JPS60197734A - Preparation of polyamide resin particles - Google Patents

Preparation of polyamide resin particles

Info

Publication number
JPS60197734A
JPS60197734A JP5235684A JP5235684A JPS60197734A JP S60197734 A JPS60197734 A JP S60197734A JP 5235684 A JP5235684 A JP 5235684A JP 5235684 A JP5235684 A JP 5235684A JP S60197734 A JPS60197734 A JP S60197734A
Authority
JP
Japan
Prior art keywords
polyamide resin
component
particle size
resin particles
nylon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5235684A
Other languages
Japanese (ja)
Inventor
Takashi Kai
丘 甲斐
Nobuo Kushibiki
信男 櫛引
Shigeru Saeda
佐枝 繁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP5235684A priority Critical patent/JPS60197734A/en
Publication of JPS60197734A publication Critical patent/JPS60197734A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processes Of Treating Macromolecular Substances (AREA)

Abstract

PURPOSE:To provide the titled resin particles in a perfectly spherical form, having a narrow particle size distribution, by dispersing a polyamide resin in a particular medium contg. an anionic surfactant by heating, followed by separating. CONSTITUTION:A polyamide resin (A) (e.g., nylon 6), a medium (B) of the formula (wherein R, R' are H, 1-12C straight-chain or branched alkyl; R'' is H, CH3, C2H5; n is 20 or more) having a MW of 900-1,000,000 (e.g., polyoxyethylene), and 0.1-40% one or more anionic surfactants (C) based on said polyamide resin are mixed with stirring at a temp. of at least the m.p. or softening point of components A and B to disperse well, and then cooled to a temp. of at most the m.p. of the component A and at least the m.p. or softening point of the component B. Then, the component A is separated from the component B, etc. by procedures such as filtering and, if necessary, the component B is completely removed by washing with water or low-boiling org. compds., yielding the titled resin particles.

Description

【発明の詳細な説明】 技術分野 本発明は、球状のポリアミド樹脂微粒子の製造法に関し
、更に詳しくは、粒径及び粒度分布、特に粒度分布を制
御することができる球状で緻密な構造のポリアミド微粒
子の製造法に関する。
Detailed Description of the Invention Technical Field The present invention relates to a method for producing spherical polyamide resin fine particles, and more specifically, to a method for producing spherical polyamide resin fine particles, and more particularly to spherical and densely structured polyamide fine particles whose particle size and particle size distribution, particularly particle size distribution, can be controlled. Concerning the manufacturing method.

え嵐汰阪 熱可塑性樹脂の微粒子の製造方法として、懸濁重合又は
乳化重合により微粒子を製造する方法、ポリマーを溶媒
に溶解させた後、これに非又は貧溶媒を加えて析出沈澱
させる方法、ポリマーを溶媒に加熱溶解させた後に冷却
し結晶化させて沈澱させる方法、ボールミル、ジェット
ミル等を用いて機械的に粉砕する方法などが知られてい
る。しかしながら、懸濁重合法、乳化重合法などによる
ポリアミド樹脂の製造法は未だ確立されておらず、ポリ
マー溶液から析出させる方法では、析出時に緻密な構造
の微粒子が得られず、多孔質状になったり、均質な球形
微粒子が得られなかったりするという欠点があった。ま
た、本発明者らは先に実質的に球状のポリアミド樹脂微
粒子を製造する方法を見出し、既に特許出願したく特願
昭58−147324号参照)。
Methods for producing microparticles of Aratasaka thermoplastic resin include a method of producing microparticles by suspension polymerization or emulsion polymerization, a method of dissolving a polymer in a solvent, and then adding a non- or poor solvent thereto for precipitation. A method in which a polymer is heated and dissolved in a solvent and then cooled to crystallize and precipitate, and a method in which the polymer is mechanically pulverized using a ball mill, a jet mill, etc. are known. However, methods for producing polyamide resin by suspension polymerization, emulsion polymerization, etc. have not yet been established, and methods in which they are precipitated from a polymer solution do not yield fine particles with a dense structure during precipitation, resulting in porous particles. However, there were disadvantages in that homogeneous spherical particles could not be obtained. Furthermore, the present inventors have previously discovered a method for producing substantially spherical polyamide resin fine particles, and have already filed a patent application (see Japanese Patent Application No. 147324/1982).

しかしながら、従来方法において、粒度分布の調節を機
械的な攪拌方法のみで達成しようとするのは困難であり
、技術の一層の改善がめられるところである。
However, in conventional methods, it is difficult to control the particle size distribution using only mechanical stirring, and further improvements in the technology are needed.

発明の目的 従って、本発明の目的は実質上完全な球状のポリアミド
樹脂微粒子であって、特に粒度分布の狭いポリアミド樹
脂微粒子の製造方法を提供することにある。
OBJECTS OF THE INVENTION Accordingly, an object of the present invention is to provide a method for producing polyamide resin fine particles that are substantially perfectly spherical, particularly having a narrow particle size distribution.

発明の構成 本発明に従えば、一般式(I) (式中、R及びR′はそれぞれ独立に水素原子又は炭素
数1〜12の直鎮状もしくは分岐鎖状アルキル基、R”
は水素原子又はメチルもしくはエチル基、nは20以上
の数である)で表わされる化合物を媒体化合物として用
い、この媒体化合物とポリアミド樹脂を混合し、更に陰
イオン性界面活性剤のうちから選ばれた少なくとも1種
の化合物を添加してポリアミド樹脂及び媒体化合物の融
点又は軟化点以上の温度で混合分散せしめた後、ポリア
ミド樹脂を分離することがら成る粒径分布の狭いポリア
ミド樹脂微粒子の製造方法が提供される。
Structure of the Invention According to the present invention, the general formula (I) (wherein R and R' are each independently a hydrogen atom or a straight or branched alkyl group having 1 to 12 carbon atoms, R''
is a hydrogen atom or a methyl or ethyl group, and n is a number of 20 or more) is used as a medium compound, this medium compound and a polyamide resin are mixed, and an anionic surfactant selected from among A method for producing fine polyamide resin particles with a narrow particle size distribution, which comprises adding at least one compound to the polyamide resin and mixing and dispersing the medium compound at a temperature higher than the melting point or softening point, and then separating the polyamide resin. provided.

本発明方法を適用しうるポリアミド樹脂としてはアミノ
酸縮合型ポリアミド、二塩基酸−ジアミン縮合型ポリア
ミド及びそれら相互間の共重合体をあげることができる
。このようなポリアミド樹脂としては、例えば、ナイロ
ン6、ナイロン7、ナイロン10、ナイロン11.ナイ
ロン12、ナイロン13、ナイロン66などの重合体、
ナイロン6/12、ナイロン6766、ナイロン6/1
0.ナイロン6/68/ 6−10.ナイoy6/6T
/6−10. ナイ。
Examples of polyamide resins to which the method of the present invention can be applied include amino acid condensation polyamides, dibasic acid-diamine condensation polyamides, and copolymers thereof. Examples of such polyamide resins include nylon 6, nylon 7, nylon 10, nylon 11. Polymers such as nylon 12, nylon 13, nylon 66,
Nylon 6/12, nylon 6766, nylon 6/1
0. Nylon 6/68/ 6-10. Nice oy6/6T
/6-10. No.

ン6/6T/6I (Tはテレフタール酸成分、■はイ
ソフタール酸成分を示す)などの共重合体などをあげる
ことができる。またこれらのポリアミドの2種以上のブ
ロック共重合体、混合物又はポリアミド以外の他の重合
体とのブロック共重合体、混合物などにも本発明方法を
通用することができる。
Examples include copolymers such as 6/6T/6I (T represents a terephthalic acid component, and ■ represents an isophthalic acid component). The method of the present invention can also be applied to block copolymers or mixtures of two or more of these polyamides, or block copolymers or mixtures with other polymers other than polyamides.

媒体化合物(■)としては、分子量が900〜1.00
0.000のポリオキシンエチレン及びポリオキシプロ
ピレンを使用するのが好ましく、ポリアミド樹脂の溶融
粘度が高い場合には、分子量10.000以上であるの
が好適である。
The medium compound (■) has a molecular weight of 900 to 1.00.
It is preferable to use polyoxine ethylene and polyoxypropylene having a molecular weight of 0.000, and when the polyamide resin has a high melt viscosity, a molecular weight of 10.000 or more is preferable.

本発明方法において使用する陰イオン性界面活性剤とし
ては、例えば脂肪酸塩、高級アルコールの硫酸エステル
塩、脂肪酸アルコールのリン酸エステル、アルキルアリ
ルスルホン酸塩などが挙げられる。
Examples of the anionic surfactant used in the method of the present invention include fatty acid salts, higher alcohol sulfate ester salts, fatty acid alcohol phosphate esters, alkylaryl sulfonates, and the like.

本発明方法の具体的実施にあたっては、例えば、先ずポ
リアミド樹脂と前記一般式(1)の媒体化合物と、陰イ
オン性界面活性剤とをポリアミド樹脂及び媒体化合物の
融点又は軟化点以上の温度で攪拌して十分に混合分散せ
しめる。使用するポリアミド樹脂と媒体化合物によって
陰イオン性界面活性剤は適宜選択することができる。
In carrying out the method of the present invention, for example, first, a polyamide resin, a medium compound of the general formula (1), and an anionic surfactant are stirred at a temperature higher than the melting point or softening point of the polyamide resin and the medium compound. Mix and disperse thoroughly. The anionic surfactant can be appropriately selected depending on the polyamide resin and medium compound used.

ポリマーを粒子化するためには、ポリマーの変形力をF
D、変形に抗する力をFGとするとFDがFGより大で
ある必要がある。FGはポリマーの緩和弾性項に比例す
る力であるため使用するポリアミドの種類によって異な
る。FDは使用する界面活性剤によって支配される力で
ある。FDは界面活性剤の種類によって異なるため、ポ
リアミドの種類によっては効果の無い界面活性剤もある
In order to make a polymer into particles, the deformation force of the polymer is F
D. If FG is the force resisting deformation, FD needs to be larger than FG. Since FG is a force proportional to the relaxation elastic term of the polymer, it varies depending on the type of polyamide used. FD is a force governed by the surfactant used. Since FD varies depending on the type of surfactant, some surfactants may be ineffective depending on the type of polyamide.

かかる界面活性剤の選択は、界面活性剤のHLB(親水
性−疎水性バランス)、ゼータ電位、界面活性剤の立体
障害による影響、用いるポリアミド樹脂の界面張力等を
考慮して決定される。
The selection of such a surfactant is determined in consideration of the HLB (hydrophilic-hydrophobic balance) of the surfactant, zeta potential, influence of steric hindrance of the surfactant, interfacial tension of the polyamide resin used, etc.

なお、陰イオン性界面活性剤の添加量は使用する陰イオ
ン性界面活性剤の種類によって適宜決定することができ
る。界面活性剤が最少量で最大の効果を発揮する濃度、
即ち臨界ミセル濃度(CMC)は温度、界面活性剤の種
類、分散媒体によって異なることは衆知の通りである。
The amount of anionic surfactant to be added can be appropriately determined depending on the type of anionic surfactant used. The concentration at which the surfactant exhibits the maximum effect with the minimum amount,
That is, it is well known that the critical micelle concentration (CMC) varies depending on the temperature, type of surfactant, and dispersion medium.

例えば、ラウリル硫酸ナトリウムのCMCは水溶液中で
は0.2〜0.5重量%である(N、C,Presto
n、J、CCo11oidChe、 52壱84頁(1
94B) ) 、しかしながら、本発明方法のように、
高温で用いる場合には、CMCは大きくなることが考え
られ、事実本発明方法ではラウリル硫酸ナトリウムを用
いるとポリアミド樹脂に対し0.5〜20重量%で最大
の効果を示した。
For example, the CMC of sodium lauryl sulfate is 0.2-0.5% by weight in aqueous solution (N, C, Presto
n, J, CCo11oidChe, 52 184 pages (1
94B)) However, as in the method of the present invention,
When used at high temperatures, it is thought that the CMC increases, and in fact, in the method of the present invention, when sodium lauryl sulfate was used, the maximum effect was shown at 0.5 to 20% by weight based on the polyamide resin.

また、疎水性基であるアルキル鎖がラウリル基より長く
なると、CMC上記値よりは減少し、短くなると増加す
ることは、界面活性剤の分野における常識である。一般
的に言えば、陰イオン性界面活性剤の添加量はポリアミ
ド樹脂100重量部に対し0.1〜40%程度とするこ
とができる。
Furthermore, it is common knowledge in the field of surfactants that when the alkyl chain, which is a hydrophobic group, is longer than the lauryl group, the CMC decreases from the above value, and when it becomes shorter, it increases. Generally speaking, the amount of anionic surfactant added can be about 0.1 to 40% based on 100 parts by weight of the polyamide resin.

ポリアミド樹脂と媒体化合物は、前記加熱条件下で十分
攪拌して混合分散せしめた後、ポリアミド樹脂の融点が
媒体化合物の融点もしくは軟化点より高い場合には、ポ
リアミド樹脂の融点以下でかつ媒体化合物の融点もしく
は軟化点以上の温度前記混合物をに冷却し、ポリアミド
樹脂を濾過等の分離操作を施すことによって、媒体化合
物から分離し、更に必要に応じ、水又は以下に示すよう
な低沸点有機化合物で洗浄して媒体化合物を実質的に完
全に除去することができる。ポリアミド樹脂と媒体化合
物との混合物をポリアミド樹脂の融点もしくは軟化点以
下に冷却し、前記一般式(I)で表わされる媒体化合物
を溶解し、ポリアミド樹脂を溶解又は膨潤しない水及び
低沸点有機化合物のうちから選ばれた1種もしくは2種
以上の化合物によって媒体化合物及び陰イオン性界面活
性剤を溶解除去することによってポリアミド樹脂微粒子
を分離することもできる。前記低沸点有機化合物として
は、例えば、メタノール、エタノール、アセトン等をあ
げることができる。水も好適に用いられ、又水で溶解除
去した後、低沸点有機化合物で洗浄することは差し支え
ない。得られた粒子は必要により常法に従って乾燥する
ことができる。
After the polyamide resin and the medium compound are thoroughly mixed and dispersed under the heating conditions described above, if the melting point of the polyamide resin is higher than the melting point or softening point of the medium compound, the melting point of the polyamide resin and the medium compound are lower than the melting point of the polyamide resin and The mixture is cooled to a temperature above the melting point or softening point, and the polyamide resin is separated from the medium compound by a separation operation such as filtration, and if necessary, it is further treated with water or a low boiling point organic compound as shown below. Washing can substantially completely remove media compounds. The mixture of the polyamide resin and the medium compound is cooled to below the melting point or softening point of the polyamide resin, the medium compound represented by the general formula (I) is dissolved, and water and low-boiling organic compounds that do not dissolve or swell the polyamide resin are dissolved. The polyamide resin fine particles can also be separated by dissolving and removing the medium compound and the anionic surfactant using one or more selected compounds. Examples of the low-boiling organic compound include methanol, ethanol, acetone, and the like. Water is also suitably used, and after dissolving and removing with water, washing with a low-boiling organic compound may be carried out. The obtained particles can be dried according to a conventional method if necessary.

本発明方法に従えば、更に、前記ポリアミド樹脂に無機
充填剤を配合し、これと前記一般式(1)の媒体化合物
を前述の如く処理して実質上球形のポリアミド樹脂複合
材の微粒子を製造することができる。
According to the method of the present invention, an inorganic filler is further blended with the polyamide resin, and this and the medium compound of the general formula (1) are treated as described above to produce substantially spherical polyamide resin composite fine particles. can do.

かかる目的で使用される無機充填剤としては任意の無機
充填剤を配合することができ、表面処理を施したもので
もよい。そのような無機充填剤の具体例としては、シリ
カ、アルミナ、シリカアルミナ、酸化鉄、酸化クロム、
酸化チタンなどの金属酸化物、タルク、炭酸カルシウム
、カーボンブランク、金属粉(例えば鉄、アルミニウム
など)、金属硫化物、粘土類(カオリナイト、ゼオライ
ト、ベントナイト等)、ガラスピーズなどをあげること
ができる。使用する無機充填剤の粒径や形状には特に限
定はないが゛、その粒子径は製造しようとするポリアミ
ド樹脂複合材の目的粒子径の1/lO以下であるのが好
ましく、1150以下であるのが特に好ましい。上記無
機充填剤は単独又は2種以上の混合物として使用するこ
とができ、更にアゾ染料、ベンガラ、フタロシアニン系
などの有機染料を併用することもできる。
Any inorganic filler can be blended as the inorganic filler used for this purpose, and one that has been surface-treated may be used. Specific examples of such inorganic fillers include silica, alumina, silica alumina, iron oxide, chromium oxide,
Examples include metal oxides such as titanium oxide, talc, calcium carbonate, carbon blank, metal powders (e.g. iron, aluminum, etc.), metal sulfides, clays (kaolinite, zeolite, bentonite, etc.), glass peas, etc. . There are no particular limitations on the particle size or shape of the inorganic filler used, but the particle size is preferably 1/1O or less of the target particle size of the polyamide resin composite to be manufactured, and is 1150 or less. is particularly preferred. The above-mentioned inorganic fillers can be used alone or as a mixture of two or more, and organic dyes such as azo dyes, red iron oxides, and phthalocyanine-based dyes can also be used in combination.

本発明方法に従って無機充填剤を含む複合材を製造する
場合にはポリアミド樹脂と無機充填剤とを予め混合して
おくことが望ましい。両者の混合比は所望ポリアミド樹
脂複合材の用途に応じて適宜選定することができるが、
無機充填剤の配合量は一般にポリアミド樹脂100重量
部に対し70重量部以下、好ましくは0.5〜50重量
部の範囲である。
When producing a composite material containing an inorganic filler according to the method of the present invention, it is desirable to mix the polyamide resin and the inorganic filler in advance. The mixing ratio of both can be appropriately selected depending on the desired use of the polyamide resin composite material, but
The amount of the inorganic filler blended is generally 70 parts by weight or less, preferably in the range of 0.5 to 50 parts by weight, based on 100 parts by weight of the polyamide resin.

この様にして製造した実質上球形のポリアミド樹脂の微
粒子は、種々の方法による粉末塗装用塗料、摺動部用固
体潤漬剤、クロマトグラフィ用カラム担体、酵素担持用
担体などの担体、化粧品用ベース等に好適に使用するこ
とができる。
Substantially spherical polyamide resin fine particles produced in this manner can be used as powder coating paints, solid lubricants for sliding parts, column carriers for chromatography, carriers such as enzyme carriers, and bases for cosmetics. It can be suitably used for.

裏1匠 以下、本発明を実施例に従って更に詳しく説明するが、
本発明の範囲をこれらの実施例に限定するものでないこ
とはいうまでもない。
Below, the present invention will be explained in more detail according to examples.
It goes without saying that the scope of the present invention is not limited to these Examples.

実施例1 攪拌機を備えた11フラスコ中に、ナイロン−1230
g、ポリエチレングリコール(分子量20.000)7
0g及びラウリル硫酸ナトリウム1.5gを窒素雰囲気
下で混合し、240℃で60分間11000rpで攪拌
した。所定時間経過後混合物を濾過装置内に移し170
℃で窒素圧7 kg/−をかけてポリエチレングリコー
ルを濾過して除去し、その後温度を50℃に下げ、水、
メタノールで洗浄し、ナイロン−12の球形微粒子を得
た。得られたポリアミド微粒子の粒度分布は第1図に示
す通りであった。
Example 1 In a 11 flask equipped with a stirrer, nylon-1230
g, polyethylene glycol (molecular weight 20.000) 7
0 g and 1.5 g of sodium lauryl sulfate were mixed under nitrogen atmosphere and stirred at 240°C for 60 minutes at 11000 rpm. After a predetermined period of time, the mixture is transferred into a filtration device 170
℃ to remove polyethylene glycol by filtration under nitrogen pressure of 7 kg/-, then lower the temperature to 50℃, water,
After washing with methanol, spherical fine particles of nylon-12 were obtained. The particle size distribution of the obtained polyamide fine particles was as shown in FIG.

実施例2 ゛ラウリル硫酸の添加量を0.3gにした以外は実施例
1と同様にして球状のポリアミド樹脂粒子を得た。得ら
れた粒子の粒度分布は第1図に示す通りであった。
Example 2 Spherical polyamide resin particles were obtained in the same manner as in Example 1 except that the amount of lauryl sulfate added was 0.3 g. The particle size distribution of the obtained particles was as shown in FIG.

比較例1 ラウリル硫酸ナトリウムを使用しなかった以外は実施例
1と同様にして球状のポリアミド樹脂粒子を得た。得ら
れた粒度分布は第1図に示す通りであった。
Comparative Example 1 Spherical polyamide resin particles were obtained in the same manner as in Example 1 except that sodium lauryl sulfate was not used. The particle size distribution obtained was as shown in FIG.

実施例3 ナイロン12をナイロン6に変えた以外は実施例1と同
様にして球状のポリアミド樹脂粒子を得た得られた粒度
分布は第2図に示す通りであった。
Example 3 Spherical polyamide resin particles were obtained in the same manner as in Example 1 except that nylon 6 was used instead of nylon 12. The particle size distribution obtained was as shown in FIG.

比較例2 ラウリル硫酸ナトリウムを使用しなかった以外は実施例
3と同様にして球状のポリアミド樹脂粒子を得た。得ら
れた粒子の粒度分布は第2図に示す通りであった。
Comparative Example 2 Spherical polyamide resin particles were obtained in the same manner as in Example 3 except that sodium lauryl sulfate was not used. The particle size distribution of the obtained particles was as shown in FIG.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は実施例1及び2並びに比較例1において得られ
たポリアミド粒子の粒度分布を示すグラフ図である。第
2図は実施例3及び比較例2において得られたポリアミ
ド粒子の粒度分布を示すグラフ図である。 特許出願人 昭和電工株式会社 特許出願代理人 弁理士 青 木 朗 弁理士西舘和之 弁理士 石 1) 敬 弁理士山口昭之 弁理士西山雅也
FIG. 1 is a graph showing the particle size distribution of polyamide particles obtained in Examples 1 and 2 and Comparative Example 1. FIG. 2 is a graph showing the particle size distribution of polyamide particles obtained in Example 3 and Comparative Example 2. Patent Applicant: Showa Denko Co., Ltd. Patent Application Agent: Akira Aoki, Patent Attorney: Kazuyuki Nishidate, Patent Attorney: Ishi 1) Patent Attorney: Akiyuki Yamaguchi, Patent Attorney: Masaya Nishiyama

Claims (1)

【特許請求の範囲】 1、一般式(1) (式中、R及びR′はそれぞれ独立に水素原子又は炭素
数1〜12の直鎮状もしくは分岐鎮状アルキル基、R”
は水素原子又はメチルもしくはエチル基、nは20以上
の数である)で表わされる化合物を媒体化合物として用
い、この媒体化合物とポリアミド樹脂とを混合し、更に
陰イオン性界面活性剤のうちから選ばれた少なくとも1
種の化合物を添加してポリアミド樹脂及び媒体化合物の
融点又は軟化点以上の温度で混合分散せしめた後、ポリ
アミド樹脂を分離することを特徴とする粒径分布の狭い
球状ポリアミド樹脂微粒子の製造方法。
[Claims] 1. General formula (1) (wherein R and R' are each independently a hydrogen atom or a straight or branched alkyl group having 1 to 12 carbon atoms, R''
is a hydrogen atom or a methyl or ethyl group, and n is a number of 20 or more) is used as a medium compound, this medium compound and a polyamide resin are mixed, and an anionic surfactant selected from among at least 1
A method for producing fine spherical polyamide resin particles with a narrow particle size distribution, which comprises adding a seed compound, mixing and dispersing the polyamide resin and a medium compound at a temperature higher than the melting point or softening point, and then separating the polyamide resin.
JP5235684A 1984-03-21 1984-03-21 Preparation of polyamide resin particles Pending JPS60197734A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5235684A JPS60197734A (en) 1984-03-21 1984-03-21 Preparation of polyamide resin particles

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5235684A JPS60197734A (en) 1984-03-21 1984-03-21 Preparation of polyamide resin particles

Publications (1)

Publication Number Publication Date
JPS60197734A true JPS60197734A (en) 1985-10-07

Family

ID=12912528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5235684A Pending JPS60197734A (en) 1984-03-21 1984-03-21 Preparation of polyamide resin particles

Country Status (1)

Country Link
JP (1) JPS60197734A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007246718A (en) * 2006-03-16 2007-09-27 Sumitomo Seika Chem Co Ltd Method for producing spherical thermoplastic resin particle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007246718A (en) * 2006-03-16 2007-09-27 Sumitomo Seika Chem Co Ltd Method for producing spherical thermoplastic resin particle

Similar Documents

Publication Publication Date Title
US4254207A (en) Process for producing spherical particles or crystalline polymers
JP5753345B2 (en) Fluorescent solid ink produced using fluorescent nanoparticles
JP4746628B2 (en) Method for preparing encapsulated granular solid
DE69007385T2 (en) Anthraquinone copolyester dye concentrates.
KR100449197B1 (en) Pigment dispersant
DE69735499T2 (en) Dispersant
US4102846A (en) Stable dispersions of polymer particles containing sub-particles of a solid modifying agent and process for making same
JP4642166B2 (en) Products obtained by salt formation from polyamines and their use as dispersants for pigments and extenders
US4694063A (en) Anhydrous process for the manufacture of polyamide powder from lactam in the presence of N,N'-alkylene bis amide
RU2358996C2 (en) Method of producing particles based on thermoplastic polymer and powder, produced using this method
US6127513A (en) Spherical polyamide and process for preparing the same
JP2011224562A (en) Dispersant
TWI398296B (en) Process for preparing an encapsulated particulate solid
EP1697030A1 (en) Process for encapsulating solid particulates
US2776267A (en) Spherical pigments and method of preparing same
EP1697470B1 (en) A process for preparing modified particulate solid materials and inks comprising the same
JPS62295966A (en) Surface modifying pigment composition
US4267310A (en) Process for producing spherical particles of crystalline polymers
JPS61221273A (en) Production of powdery coating agent based on polyamide having at least 10 aliphatic bonded carbon atoms per one carbonamide group
JPS60197734A (en) Preparation of polyamide resin particles
CA2253868A1 (en) Solvent resistant non-formaldehyde thermoset fluorescent pigment
JPS6040134A (en) Preparation of fine particle of polyamide resin
DE1520643B2 (en) PROCESS FOR MANUFACTURING A CONDENSATION POLYMER OF THE CLASS CONSISTING OF POLYESTERS AND POLYAMIDES INCLUDING X POLYCARBAMIDES
JP3786727B2 (en) Pigment composition of modified diketopyrrolopyrrole and aminoalkyl acrylate resin
JPS61221274A (en) Production of condensible polymer coating material based on polyamiide by precipitation method