JPS6020180U

JPS6020180U - Electronic device housing device

Info

Publication number: JPS6020180U
Application number: JP11289583U
Authority: JP
Inventors: 祐次渡辺; 修小泉
Original assignee: 東芝テック株式会社
Priority date: 1983-07-20
Filing date: 1983-07-20
Publication date: 1985-02-12

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は従来のカバーとベースとの取付構造を示す一部
を拡大した縦断側面図、第２図ないし第８図はこの考案
の一実施例を示すもので、第２図は側面図、第３図は分
解斜視図、第４図はベースとカバーとの取付状態を示す
一部を拡大した縦断側面図、第５図はその一部を拡大し
た縦断正面図、第６図はカバーへの取付脚の取付関係を
示す一部を拡大した分解斜視図、第７図はカバーへの取
付　　　、脚の取付状態を示す一部を拡大した斜視図、
第８図は取付脚を接着面側より見た拡大した斜視図であ
る。１・・・・・・筐体、２・・・・・・ベース、３・・・
・・・カッ゛＜−１４・・・・・・拡開部、５・・・・
・・取付脚、８・・・・・・チップ、９・・・・・・金
属片、１５・・・・・・接着面、１６・・・・・・カッ
ト部。Fig. 1 is a partially enlarged vertical sectional side view showing a conventional mounting structure between a cover and a base, and Figs. 2 to 8 show an embodiment of this invention; Fig. 2 is a side view; Fig. 3 is an exploded perspective view, Fig. 4 is a partially enlarged longitudinal side view showing how the base and cover are attached, Fig. 5 is a partially enlarged vertical sectional front view, and Fig. 6 is the cover. Fig. 7 is a partially enlarged exploded perspective view showing the mounting relationship of the mounting legs; Fig. 7 is a partially enlarged perspective view showing the mounting state of the legs;
FIG. 8 is an enlarged perspective view of the mounting leg seen from the adhesive surface side. 1... Housing, 2... Base, 3...
・・・Ka゛<-14... Expansion part, 5...
... Mounting leg, 8 ... Chip, 9 ... Metal piece, 15 ... Adhesive surface, 16 ... Cut portion.

Claims

[Scope of utility model registration request]

A synthetic resin cover is provided which is supported by an enlarged part formed on the upper opening edge of the base and forms a housing together with the base, and the cover is positioned so that its lower edge is supported by the enlarged part. a plurality of mounting legs each consisting of a synthetic resin chip adhered to the inner surface of the base and a metal piece partially embedded in the chip and screwed to the inner surface of the base;
A casing device for an electronic device, characterized in that a cut portion is formed along the lower edge of the bonding surface of the chip to the cover to collect adhesive that protrudes from the bonding surface.