JPS60195957U - Engine intake air temperature automatic adjustment device - Google Patents

Engine intake air temperature automatic adjustment device

Info

Publication number
JPS60195957U
JPS60195957U JP8292584U JP8292584U JPS60195957U JP S60195957 U JPS60195957 U JP S60195957U JP 8292584 U JP8292584 U JP 8292584U JP 8292584 U JP8292584 U JP 8292584U JP S60195957 U JPS60195957 U JP S60195957U
Authority
JP
Japan
Prior art keywords
adjustment device
air temperature
intake air
automatic adjustment
engine intake
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8292584U
Other languages
Japanese (ja)
Other versions
JPH0117644Y2 (en
Inventor
杢屋　博一
Original Assignee
スズキ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スズキ株式会社 filed Critical スズキ株式会社
Priority to JP8292584U priority Critical patent/JPS60195957U/en
Publication of JPS60195957U publication Critical patent/JPS60195957U/en
Application granted granted Critical
Publication of JPH0117644Y2 publication Critical patent/JPH0117644Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Temperature-Responsive Valves (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はエイシン吸入空気温度自動調整装置の構成を示
す縦断−面図、第２図はこの考案装置の実施例を示すサ
ーモワックスシリンダ装置の側面図、第３図は同上正面
図、第４図はこの考案の他の実施例を示すサーモワック
スシリンダ装置の側面図、第５図は同上正面図である。 ２・・・吸入通路、２ａ・・・通路壁、３・・・暖気供
給通路１．４・・・冷気供給通路、５・・・切換バルブ
、６・・・サーモワックスシリンダ装置、１２・・・感
熱板。Fig. 1 is a vertical cross-sectional view showing the structure of the Eisin intake air temperature automatic adjustment device, Fig. 2 is a side view of a thermowax cylinder device showing an embodiment of this devised device, Fig. 3 is a front view of the same, and Fig. 4 The figure is a side view of a thermowax cylinder device showing another embodiment of this invention, and FIG. 5 is a front view of the same. 2... Suction passage, 2a... Passage wall, 3... Hot air supply passage 1.4... Cold air supply passage, 5... Switching valve, 6... Thermowax cylinder device, 12...・Heat-sensitive plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キャブレタ上流の吸入通路に暖気供給通路と冷気供給通
路とを切換バルブを介して接続し、この切換バルブを吸
入通路に設置したす」モワックスシリツダ装置によって
制御するようにすると共にサーモワックスシリンダ装置
の感熱部に感熱板を延設し、この感熱板を吸入通路壁に
密着あるいは通路壁を貫通して外気に晒すようにしたこ
とを特徴とするエンジンの吸入空気温度自動調整装置。The hot air supply passage and the cold air supply passage are connected to the intake passage upstream of the carburetor via a switching valve, and this switching valve is installed in the intake passage. An automatic intake air temperature adjustment device for an engine, characterized in that a heat-sensitive plate is extended to the heat-sensitive part of the engine, and the heat-sensitive plate is exposed to the outside air by closely contacting the wall of the intake passage or penetrating the wall of the passage.
JP8292584U 1984-06-06 1984-06-06 Engine intake air temperature automatic adjustment device Granted JPS60195957U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8292584U JPS60195957U (en) 1984-06-06 1984-06-06 Engine intake air temperature automatic adjustment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8292584U JPS60195957U (en) 1984-06-06 1984-06-06 Engine intake air temperature automatic adjustment device

Publications (2)

Publication Number Publication Date
JPS60195957U true JPS60195957U (en) 1985-12-27
JPH0117644Y2 JPH0117644Y2 (en) 1989-05-23

Family

ID=30631085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8292584U Granted JPS60195957U (en) 1984-06-06 1984-06-06 Engine intake air temperature automatic adjustment device

Country Status (1)

Country Link
JP (1) JPS60195957U (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9275939B1 (en) 2011-01-27 2016-03-01 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9362210B2 (en) 2000-04-27 2016-06-07 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9224676B1 (en) 1998-06-24 2015-12-29 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8963301B1 (en) 1998-06-24 2015-02-24 Amkor Technology, Inc. Integrated circuit package and method of making the same
US9362210B2 (en) 2000-04-27 2016-06-07 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US9406645B1 (en) 2002-11-08 2016-08-02 Amkor Technology, Inc. Wafer level package and fabrication method
US8952522B1 (en) 2002-11-08 2015-02-10 Amkor Technology, Inc. Wafer level package and fabrication method
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9275939B1 (en) 2011-01-27 2016-03-01 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9508631B1 (en) 2011-01-27 2016-11-29 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9431323B1 (en) 2011-11-29 2016-08-30 Amkor Technology, Inc. Conductive pad on protruding through electrode
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9543235B2 (en) 2013-10-24 2017-01-10 Amkor Technology, Inc. Semiconductor package and method therefor

Also Published As

Publication number Publication date
JPH0117644Y2 (en) 1989-05-23

Similar Documents

Publication Publication Date Title
JPS60195957U (en) Engine intake air temperature automatic adjustment device
JPS5829148U (en) vaporizer cooling system
JPS60162254U (en) Engine carburetor and intake chamber connection device
JPS58102765U (en) Internal combustion engine intake air heating device
JPS60195931U (en) Diesel engine intake system
JPS58156158U (en) Air heater device for internal combustion engine
JPS5882473U (en) engine intake system
JPS6143966U (en) Air heater device
JPS58119033U (en) Outdoor combustor
JPS58151325U (en) Engine air-fuel ratio sensor - protection device
JPS616645U (en) Air cleaner intake adjustment device
JPH0452542U (en)
JPS589938U (en) Intake control device for diesel engine
JPS5832121U (en) Reed valve of secondary air supply device
JPS6121814U (en) Engine exhaust system cooling system
JPS59111922U (en) Air intake system cooling system for supercharged engines
JPS5882463U (en) Installation structure of carburetor for internal combustion engine
JPS5864852U (en) Internal combustion engine intake air heating device
JPS58172019U (en) Engine temperature sensor - mounting device
JPS59117851U (en) Carburetor first idle device
JPS5960379U (en) air cleaner
JPS58154814U (en) Secondary air heating device for internal combustion engine
JPS59148464U (en) Engine cold start device
JPS60112636U (en) Internal combustion engine intake system
JPS5891070U (en) Reed valve device