JPS6019340B2 - thermoplastic resin composition - Google Patents
thermoplastic resin compositionInfo
- Publication number
- JPS6019340B2 JPS6019340B2 JP51065236A JP6523676A JPS6019340B2 JP S6019340 B2 JPS6019340 B2 JP S6019340B2 JP 51065236 A JP51065236 A JP 51065236A JP 6523676 A JP6523676 A JP 6523676A JP S6019340 B2 JPS6019340 B2 JP S6019340B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- thermoplastic resin
- parts
- resin composition
- hydroxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims description 9
- 239000011342 resin composition Substances 0.000 title claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000000732 arylene group Chemical group 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 239000002253 acid Substances 0.000 description 25
- -1 2,2',4-trihydroxy-3,5,5'-trimethylbenzophenone Chemical compound 0.000 description 15
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 12
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- 150000007513 acids Chemical class 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 239000006096 absorbing agent Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 4
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229960001755 resorcinol Drugs 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- LDWPBRGCKKYGHR-UHFFFAOYSA-N (4-benzoyl-3-hydroxyphenyl) acetate Chemical compound OC1=CC(OC(=O)C)=CC=C1C(=O)C1=CC=CC=C1 LDWPBRGCKKYGHR-UHFFFAOYSA-N 0.000 description 2
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- ONLMUMPTRGEPCH-UHFFFAOYSA-N Hentriacontanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O ONLMUMPTRGEPCH-UHFFFAOYSA-N 0.000 description 2
- QCNWZROVPSVEJA-UHFFFAOYSA-N Heptadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCC(O)=O QCNWZROVPSVEJA-UHFFFAOYSA-N 0.000 description 2
- LRKATBAZQAWAGV-UHFFFAOYSA-N Hexatriacontylic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O LRKATBAZQAWAGV-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 235000021314 Palmitic acid Nutrition 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- QXGVRGZJILVMDF-UHFFFAOYSA-N Tetracosanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCCCC(O)=O QXGVRGZJILVMDF-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 2
- 150000001266 acyl halides Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- DGXRZJSPDXZJFG-UHFFFAOYSA-N docosanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCC(O)=O DGXRZJSPDXZJFG-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 2
- HMSWAIKSFDFLKN-UHFFFAOYSA-N hexacosane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCC HMSWAIKSFDFLKN-UHFFFAOYSA-N 0.000 description 2
- XMHIUKTWLZUKEX-UHFFFAOYSA-N hexacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O XMHIUKTWLZUKEX-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- IHEJEKZAKSNRLY-UHFFFAOYSA-N nonacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O IHEJEKZAKSNRLY-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- BNJOQKFENDDGSC-UHFFFAOYSA-N octadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCC(O)=O BNJOQKFENDDGSC-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- MWMPEAHGUXCSMY-UHFFFAOYSA-N pentacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCC(O)=O MWMPEAHGUXCSMY-UHFFFAOYSA-N 0.000 description 2
- 238000001782 photodegradation Methods 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 2
- QJXPRGZXRIIGOP-UHFFFAOYSA-N tricosanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCCC(O)=O QJXPRGZXRIIGOP-UHFFFAOYSA-N 0.000 description 2
- XEZVDURJDFGERA-UHFFFAOYSA-N tricosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCC(O)=O XEZVDURJDFGERA-UHFFFAOYSA-N 0.000 description 2
- IIYFAKIEWZDVMP-UHFFFAOYSA-N tridecane Chemical compound CCCCCCCCCCCCC IIYFAKIEWZDVMP-UHFFFAOYSA-N 0.000 description 2
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- FRPZMMHWLSIFAZ-UHFFFAOYSA-N 10-undecenoic acid Chemical compound OC(=O)CCCCCCCCC=C FRPZMMHWLSIFAZ-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- HJGHNYYPROKZGW-UHFFFAOYSA-N 3,6-dimethylphthalic acid Chemical compound CC1=CC=C(C)C(C(O)=O)=C1C(O)=O HJGHNYYPROKZGW-UHFFFAOYSA-N 0.000 description 1
- VTDMBRAUHKUOON-UHFFFAOYSA-N 4-[(4-carboxyphenyl)methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C=C1 VTDMBRAUHKUOON-UHFFFAOYSA-N 0.000 description 1
- VAXBLYWAVAIJJJ-UHFFFAOYSA-N 4-[2-(4-carboxyphenoxy)ethoxy]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OCCOC1=CC=C(C(O)=O)C=C1 VAXBLYWAVAIJJJ-UHFFFAOYSA-N 0.000 description 1
- AWQSAIIDOMEEOD-UHFFFAOYSA-N 5,5-Dimethyl-4-(3-oxobutyl)dihydro-2(3H)-furanone Chemical compound CC(=O)CCC1CC(=O)OC1(C)C AWQSAIIDOMEEOD-UHFFFAOYSA-N 0.000 description 1
- DFGKGUXTPFWHIX-UHFFFAOYSA-N 6-[2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]acetyl]-3H-1,3-benzoxazol-2-one Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)C1=CC2=C(NC(O2)=O)C=C1 DFGKGUXTPFWHIX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- PWLXTFFHCFWCGG-UHFFFAOYSA-N Heneicosanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCC(O)=O PWLXTFFHCFWCGG-UHFFFAOYSA-N 0.000 description 1
- PLPABYLKGGTKBQ-UHFFFAOYSA-N Hexatetracontanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O PLPABYLKGGTKBQ-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920000577 Nylon 6/66 Polymers 0.000 description 1
- AJQRZOBUACOSBG-UHFFFAOYSA-N Octatriacontanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O AJQRZOBUACOSBG-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- JADFUOUIMWDTFX-UHFFFAOYSA-N Triacontanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O JADFUOUIMWDTFX-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229960002255 azelaic acid Drugs 0.000 description 1
- TZYHIGCKINZLPD-UHFFFAOYSA-N azepan-2-one;hexane-1,6-diamine;hexanedioic acid Chemical compound NCCCCCCN.O=C1CCCCCN1.OC(=O)CCCCC(O)=O TZYHIGCKINZLPD-UHFFFAOYSA-N 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- YWJUZWOHLHBWQY-UHFFFAOYSA-N decanedioic acid;hexane-1,6-diamine Chemical compound NCCCCCCN.OC(=O)CCCCCCCCC(O)=O YWJUZWOHLHBWQY-UHFFFAOYSA-N 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- HCPOCMMGKBZWSJ-UHFFFAOYSA-N ethyl 3-hydrazinyl-3-oxopropanoate Chemical compound CCOC(=O)CC(=O)NN HCPOCMMGKBZWSJ-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 244000144992 flock Species 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000010102 injection blow moulding Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- DFFZOPXDTCDZDP-UHFFFAOYSA-N naphthalene-1,5-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1C(O)=O DFFZOPXDTCDZDP-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- DBLXKSQAPLLLDB-UHFFFAOYSA-N phenyl-(4,6,6-trihydroxycyclohexa-2,4-dien-1-yl)methanone Chemical compound C1=CC(O)=CC(O)(O)C1C(=O)C1=CC=CC=C1 DBLXKSQAPLLLDB-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229960005137 succinic acid Drugs 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- DXUKAYJJWAWCLA-UHFFFAOYSA-N tetratriacontanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O DXUKAYJJWAWCLA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
【発明の詳細な説明】
本発明は、高分子成形品の耐光性改良に適した紫外線吸
収剤を含有してなる熱可塑性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermoplastic resin composition containing an ultraviolet absorber suitable for improving the light resistance of polymer molded articles.
本発明は特に高温の成形工程を経て製造される高分子成
形品や繊維、フィルムなど容積に比し表面積の大きい成
形品の耐光性改良に特に適した紫外線吸収剤に関する。
一般に高分子材料は光により劣化する傾向を有し、例え
ば長期間屋外で使用した場合縦化現象を生じたり着色し
たりなどする欠点を有しその有用性が阻害されている。The present invention relates to an ultraviolet absorber particularly suitable for improving the light resistance of molded products having a large surface area relative to their volume, such as polymer molded products, fibers, and films manufactured through high-temperature molding processes.
In general, polymeric materials tend to be degraded by light, and for example, when used outdoors for a long period of time, they have drawbacks such as verticalization and discoloration, which hinders their usefulness.
このため従来例えば0−ヒドロキシベンゾフエノン、2
一(2′ーヒドロキシフェニル)ペンゾトリアゾールな
どの紫外線吸収剤を重合体に少量配合し耐光性を改良す
ることが行なわれてきた。しかしながら従釆多用されて
いるこれら紫外線吸収剤の大きな欠点はその健敵性にあ
る。即ち、紫外線吸収剤を配合した重合体組成物は押出
成形、射出成形、ブロー成形などの成形工程、さらには
延伸、熱処理などの工程を経て所望の形状の成形品にな
されるが、一般にこれらの工程で重合体組成物は120
〜300qoという高温の加熱処理をうけるため添加さ
れた紫外線吸収剤の相当量が揮発脱離し耐光性改良に有
効に作用しないという結果をもたらす。さらに揮発脱離
した紫外線吸収剤は衛生上の観点から排気除去する必要
がある。またこのような紫外線吸収剤を添加した重合体
の成形品を例えば屋外で長期間使用する場合には該添加
剤が経時的に徐々に成形品の表面に移行し脱離すること
により耐光性の低下を招くことも欠点の一つである。本
発明者らはこれらの欠点を改良すべく種々研究を重ねた
結果本発明の紫外線吸収剤含有熱可塑性樹脂組成物がす
ぐれた耐光性を有し上記の欠点が改良される事を見出し
た。For this reason, conventionally, for example, 0-hydroxybenzophenone, 2
It has been attempted to incorporate small amounts of ultraviolet absorbers such as 1(2'-hydroxyphenyl)penzotriazole into polymers to improve light resistance. However, a major drawback of these commonly used ultraviolet absorbers is their compatibility. In other words, a polymer composition containing an ultraviolet absorber is formed into a molded product in a desired shape through a molding process such as extrusion molding, injection molding, and blow molding, as well as through processes such as stretching and heat treatment. In the process the polymer composition is 120
Since it is subjected to heat treatment at a high temperature of ~300 qo, a considerable amount of the added ultraviolet absorber is volatilized and desorbed, resulting in that it does not effectively improve light resistance. Furthermore, the UV absorber that has been volatilized and desorbed needs to be removed by exhaust air from a hygienic point of view. In addition, when a molded product made of a polymer to which such a UV absorber has been added is used outdoors for a long period of time, the additive gradually migrates to the surface of the molded product and desorbs over time, resulting in a decrease in light resistance. One of the disadvantages is that it causes a decline. The present inventors have conducted various studies to improve these drawbacks, and as a result, they have found that the ultraviolet absorber-containing thermoplastic resin composition of the present invention has excellent light resistance and can improve the above-mentioned drawbacks.
即ち本発明は下式(1)又は(0)の一般式で示される
化合物からなる紫外線吸収剤を含有してなる熱可塑性樹
脂組成物、に関する。That is, the present invention relates to a thermoplastic resin composition containing an ultraviolet absorber made of a compound represented by the general formula (1) or (0) below.
R,:ヒドロキシ基
1,m:0または1の数であるが共に0になることはな
い。R: hydroxy group 1, m: number of 0 or 1, but both cannot be 0.
R2,R3:ハロゲン、アルキル基またはアルコキシ基
から選ばれたもの、同一又は異なってもよい。R2, R3: selected from halogen, alkyl group or alkoxy group, which may be the same or different.
n,p:0から3までの整数を表わす。n, p: Represents an integer from 0 to 3.
R4:アルキル、アリール、アルキレン、アリーレン基
のいずれかを表わす。R4: represents any one of alkyl, aryl, alkylene, and arylene group.
q:1又は2
上記の一般式で示される化合物は、例えば2コ以上のヒ
ドロキシ基を有するペンゾフヱノン誘導体又は2コのヒ
ドロキシ基を有するフェニル基で置換されたペンゾトリ
ァゾール誘導体と各種の−塩基酸又は二塩基酸、或はそ
れらのアシルハラィドとから常法により合成することが
できる。q: 1 or 2 The compound represented by the above general formula is, for example, a penzophenone derivative having two or more hydroxy groups or a penzotriazole derivative substituted with a phenyl group having two hydroxy groups, and various bases. It can be synthesized from acids, dibasic acids, or their acyl halides by conventional methods.
例えば上記ペンゾフェノン化合物と無水酢酸とを溶媒の
存在下環流加熱することにより得られるアセチル化物と
一塩基酸又は二塩基酸とを加熱融解し、脱酢酸反応を行
うことにより容易に合成される。又上記ペンゾフェノン
化合物をアルカリ溶液に漆しこれとアシルハラィドとを
激しく境拝し反応させることによっても容易に合成され
る。すなわち溶媒として水ーハロゲン化物等の組合せに
よる界面縮合反応によって合成される。ペンゾフェノン
譲導体及びペンゾトリアゾール誘導体の例としては、2
,4−ジヒドロキシベンゾフエノン、2,2,4−トリ
ヒドロキシベンゾフエノン、2,2′,4−トリヒドロ
キシ−3,5,5′−トリメチルベンゾフエノン、2,
4−ジヒドロキシ−3,5,5′ートリメトキシベンゾ
フエノン、2,2′,4−トリヒドロキシ−5,5′ー
ジクロロベンゾフエノン、6一(2日ーベンゾトリアゾ
ール−2−0イル)−レゾルシン、2一(5ークロロ−
2H−ペンゾトリアゾール−2ーイル)ーレゾルシン、
2,4ージメチル−6−(2H−ペンゾトリアゾールー
2−イル)−レゾルシン、2,4−ジメトキシ‐6−(
汎‐ペンゾトリァゾール−2‐ィル)−レゾルシンなど
があげられる。ペンゾフエノン誘導体においては少なく
とも1コのヒドロキシ基がカルボニル基に対してオルソ
位にあり、1コのヒドロキシ基がそれ以外の位置にある
ことが必要である。またペンゾトリアゾール誘導体にお
いて2コのヒドロキシ基の内1コは,2の位置の窒素原
子に対しオルソ位にあり他の1コはそれ以外の位置にあ
ることが必要である。本発明の紫外線吸収剤の製造にお
いて用いられる一塩基酸には例えば安息香酸、バラ、メ
タ又はJオルソメチル安息香酸、Q又はB−ナフトェ酸
、アントラセン−1−,一2一又は一9ーカルボン酸、
フェナントレンー1一,一2−,一3−又は一9ーカル
ポン酸等の芳香族一塩基酸とかC4以上の脂肪族一塩基
酸例えばカプロン酸、ヘプタンZ酸、カプリル酸、ベラ
ルゴン酸、カプリン酸、nーウンデシレン酸、ラウリン
酸、nートリデシレン酸、ミリスチン酸、n−ペンタデ
シレン酸、パルミチン酸、マーガリン酸、ステアリン酸
、nーノナデシレン酸、アラキジン酸、n−へンアイコ
2サン酸、べへニン酸、n−トリコサン酸、リグ/セリ
ン酸、n−ペンタコサン酸、セロチン酸、n−へプタコ
サン酸、モンタン酸、nーノナコサン酸、メリシン酸、
n−へントリアコンタン酸、nードトリアコンタン酸、
セロプラスチン酸、n一2へキサトリアコンタン酸、n
−オクタトリアコンタン酸、n−ヘキサテトラコンタン
酸、Qーフェニル酢酸等がある。For example, it can be easily synthesized by heating and melting an acetylated product obtained by heating the penzophenone compound and acetic anhydride under reflux in the presence of a solvent and a monobasic acid or dibasic acid to perform an acetic acid removal reaction. It can also be easily synthesized by lacquering the above penzophenone compound in an alkaline solution and vigorously mixing it with an acyl halide to cause a reaction. That is, it is synthesized by an interfacial condensation reaction using a combination of water and a halide as a solvent. Examples of penzophenone derivatives and penzotriazole derivatives include 2
, 4-dihydroxybenzophenone, 2,2,4-trihydroxybenzophenone, 2,2',4-trihydroxy-3,5,5'-trimethylbenzophenone, 2,
4-dihydroxy-3,5,5'-trimethoxybenzophenone, 2,2',4-trihydroxy-5,5'-dichlorobenzophenone, 6-(2-day-benzotriazol-2-0yl) )-resorcin, 2-(5-chloro-
2H-penzotriazol-2-yl)-resorcin,
2,4-dimethyl-6-(2H-penzotriazol-2-yl)-resorcin, 2,4-dimethoxy-6-(
Examples include pan-penzotriazol-2-yl)-resorcin. In the penzophenone derivative, it is necessary that at least one hydroxy group is located at the ortho position with respect to the carbonyl group, and one hydroxy group is located at a position other than that. In the penzotriazole derivative, one of the two hydroxy groups must be at the ortho position to the nitrogen atom at position 2, and the other one must be at the other position. Monobasic acids used in the production of the ultraviolet absorber of the present invention include, for example, benzoic acid, bara, meta or J-orthomethylbenzoic acid, Q or B-naphthoic acid, anthracene-1-, 121- or 19-carboxylic acid,
Aromatic monobasic acids such as phenanthrene-1-1, 12-, 13- or 19-carboxylic acid, or C4 or higher aliphatic monobasic acids such as caproic acid, heptanoic acid, caprylic acid, belargonic acid, capric acid, n-undecylenic acid, lauric acid, n-tridecylenic acid, myristic acid, n-pentadecylenic acid, palmitic acid, margaric acid, stearic acid, n-nonadecylenic acid, arachidic acid, n-heneicodisanoic acid, behenic acid, n- tricosanoic acid, lig/seric acid, n-pentacosanoic acid, cerotic acid, n-heptacanoic acid, montanic acid, n-nonacosanoic acid, melisic acid,
n-Hentriacontanoic acid, n-Hentriacontanoic acid,
Seroplastic acid, n-2 hexatriacontanoic acid, n
-octatriacontanoic acid, n-hexatetracontanoic acid, Q-phenylacetic acid, etc.
二塩基酸としては例えばテレフタール酸、ィソフタール
酸、2,2′−又は4,4一ジフェニルジカルボン酸、
2,6−,2,73−又は1,5−ナフタレンジカルポ
ン酸、1,2ービス(4ーカルボキシルフエノキシ)ヱ
タン、ビス(4一カルボキシルフェニル)メタン等の芳
香族二塩基酸とかC3以上の脂肪族二塩基醸すなわちプ
ロパン二酸、ブタン二酸、ベンタン二酸、3へキサン二
酸、ヘプタン二酸、オクタン二酸、ノナンニ酸、デカン
二酸、ウンデカン二酸、ドデカン二酸、トリデカン二酸
、テトラデカン二酸、ベンタデカン二酸、ヘキサデカン
酸、ヘプタデカン二酸、オクタデカン二酸、/ナデカン
二酸、アィ2コサン二酸、ヘンアィコサン二酸、ドコサ
ン二酸、トリコサン二酸、テトラコサン二酸、ヘキサコ
サン二酸、トリアコンタン二酸、テトラトリアコンタン
二酸、pーキシレンジカルボン酸等があげられる。本発
明の紫外線吸収剤は光劣化をおこす熱可塑性樹脂の耐光
性改良に効果的に使用される。Examples of dibasic acids include terephthalic acid, isophthalic acid, 2,2'- or 4,4-diphenyldicarboxylic acid,
Aromatic dibasic acids such as 2,6-, 2,73- or 1,5-naphthalene dicarboxylic acid, 1,2-bis(4-carboxylphenoxy)ethane, bis(4-carboxylphenyl)methane, or C3 The above aliphatic dibasic acids include propanedioic acid, butanedioic acid, betanedioic acid, trihexanedioic acid, heptanedioic acid, octanedioic acid, nonanedioic acid, decanedioic acid, undecanedioic acid, dodecanedioic acid, tridecane diacid, tetradecanedioic acid, bentadecanedioic acid, hexadecanoic acid, heptadecanedioic acid, octadecanedioic acid, /nadecanedioic acid, dicosanedioic acid, henicosanedioic acid, docosanedioic acid, tricosanedioic acid, tetracosanedioic acid, hexacosane Examples include diacid, triacontanedioic acid, tetratriacontanedioic acid, p-xylene dicarboxylic acid, and the like. The ultraviolet absorber of the present invention can be effectively used to improve the light resistance of thermoplastic resins that undergo photodeterioration.
熱可塑性樹脂の例としてはポリエチレン、ポリプロピレ
ン、エチレンノプロピレン共重合体などのポリオレフイ
ン、スチレンのホモ重合体及び共重合体、ブタジェン、
イソプレンなどから誘導されるホモ重合体及び共重合体
、塩化ビニル、塩化ビニリデン、アクリレートなどから
議導されるホモ重合体及び共重合体、ポリエチレンテレ
フタレート、ポリブチレンテレフタレート、ポリエチレ
ンテレフタレート/イソフタレート、ポリアルキレンナ
フタレートなどの飽和ポリエステル、及び通常の不飽和
ポリエステル、ナイロン6、ナイロン60ナイロン11
、ナイロン12、ナイロン6/10、ナイロン6/66
などの脂肪族ポリアミド、キシリレン基などを含有する
芳香族ポリアミド、ポリエステル・ポリエーテルフロツ
クポリマー、ポリアミド・ポリェーテルプロツクポリマ
ーなどがあげられるがこれに限定されるものではない。
また本発明の紫外線吸収剤を配合した熱可塑性樹脂組成
物を利用した成形品の形態に制限はないが、繊維、フィ
ルム、シート、塗膜、ボルトなどの中空容器、その他各
種のプラスチック成形物があげられる。Examples of thermoplastic resins include polyolefins such as polyethylene, polypropylene, and ethylenenopropylene copolymers, styrene homopolymers and copolymers, butadiene,
Homopolymers and copolymers derived from isoprene, etc., homopolymers and copolymers derived from vinyl chloride, vinylidene chloride, acrylate, etc., polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate/isophthalate, polyalkylene Saturated polyesters such as naphthalates, and regular unsaturated polyesters, nylon 6, nylon 60, nylon 11
, nylon 12, nylon 6/10, nylon 6/66
Examples include, but are not limited to, aliphatic polyamides such as, aromatic polyamides containing xylylene groups, polyester/polyether flock polymers, and polyamide/polyether block polymers.
In addition, there are no restrictions on the form of molded products using the thermoplastic resin composition containing the ultraviolet absorber of the present invention, but fibers, films, sheets, paint films, hollow containers such as bolts, and various other plastic molded products can be used. can give.
本発明の紫外線吸収剤が特に有効に利用されるのは、ポ
リプロピレン、ポリエステル、ポリアミドなどその加工
温度の高い高分子材料であり、また繊維、フィルムのよ
うな容積に比し表面積の大きい製品の場合である。耐光
性を改良するためには本発明の紫外線吸収剤を高分子材
料10の重量部に対し0.01重量部以上配合すること
が必要であるが、5重量部以上用いても効果の向上は大
きくない。The ultraviolet absorber of the present invention is particularly effectively used for polymeric materials whose processing temperatures are high, such as polypropylene, polyester, and polyamide, and for products that have a large surface area relative to their volume, such as fibers and films. It is. In order to improve the light resistance, it is necessary to blend the ultraviolet absorber of the present invention in an amount of 0.01 parts by weight or more per 10 parts by weight of the polymer material, but even if 5 parts by weight or more is used, the effect will not improve. not big.
望ましい配合量の範囲は0.5〜3重量部である。熱可
塑性樹脂に配合する方法には特に制限はなく高分子材料
の重合工程で添加してもよく成形工程の前に添加しても
よい。本発明の紫外線吸収剤はすぐれた紫外線吸収特性
を有する上に従事の紫外線吸収剤の揮発脱離性が著しく
改良されており、光劣化を生ずる高分子材料に少量配合
することにより屋外で長期間使用される場合の耐久性を
向上し高分子材料の有用性を増大するものである。A desirable range of blending amount is 0.5 to 3 parts by weight. There are no particular restrictions on the method of blending it into the thermoplastic resin, and it may be added during the polymerization process of the polymeric material or before the molding process. The ultraviolet absorber of the present invention not only has excellent ultraviolet absorption properties, but also has significantly improved volatilization and desorption properties. It increases the durability and usefulness of the polymeric material when used.
以下実施例をあげて説明するが本発明の内容はこれに限
定されるものではない。The present invention will be described below with reference to Examples, but the content of the present invention is not limited thereto.
以下の実施例の中に示した核磁気共鳴スペクトルの測定
はバリァンA−60により、重水素化クロロホルム中、
60qoの温度で測定した。The nuclear magnetic resonance spectra shown in the following examples were measured using Varian A-60 in deuterated chloroform.
Measured at a temperature of 60 qo.
実施例 1
214部の2,4−ジヒドロキシベンゾフェノン、10
2部の無水酢酸を40$都のニトロベンゼン中に溶解し
、これを2時間加熱環流した。Example 1 214 parts of 2,4-dihydroxybenzophenone, 10
Two parts of acetic anhydride were dissolved in 40 $ of nitrobenzene and heated to reflux for 2 hours.
反応終了後ニトロベンゼンを系外に蟹去した。残査をエ
チルアルコールより3回再結晶をすり返し精製し、2ー
ヒドロキシ4ーアセトキシベンゾフエノンを得た。さら
に29.8部の2−ヒドロキシ4−アセトキシベンゾフ
ェ/ン、20.2部のセバチン酸、0.05部のマグネ
シウムの混合物を窒素雰囲気下、200℃の温度で加熱
した。After the reaction was completed, nitrobenzene was removed from the system. The residue was purified by repeating recrystallization three times from ethyl alcohol to obtain 2-hydroxy 4-acetoxybenzophenone. Furthermore, a mixture of 29.8 parts of 2-hydroxy 4-acetoxybenzophene, 20.2 parts of sebacic acid, and 0.05 parts of magnesium was heated at a temperature of 200° C. under a nitrogen atmosphere.
途中生成する酢酸を系外に蟹去しながら2時間反応を行
った。この反応混合物をアセトンより2回再結晶する事
により精製しビス(3ーヒドロキシー4ーベンゾイルベ
ンゼン)セバケートを得た。なお2−ヒドロキシ4−ア
セトキシベンゾフヱノンの2位のヒドロキシ基及びビス
(3ーヒドロキシ4ーベンゾイルベンゼン)セバケート
の3位のヒドロキシ基が反応していない事をNMRスペ
クトルの測定により確認した。このスペクトルを第1図
の〔1〕に示した。すなわち7−2.1付近にカルボニ
ル基とヒドロキシ基との間の水素結合にもとづくシグナ
ルが認められる事又は各シグナルのプロトン相対強度比
が理論値と良い一致を示す事等より構造を確認した。The reaction was carried out for 2 hours while acetic acid produced during the process was removed from the system. This reaction mixture was purified by recrystallizing twice from acetone to obtain bis(3-hydroxy-4-benzoylbenzene) sebacate. It was confirmed by NMR spectrum measurement that the hydroxy group at the 2-position of 2-hydroxy 4-acetoxybenzophenone and the hydroxy group at the 3-position of bis(3-hydroxy 4-benzoylbenzene) sebacate did not react. This spectrum is shown in [1] of FIG. That is, the structure was confirmed based on the fact that a signal based on the hydrogen bond between the carbonyl group and the hydroxyl group was observed near 7-2.1, and the proton relative intensity ratio of each signal showed good agreement with the theoretical value.
実施例 2
25.3部の2,4ージヒドロキシベンゾフエノン、4
.7部の水酸化ナトリウムを30礎部の水に溶解し、さ
らに12部のイソフタール酸クロライドを15礎部のク
ロロホルムに溶解し、このクロロホルム溶液を上記の水
溶液に加え0.3時間激しく蝿拝した。Example 2 25.3 parts of 2,4-dihydroxybenzophenone, 4
.. 7 parts of sodium hydroxide was dissolved in 30 parts of water, 12 parts of isophthalic acid chloride was further dissolved in 15 parts of chloroform, and this chloroform solution was added to the above aqueous solution and stirred vigorously for 0.3 hours. .
反応終了後クロロホルム層を分液し、これよりクロロホ
ルムを蟹去し、淡黄色の麹査を得た。これをクロロホル
ム:アセトン=7:3の混合溶媒より再結晶を3回行っ
て精製しビス(3ーヒドロキシー4−ペンゾイルベンゼ
ン)イソフタレートを得た。この化合物のNMRスペク
トルにも丁一2.1付近にシグナルが認められ、各シグ
ナルのプロント相対強度比も理論値と良い一致を示した
。このNM旧スペクトルを第1図の〔ロ〕に示した。実
施例 3
実施例1又は2に示した方法により、種々の合成物を得
た。After the reaction was completed, the chloroform layer was separated and the chloroform was removed from it to obtain a pale yellow koji mixture. This was purified by recrystallization three times from a mixed solvent of chloroform:acetone=7:3 to obtain bis(3-hydroxy-4-penzoylbenzene) isophthalate. A signal was observed in the NMR spectrum of this compound in the vicinity of 2.1, and the front relative intensity ratio of each signal also showed good agreement with the theoretical value. This NM old spectrum is shown in Figure 1 (b). Example 3 Various synthetic products were obtained by the method shown in Example 1 or 2.
これらの性質を表1に示した。実施例 4表1に示した
種々の合成物をポリエチレンテレフタレートレジン10
碇都‘こ対して3部添加し280℃の温度で押し出し、
これを9500の温度で延伸し、020〃のフィルムを
得た。These properties are shown in Table 1. Example 4 Various compounds shown in Table 1 were mixed into polyethylene terephthalate resin 10.
Add 3 parts to Ikari Miyako and extrude at a temperature of 280℃,
This was stretched at a temperature of 9500 to obtain a film of 020.
このフィルムを空気中200午0の温度で30秒間、又
は10‐4脇日夕の真空度170℃の温度で30分間加
熱した。This film was heated in air at a temperature of 200° C. for 30 seconds or at a vacuum level of 170° C. on 10-4 Wakihigo for 30 minutes.
これらのフィルムの加熱前後で紫外部330(nm)で
の吸光度の変化を測定し添加した合タ成物の残存率を求
めた。これらの結果を表2に示した。紫外部の吸光度の
測定は日立214分光光度計により行った。実施例 5
表1に示した種々の合成物をポリエチレンテレ0フタレ
ートジン10峠部1こ対して3部添加し、280qoの
温度で押し出し100Aのフィルムを得た。The residual rate of the added composite compound was determined by measuring the change in absorbance at 330 (nm) in the ultraviolet region before and after heating these films. These results are shown in Table 2. The absorbance in the ultraviolet region was measured using a Hitachi 214 spectrophotometer. Example 5 3 parts of various compounds shown in Table 1 were added to 10 parts of polyethylene terephthalate resin and extruded at a temperature of 280 qo to obtain a film of 100 A.
さらにこれを95qoの温度で延伸し6ムの薄いフィル
ムを得た。これらのフィルムをキセノンフェードメータ
ー夕(東洋理化社製1.5kw)により300時間照射
し、極限粘度の変化を測定し、光劣化防止効果を検討し
た。これらの結果は表1に示した。なお極限粘度 一の
測定はテトラクロロェタン:フェノール=4:6の混合
溶媒により30℃の温度で行った。0比較例 1
実施例4及び5に示した同様に市販の3種の化合物2ー
ヒドロキシ−4−オクトキシベンゾフェノン、2一(3
,5′一tenブチルー2′−ヒドロキシェニル)‐5
ークロロベンゾトリアゾール及び夕2一(4′ーオクト
キシ−2−ヒドロキシフエニル)ペンゾトリアゾール(
構造式を表−2に示す)の残存率及び光劣化防止効果を
検討し結果を表3及び表4に示した。This was further stretched at a temperature of 95 qo to obtain a 6 mm thin film. These films were irradiated for 300 hours with a xenon fade meter (manufactured by Toyo Rika Co., Ltd., 1.5 kW), changes in intrinsic viscosity were measured, and the effect of preventing photodeterioration was examined. These results are shown in Table 1. Note that the measurement of the intrinsic viscosity was carried out at a temperature of 30° C. using a mixed solvent of tetrachloroethane:phenol=4:6. 0 Comparative Example 1 Three commercially available compounds similar to those shown in Examples 4 and 5: 2-hydroxy-4-octoxybenzophenone, 2-(3
,5'-tenbutyl-2'-hydroxyenyl)-5
-chlorobenzotriazole and 21(4'-octoxy-2-hydroxyphenyl)penzotriazole (
The residual rate and photodegradation prevention effect of the structural formulas shown in Table 2) were investigated, and the results are shown in Tables 3 and 4.
上記3種の化合物はいずれも市販品の中では最も良好な
残存率を示すと同時に優秀な光劣化防止効果を示すもの
の一つである。All of the above three types of compounds exhibit the best residual rate among commercially available products and are among those exhibiting an excellent photodegradation prevention effect.
比較例 2
実施例4及び5に示したと同様に表2の4一4に示す構
造の化合物の残存率及び光劣化防止効果を検討し結果を
表3及び表4に示した。Comparative Example 2 In the same manner as shown in Examples 4 and 5, the residual rate and photodeterioration prevention effect of the compounds having the structures shown in Table 2, 4 and 4, were investigated, and the results are shown in Tables 3 and 4.
表4より公知の紫外線吸収剤は本発明により合成された
化合物とほとんど同じ程度の光劣化防止能を有すること
がわかる。Table 4 shows that the known ultraviolet absorbers have almost the same ability to prevent photodeterioration as the compound synthesized according to the present invention.
しかし表3により、いずれも本発明による合成物より低
い残存率しか示さないことがわかる。表1種々の紫外線
吸収剤
表 2
表3紫外線吸収剤の残存率
※表1・2中のサンプル修と同じ。However, Table 3 shows that all of them exhibited lower residual rates than the composites according to the present invention. Table 1 Various UV absorbers Table 2 Table 3 Residual rate of UV absorbers *Same as sample modification in Tables 1 and 2.
の/ 止 ※表1・2中の修と同じof / stop *Same as Osamu in Tables 1 and 2
第1図は本発明で用いる化合物のNMRスベクトルであ
る。
第1図FIG. 1 shows the NMR spectrum of the compound used in the present invention. Figure 1
Claims (1)
含有してなる熱可塑性樹脂組成物。 ▲数式、化学式、表等があります▼ R_1:ヒドロキシ基 1,m:0または1の数であるが共に0になることは
ない。 R_2,R_3:ハロゲン、アルキル基またはアルコ
キシ基から選ばれたもの。 同一又は異なつていてもよい。 n,p:0から3まで
の整数を表わす。 R_4:イルキル、アリール、アルキレン、アリーレ
ン基のいずれかを表わす。 q:1又は2の数。[Scope of Claims] 1. A thermoplastic resin composition containing a compound represented by the general formula (I) or (II) below. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ R_1: Hydroxy group 1, m: Number of 0 or 1, but both cannot be 0. R_2, R_3: selected from halogen, alkyl group or alkoxy group. They may be the same or different. n, p: Represents an integer from 0 to 3. R_4: represents any one of anylkyl, aryl, alkylene, and arylene group. q: Number of 1 or 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51065236A JPS6019340B2 (en) | 1976-06-03 | 1976-06-03 | thermoplastic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51065236A JPS6019340B2 (en) | 1976-06-03 | 1976-06-03 | thermoplastic resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52147649A JPS52147649A (en) | 1977-12-08 |
JPS6019340B2 true JPS6019340B2 (en) | 1985-05-15 |
Family
ID=13281067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51065236A Expired JPS6019340B2 (en) | 1976-06-03 | 1976-06-03 | thermoplastic resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6019340B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5624418A (en) * | 1979-08-08 | 1981-03-09 | Toray Ind Inc | Preparation of polyester |
JPS6153332A (en) * | 1984-08-23 | 1986-03-17 | Shin Kobe Electric Mach Co Ltd | Production of laminate |
JPS6153331A (en) * | 1984-08-23 | 1986-03-17 | Shin Kobe Electric Mach Co Ltd | Production of laminate |
JP2731660B2 (en) * | 1992-03-02 | 1998-03-25 | ポリプラスチックス株式会社 | Light discoloration resistant polyarylene sulfide resin composition |
-
1976
- 1976-06-03 JP JP51065236A patent/JPS6019340B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS52147649A (en) | 1977-12-08 |
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