposit progresses in a geometric progression, resulting in poor surface condition and uneven thickness, both of which are unpalatable for the purposes of the present invention.

Therefore, in practice, it is effective to electrodeposit with a thickness of 0.5 to 2 layers at a current density of 200 A' for 20 to 5 hours.
If the thickness of the plate is the same as that of a parenthesis, there will be no open pores, and the plate will be sufficient for the intended use. Example 1 Refined crude steel was used as an anode and a rolled steel plate was used as a cathode. After applying a soap solution to the surface of the cathode in advance, it was wiped with a sponge to remove small bubbles on the surface of the cathode before use.

The distance between the anodes was 10 mm between centers. After electrolysis was continued for 4 hours at a cathode current density of 20 M', the electrodeposited steel plate was removed from the electrolytic bath and peeled off from the base plate.
A turtle coated steel plate with a thickness of 2 caps was obtained. This steel plate was cut and pressed to produce an ashtray. Similarly, 0.6 was electrodeposited for two days.
A pen plate was manufactured using a thick peeling plate, but the surface in contact with the mother plate (
The motherboard surface is relatively smooth and glossy, and the opposite surface (the silkworm-bearing surface) has a satin finish with fine irregularities and is semi-glossy, so you can use both sides depending on your preference.

Note that with the above thickness, there are usually no ventilation holes, so it can also be used for impermeable boards such as roof boards.

Claims (1)

[Scope of Claims] 1. A method for manufacturing pure copper products, in which an electrodeposited seed plate is used as a raw material without going through a melting and rolling process, and is directly cold-processed to form a copper container or plate. 2. The method for producing pure copper products according to claim 1, wherein the thickness of the electrodeposited seed plate is 0.5 to 2.0 mm.