JPS60192439U - Semiconductor package assembly equipment - Google Patents
Semiconductor package assembly equipmentInfo
- Publication number
- JPS60192439U JPS60192439U JP7951284U JP7951284U JPS60192439U JP S60192439 U JPS60192439 U JP S60192439U JP 7951284 U JP7951284 U JP 7951284U JP 7951284 U JP7951284 U JP 7951284U JP S60192439 U JPS60192439 U JP S60192439U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- package assembly
- base substrate
- positioning plate
- slide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のサーディツプパッケージのリードベース
自動組立機の概要を説明するための図、第２図はそのベ
ース基板位置決め工程部分を説明するための図、第３図
は本考案による半導体パッケージ組立装置を説明するた
めの図、第４図は他の実施例を説明するための図である
。
図面において、３０はテーブル、３１は固定位置決め板
、３２はスライド板、３３．３３’は位置決め片、３４
は長孔、３５はねじ、３６はガイド、３７はエアシリン
ダ、３Ｂはベース基板、３９はばねをそれぞれ示す。Figure 1 is a diagram for explaining the outline of a conventional automatic lead base assembly machine for surdip packages, Figure 2 is a diagram for explaining the base board positioning process, and Figure 3 is a diagram for explaining the semiconductor device according to the present invention. FIG. 4 is a diagram for explaining the package assembly apparatus, and FIG. 4 is a diagram for explaining another embodiment. In the drawing, 30 is a table, 31 is a fixed positioning plate, 32 is a slide plate, 33.33' is a positioning piece, and 34
35 is a long hole, 35 is a screw, 36 is a guide, 37 is an air cylinder, 3B is a base board, and 39 is a spring.
Claims (1)
別の搬送ラインで送られたリードフレームを位置決めし
て前記ベース基板に接着結合する半導体パッケージ組立
装置において、前記ベース基板の位置決め部は、Ｌ字形
の固定位置決め板と、該固定位置決め板に対し斜方向に
スライドし、且つ先端百ベース基板を押圧する２面を有
するスライド板とよりなり、該スライド板のベース基板
を押圧する２面のうちの少なくとも１面はスライド方向
に対して調節可能な構造であることを特徴とする半導体
パッケージ組立装置。Position the base board on the empty carrier on the transfer line,
In a semiconductor package assembly device that positions a lead frame sent by another conveyance line and adhesively couples it to the base substrate, the positioning portion of the base substrate includes an L-shaped fixed positioning plate and an L-shaped fixed positioning plate, and an oblique positioning plate with respect to the fixed positioning plate. a slide plate having two surfaces that slide in the direction of the tip and press the base substrate, and at least one of the two surfaces of the slide plate that presses the base substrate has a structure that is adjustable with respect to the slide direction. A semiconductor package assembly device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7951284U JPS60192439U (en) | 1984-05-31 | 1984-05-31 | Semiconductor package assembly equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7951284U JPS60192439U (en) | 1984-05-31 | 1984-05-31 | Semiconductor package assembly equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60192439U true JPS60192439U (en) | 1985-12-20 |
| JPH034029Y2 JPH034029Y2 (en) | 1991-02-01 |
Family
ID=30624495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7951284U Granted JPS60192439U (en) | 1984-05-31 | 1984-05-31 | Semiconductor package assembly equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60192439U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010205751A (en) * | 2009-02-27 | 2010-09-16 | Nippon Avionics Co Ltd | Centering device |
-
1984
- 1984-05-31 JP JP7951284U patent/JPS60192439U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010205751A (en) * | 2009-02-27 | 2010-09-16 | Nippon Avionics Co Ltd | Centering device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH034029Y2 (en) | 1991-02-01 |
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