JPS60203627A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS60203627A JPS60203627A JP6144784A JP6144784A JPS60203627A JP S60203627 A JPS60203627 A JP S60203627A JP 6144784 A JP6144784 A JP 6144784A JP 6144784 A JP6144784 A JP 6144784A JP S60203627 A JPS60203627 A JP S60203627A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- formula
- dicyandiamide
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、人混な材料（金属やグラスチノクスなど）？
接着したり、塗装したりするのに適した低温速硬化型の
一液、あるいは粉末状のエポキシ樹脂組成物に関するも
のである。[Detailed Description of the Invention] Industrial Field of Application This invention is applicable to materials that are crowded (such as metals and Glastinox)?
The present invention relates to a low-temperature, fast-curing one-component or powdered epoxy resin composition suitable for adhesion or painting.
従来例の構成とその問題点
従来、エポキシ樹脂組成物の硬化剤としては、アミン類
や、酸無水物等がよく用いられているがこのような硬化
剤を含有するエポキシ樹脂組成物は、接着・力が充分で
なかったり、また特に−成型組成物や、一体型粉体組成
物の場合などにおいては、硬化性と貯蔵安定性とを両立
し得るものがない等の問題点を有している。Structures of conventional examples and their problems Conventionally, amines, acid anhydrides, etc. have been often used as curing agents for epoxy resin compositions, but epoxy resin compositions containing such curing agents have no adhesive properties.・There are problems such as insufficient strength, and especially in the case of molding compositions and integrated powder compositions, there is no material that can achieve both curability and storage stability. There is.
例えば、エポキシ樹脂を接着剤として用いる時その硬化
剤として、ジシアンジアミドが多用されるが、この系に
おいては、接着力および貯蔵安定性は優れているが、硬
化反応として例えば１８０°Ｃ／２時間というように高
温かつ長時間全必要とする等の欠点があった。For example, when epoxy resin is used as an adhesive, dicyandiamide is often used as a curing agent. Although this system has excellent adhesive strength and storage stability, the curing reaction requires, for example, 180°C/2 hours. However, it has drawbacks such as requiring high temperatures and long periods of time.
発明の目的
本発明は、以上のような欠点を改良し、接着力が高く、
貯蔵安定性に優れ、かつ低温度硬化の可能な、−散型ま
たは一体粉末型エポキシ柄脂組成物を提供することを目
的とする。Purpose of the Invention The present invention improves the above-mentioned drawbacks, has high adhesive strength,
It is an object of the present invention to provide an epoxy pattern resin composition in the form of a powder or integral powder, which has excellent storage stability and can be cured at low temperatures.
発明の構成
上記目的達成のため、本発明のエポキシ樹脂組成物は
式
％式％
で表わされるジシアンジアミドと
一般式
（式中、Ｒ１は水素原子、又はメチル基を示し、Ｒ２は
炭素数１〜１７のアルキル基を示す）で表わさ扛るイミ
ダゾ−ルとを含む。Composition of the Invention In order to achieve the above object, the epoxy resin composition of the present invention combines dicyandiamide represented by the formula % and the general formula (wherein R1 represents a hydrogen atom or a methyl group, and R2 represents a and imidazole represented by (representing an alkyl group).
実施例の説明
以下本発明の一実施例を説明する〇
−一般
式式中Ｒは水素原子又はメチル基）で示さ扛るビスフェ
ノールＡ型（またはＦ型）エポキシ樹脂（以下それぞれ
樹脂Ａ、樹脂Ｂと略す）（式中Ｒは水素原子又はメチル
基）で示される、フェノールノボラック（またはクレゾ
ールノボラック）タイプエポキシ樹脂（以下そ扛ぞれ樹
脂Ｃ１樹脂りと略す）
と、式
％式％
で示されるジシアンジアミド（以下ＤＩＣＹと略す）
と、式
（式中Ｒ１は水素原子、又はメチル基を示し、Ｒ２は炭
素数１〜１７のアルキル基を示す）で表わさ扛るイミダ
ゾール（以下、Ｒが水素原子でＲ２が炭素数１１の場合
１ｃ１１Ｚ 、 Ｒ１が水素原子で、Ｒ２が炭素数１７
の場合をＣ１□Ｚと略す）とを含み、上記において、樹
脂Ａ、Ｃは液状または固体であり、樹脂Ｂは液状、樹脂
りは固体である。硬化剤Ｃ１１Ｚ、およびＣ１□Ｚは、
それぞれ同し名称で、四国化成工業（株）より市販され
ている０
樹脂Ａ、Ｂ、Ｃ，Ｄの単独または２種以上組み合わせた
もの１００重量部に対して、ＤＩＣＹは４〜２０重量部
、Ｃ１１ＺおよびＣ１□Ｚは１〜１０重電部配合する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below. Bisphenol A type (or F type) epoxy resin (hereinafter referred to as Resin A and Resin B, respectively) represented by the general formula in which R is a hydrogen atom or a methyl group. A phenol novolac (or cresol novolac) type epoxy resin (hereinafter each abbreviated as resin C1 resin) represented by the formula (in which R is a hydrogen atom or a methyl group) Dicyandiamide (hereinafter abbreviated as DICY) and imidazole (hereinafter R is a hydrogen atom or a methyl group) represented by the formula (wherein R1 represents a hydrogen atom or a methyl group and R2 represents an alkyl group having 1 to 17 carbon atoms). When R2 has 11 carbon atoms, 1c11Z, R1 is a hydrogen atom, and R2 has 17 carbon atoms.
In the above, resins A and C are liquid or solid, resin B is liquid, and resin is solid. The curing agents C11Z and C1□Z are
DICY is 4 to 20 parts by weight for 100 parts by weight of resins A, B, C, and D, either alone or in combination of two or more, which are commercially available from Shikoku Kasei Kogyo Co., Ltd. under the same name. C11Z and C1□Z are blended in an amount of 1 to 10 parts.
従来の（旬脂Ａ、Ｂ、Ｃ，Ｄそれぞれに硬化剤としてＬ
）ＩＣＹｉ単独で配合したものに比べて、硬化促進剤と
して、Ｃ１１ＺおよびＣ１□ｚｌ加えることにより、低
温短時間硬化においても高い接着力をもったエポキシ樹
脂組成物が得られる。また、粉体の塗料や接着剤として
本エポキシ樹脂組成物を用いる時にも、Ｃ１１Ｚ およ
びＣ１□Ｚを加えることにより、樹脂組成物の軟化後の
流れが改善されて、被接着物が充分に接着剤組成物に覆
われる効果もある。Conventional (seasonal fat A, B, C, D each with L as a hardening agent)
) By adding C11Z and C1□zl as curing accelerators, an epoxy resin composition with high adhesive strength even when cured at a low temperature and in a short time can be obtained, compared to a case where ICYi is blended alone. Furthermore, when using the present epoxy resin composition as a powder coating or adhesive, the addition of C11Z and C1□Z improves the flow of the resin composition after it has been softened, allowing the adherend to adhere well. There is also the effect of being covered by the agent composition.
また、本発明のエポキシ樹脂組成物には、充てん剤とし
て、炭酸カルシウム、タルク、シリカ等も混合して用い
てもよい。Further, the epoxy resin composition of the present invention may be mixed with calcium carbonate, talc, silica, etc. as a filler.
以下、具体例を示すＣ
実施例１
樹脂Ａの一般式で示したｎ ＝ Ｏのもの（液体）１０
０重量部にＤＩＣＹ１０重量部、Ｃ１１Ｚ６重量部を加
え、３本ロールミルにて、硬化剤を樹脂中に分散混合さ
せた。２枚のアルミ板’ｌ−２，５ｃａの面積で貼り合
わせ、１２０°Ｃ１３０分硬化後オートグラフにて、せ
ん断接着強度を測定したところ、２２０ν／ Ｃａであ
った。また、この組成物は６°Ｃで３ケ月間保存した後
も接着力の低下は見られなかった。Specific examples are shown below.Example 1 Resin A with n = O (liquid) shown in the general formula 10
10 parts by weight of DICY and 6 parts by weight of C11Z were added to 0 parts by weight, and the curing agent was dispersed and mixed into the resin using a three-roll mill. Two aluminum plates were bonded together with an area of 1-2.5 ca, and after curing at 120°C for 130 minutes, the shear adhesive strength was measured using an autograph and found to be 220 ν/Ca. Furthermore, no decrease in adhesive strength was observed even after this composition was stored at 6°C for 3 months.
実施例２
樹脂への一般式で示したｎ−２（粉体）のもの１００Ｎ
量部に対して、ＤＩＣＹ、１ｏ重量部。Example 2 100N of n-2 (powder) shown in the general formula for resin
DICY, 10 parts by weight.
Ｃ１１ｚ６重量部を加え、ボールミルにて分散混合させ
た。実施例１と同様に、せん断接着強度を測定すると、
２００ Ｋｐ ／ ｃＪであった。この組成物も、６°
Ｃで３ケ月保存後、接着力の低下は見られなかつｆ？−
０
以下、下表に実施例、および従来品の結果を比較して示
す。6 parts by weight of C11z was added and dispersed and mixed using a ball mill. Similar to Example 1, when shear adhesive strength was measured,
It was 200 Kp/cJ. This composition also has 6°
After storage for 3 months at C, no decrease in adhesive strength was observed and f? −
0 Below, the results of the example and the conventional product are compared and shown in the table below.
（以下余 白）
発明の効果
以上のように、本発明によれば、−液性、或いは一体粉
体型のエポキシ樹脂組成物を１２０″Ｃで３０分という
低温短時間の条件で硬化でき高温長時間の雰囲気中に置
けない電子部品や電気部品などを初めとする多くの素材
の接着、塗装、封止などに広く応用することができる。(The following is a blank space) Effects of the Invention As described above, according to the present invention, a liquid or integral powder type epoxy resin composition can be cured at a low temperature and a short time of 30 minutes at 120"C. It can be widely applied to bonding, painting, and sealing many materials, including electronic and electrical components that cannot be left in an atmosphere for long periods of time.
Claims (1)
炭素数１〜１７のアルキル基を示す）で表わされるイミ
ダゾールとを含むことを特徴とするエポキシ樹脂組成物
。[Claims] Dicyandiamide represented by the formula % and the general formula (wherein R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 1 to 17 carbon atoms) An epoxy resin composition characterized by containing imidazole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6144784A JPS60203627A (en) | 1984-03-28 | 1984-03-28 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6144784A JPS60203627A (en) | 1984-03-28 | 1984-03-28 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60203627A true JPS60203627A (en) | 1985-10-15 |
Family
ID=13171322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6144784A Pending JPS60203627A (en) | 1984-03-28 | 1984-03-28 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60203627A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63202676A (en) * | 1987-02-19 | 1988-08-22 | Somar Corp | Epoxy resin powder coating having excellent adhesive property |
| JPS63264624A (en) * | 1986-09-16 | 1988-11-01 | Sumitomo Bakelite Co Ltd | Liquid epoxy resin composition |
| KR101106068B1 (en) | 2004-12-21 | 2012-01-18 | 에스케이케미칼주식회사 | Epoxy resin encapsulant composition for preventing optical leakage |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52138599A (en) * | 1976-04-30 | 1977-11-18 | Sir Soc Italiana Resine Spa | Composite sultable for coating by means of electrostatlc spraying |
-
1984
- 1984-03-28 JP JP6144784A patent/JPS60203627A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52138599A (en) * | 1976-04-30 | 1977-11-18 | Sir Soc Italiana Resine Spa | Composite sultable for coating by means of electrostatlc spraying |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63264624A (en) * | 1986-09-16 | 1988-11-01 | Sumitomo Bakelite Co Ltd | Liquid epoxy resin composition |
| JPS63202676A (en) * | 1987-02-19 | 1988-08-22 | Somar Corp | Epoxy resin powder coating having excellent adhesive property |
| KR101106068B1 (en) | 2004-12-21 | 2012-01-18 | 에스케이케미칼주식회사 | Epoxy resin encapsulant composition for preventing optical leakage |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5084532A (en) | Hot-melt adhesive of epoxy resins and amino groups-containing polyoxypropylene | |
| JPS6072917A (en) | Latent curing agent for epoxy resin | |
| WO2000046317A1 (en) | Resin compositions | |
| US4747968A (en) | Low temperature cure having single component conductive adhesive | |
| KR100189282B1 (en) | Room-temperature stable, one-component, flexible epoxy adhesives | |
| US5965673A (en) | Epoxy-terminated prepolymer of polyepoxide and diamine with curing agent | |
| JPH0547212A (en) | Single-fluid type conductive adhesive | |
| KR100444409B1 (en) | Epoxy resin composition | |
| US3562215A (en) | Low temperature,latent epoxy resin curing system | |
| US5244939A (en) | Imidazole compound-containing hardening agent composition, method of preparing the same and thermosetting epoxy resin composition | |
| JPS60203627A (en) | Epoxy resin composition | |
| JP3196245B2 (en) | One-part type thermosetting epoxy resin composition | |
| JPS61207425A (en) | Two-component epoxy resin composition | |
| JPS6249293B2 (en) | ||
| JPH078899B2 (en) | Curable composition | |
| JPS6183218A (en) | Epoxy resin composition | |
| JPS61166825A (en) | Epoxy resin composition | |
| JPS6069126A (en) | Thermosetting resin composition | |
| JPS63227686A (en) | Adhesive composition of sheet form | |
| JPH0346006B2 (en) | ||
| JPS6155114A (en) | Production of curing agent for epoxy resin | |
| JP3225574B2 (en) | One-part type thermosetting epoxy resin composition | |
| JPS6183219A (en) | Epoxy resin composition | |
| JP2918850B2 (en) | One-component flexible epoxy adhesive stable at room temperature | |
| JPS63227684A (en) | Epoxy resin adhesive composition |