JPS6019664B2 - semiconductor equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device (hereinafter referred to as a plug-in type package) in which input/output signal leads, power supply and grounding leads are attached perpendicularly to one surface of a package housing a semiconductor circuit. By making holes electrically connected to each lead on the side without IJ, cooling fins,
It also relates to a semiconductor device in which terminals for input/output signal observation or connection, or other electronic circuit components can be inserted or removed as desired.

A conventional plug-in type package is shown in FIG.

In FIGS. 1a and 1b, 1 is a package forming the base of a semiconductor device, 2 is an input/output signal input/output signal lead, a power source and a ground lead, and 3 is a printed wiring board on which the semiconductor device is mounted. Accordingly, since the semiconductor device is directly attached to the printed wiring board 3 and the gap between the semiconductor device and the printed wiring board is narrow, in terms of cooling, natural convection or forced convection is effective because the surface of the semiconductor device facing the printed wiring board This has the drawback that the semiconductor device does not contribute to cooling, making it difficult to cool the semiconductor device, and it is also extremely difficult to connect input and output signals to the semiconductor device. In order to improve the above-mentioned drawback, there was a semiconductor device in which the lead 2b was extended to penetrate the package as shown in Figure 1c, but this semiconductor device did not require a lead higher than the package. However, when printed wiring boards mounted with such semiconductor devices are stacked and attached to another printed wiring board, there is a drawback that a wide gap must be provided between the printed wiring boards. This invention was made in order to eliminate such drawbacks, and it is designed to provide input/output signal leads, power supply leads, etc. so that terminals of arbitrary shapes, lengths, and materials can be inserted and removed. The present invention also provides a semiconductor device in which holes electrically connected to each of the grounding leads are provided on a surface without leads.

An embodiment of the present invention will be described in detail below based on the drawings. FIGS. 2a and 2b are diagrams showing one embodiment of such a semiconductor device, and 1, 2a, and 3 are the same as those shown in FIG. The difference between FIG. 2 and FIG. 1 is the hole 4 in FIG. 2b. This hole is electrically connected to each lead, and the inside of the hole is also covered with a conductor. With such a structure, the things shown in FIGS. 3a and 3b are possible. 1, 2a, 3, and 4 in FIGS. 3a and 3b are the same as those in FIG. 2. Figure 3a shows that cooling fins such as 5 can be easily installed by inserting them into holes 4 for cooling. At this time, if the cooling fin is not fixed in the hole 4, it can be replaced with another cooling fin as desired. In addition, in FIG. 3b, when you want to temporarily observe the input/output signals of a semiconductor device,
Observations can be made easier by inserting a terminal of any length, such as a terminal, and can be removed once the observation is completed. In such a case, 7
This is possible by inserting a terminal that allows easy signal connection into the hole 4 and fixing it. In the above embodiment, the package 1 forming the base of the semiconductor device is square, and the input/output signal leads, power supply and grounding leads 2a are
The total number of leads is 2 dollars, and the arrangement of the leads is as shown in Figure 2 a, but these can have various shapes, numbers, and arrangements, and are limited to this example. isn't it. In addition, the IJ installed in the package
- The correspondence between the door 2a and the hole 4 is not limited to one-to-one. Furthermore, the objects that can be inserted into the holes 4 are not limited to cooling fins of a specific shape and material and input/output signal observation and connection terminals, but can be of any shape and material, and may be any electronic circuit component. But it's okay. As described above, in the semiconductor device according to the present invention, holes electrically connected to the input/output signal leads, power supply and grounding leads are provided on the surface opposite to the surface to which these leads are attached. By providing this, there is an advantage that any cooling fin can be easily attached and removed, and any input/output signal observation and connection terminals and other electronic circuit parts can be easily attached and removed.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a conventional plug-in type package, in which FIG. FIG. c is a side view of an improved version of FIG. 1b, FIG. 2 is a diagram showing an embodiment of the semiconductor device according to the present invention, and FIG.
is a plan view, and FIG. 2b is a side view. FIG. 3 is a diagram showing an application example of the semiconductor device according to the present invention, FIG. 3a is a diagram with cooling fins attached, and FIG. 3b is a diagram with an input/output signal observation terminal and an input/output signal connection terminal attached. It is a diagram. In the figure, 1' is a package, 2a and 2b are leads for input/output signals, IJ-boards for power supply and grounding, 3 is a printed wiring board, and 4 is a feature of the semiconductor device according to the present invention. 5 is a cooling fin, 6 is a terminal for observing input/output signals, and 7 is a terminal for connecting input/output signals. Note that the same or corresponding parts in the figure are the same. It is shown with a code.Yo1 NadaYoZ PrisonerYo3Kyo

Claims (1)

[Claims] 1 The input/output signal leads, power supply and grounding leads are
In a semiconductor device mounted vertically on one side of a package housing a semiconductor circuit, the holes electrically connected to the input/output signal leads, power supply and grounding leads are connected to the side of the package without leads. A semiconductor device characterized by being provided in.