JPS60191316A - Heat shielding case - Google Patents

Abstract

PURPOSE:To improve the heat insulating effect of a heat shielding case by securing a close combination at a lower part of the shielding case between a bottom part of an approximately flat plate structure and a cover part of a semidouble structure or a fully double structure and therefore keeping the warmed air within said shielding case. CONSTITUTION:A bottom part 11 of a heat shielding case which has an approximately flat plate structure includes a support part 11a for an IC1 containing an on-chip thermostatic chamber, a hollow part 11b into which an end of a cover part 12 for the main body of said shielding case is fitted and a hole 11c through which a pin 1a of the IC1 is put. The cover 12 of a semidouble space or fully double space structure is adhered to the part 11 at a lower part Z. Thus the 1st space 13 storing the IC1 and the 2nd space 14 are formed by both parts 11 and 12. In such constitution, the warmed air can be kept within the shielding case. This improves the heat insulating effect of said shielding case.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a case for a heat shield, in particular, a heat shield case that incorporates a heat source, for example, an IC with an on-chip incubator, and whose heat generation temperature is adjusted to the ambient temperature. The present invention relates to a heat shield case having a structure that insulates and maintains a substantially constant temperature without being affected by changes in the temperature.

<Prior Art> A heat shielding device according to the prior art of the present invention will be explained based on the sectional view shown in FIG.

In the figure, 1 is an IC with an on-chip incubator 2 that includes a temperature sensor, a heater, a control circuit, etc., Ia is a bottle, and 3 is a first wall 3a and a second wall 31). The lower part of the heat shield case main body has a concave structure and has a double structure and a protrusion 3G that supports the IC 1 with an on-chip incubator at the bottom. The IC with an on-chip thermostat is press-fitted between the wall 3b and the two-shaped end 4a.
The upper part of the heat shield case body consists of a protrusion 4b that fixes 1 from the -F part, and the material for the upper and lower parts of the main body is a material with excellent heat insulation effect, such as polybutylene terephthalate. . 5 is a first sealed space, and 6 is a second sealed space, which are formed by a combination of the lower part 3 and the upper part 4 of the main body.

However, the heat shield tars having such a configuration has the following problems.

Here, 9 and h are minute gaps generated between the first sealed space 5 and the second sealed space 6, and γ1. Let γ2 be the leakage of heated air passing through gaps 0 and h. Now, when the on-chip thermostat 2 is turned on, the air in the first sealed space 5 and the second sealed space 6 starts convection αi, α2, and the heated air rises to the gaps g and h. The air passes through the air, becomes air leak γ2, and is released to the outside. Therefore, the heat insulating effect decreases as the heated air is released, and it takes time to reach the target temperature.

One way to solve this problem is to close the gap 1) with putty or the like, but since the heat shield case is small with a diameter of 10 mm and a height of 6 nV, it is necessary to close the gap 11. Taking such measures is extremely difficult for mass-produced products, and even if it were possible, it would lead to an increase in product prices.

<Objective of the Invention> The present invention has been made in view of the problems of the prior art described above, and an object of the present invention is to provide a heat shield case that can reach a target heat retention temperature in a short time.

・〈Structure of the Invention〉 The structure of the present invention to achieve the above-mentioned object is as follows: (1) a bottom portion having a substantially flat plate structure; (2) a first space containing a heat generation source; and at least a side wall portion in this first space. a lid part having a multi-space structure having a second space provided through the second space; The heat shield case is characterized in that the first space and the second space each have a sealed structure.

<Embodiments of the Invention> Specific embodiments of the above-mentioned configuration of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is a diagram showing a cross section of the heat shield case of the present invention. Note that the same numbers and symbols are given to the same parts as in FIG. 1, and redundant explanations will be omitted.

In FIG. 2, reference numeral 11 denotes a bottom portion of a substantially flat plate structure, in which a projection portion 11a that supports the IC 1 with an on-chip incubator and a four portion 11b into which one end of the first wall of the lid portion described below is fitted.
and a hole 11d through which the bottle 1a passes. Reference numeral 12 denotes a lid portion having a half-double space structure, 12a a first wall forming a first space 13 consisting of a lid shaped to include an ICI with an on-chip incubator, and 12b a side wall of the first space 13. an external wall forming a second space 14 in the section. At the lower part Z, one end of the first wall 12a of this lid part 12 and the recessed part 11b of the bottom part 11
are fitted together, and the lower end of the outer wall 12b of the lid part 11 is crimped to the outer periphery of the bottom part 11, so that the first space 13 connects the first sealed space to the second closed space. Space 14 forms a second sealed space.

In this way, in the structure of the present invention, the bottom part of the lid part can be easily fitted and assembled tightly at the bottom, so even if the air heated by the ICI with an on-chip thermostat rises due to convection, There is no leakage of heated air as in the conventional case, and therefore the time required to reach the stable point 5 can be shortened, and the warm-up characteristics can be improved.

Note that the structure shown in FIG. 2 is not limited to this.

For example, it is also possible to adopt the structure shown in FIG. Third
In the figure, parts that overlap with those in FIG. 2 are designated by the same numbers and symbols, and their explanation will be omitted.

In FIG. 3(A), 15 is a hole 15a through which the pin 1a passes.
The bottom part 16 of the flat plate structure has a lid part. In this lid part 16, 16a is a first wall corresponding to the first wall 12a in FIG. 2, 16b is a first wall bent part where the lower part of the first wall 16a is bent, 16c is an external wall, The space 17 becomes a second sealed space by the first wall bending portion 16b and the outer wall 16c. Reference numeral 18 denotes a support plate that supports the IC 1 with an on-chip incubator and has a fulcrum portion 18a that makes point contact with the bottom portion 16.

FIG. 3(B) is yet another cross-sectional view.

In FIG. 3(B), reference numeral 19 indicates a bottom portion of a substantially flat plate structure, and in this bottom portion 19, 19a represents a protrusion, 19b represents a convex portion, and 19c represents a hole. Reference numeral 20 denotes a heat insulating material filled in the second space 14, and this heat insulating material may be made of a known material such as a foamed chemical synthetic resin. In this way, the second space 14 is filled with the insulation cable JA20, and the second
If a sealed space is formed, insulation and heat retention can be further improved.

Further, for example, in the case of the structure shown in FIG. 3(A), if the second sealed space is constructed in a vacuum state, the heat insulation and heat retention properties are further improved.

By the way, the structure of the lid part may be a complete double structure. A cross-sectional view of this structure is shown in FIG. 3(C).

In FIG. 3(C), 21 is a first lid part forming a first space 23, and 22 is a second M part forming a second space 24. In FIG.

However, also in FIG. 3(C), at least the second space 24 may be filled with the thermal material 20.

Also, as is common to FIGS. 2 and 3, for example, in FIG. 3(C), the ICI with an on-chip incubator shown by the two-dot chain line 25 is placed in a non-contact state. filling it with a material with a high reflection coefficient such as aluminum (or filling it with the first
It may also be removed by means such as vapor deposition on the inner surface of the wall.

Furthermore, with the configuration of the present invention, applying adhesive to the bottom edge can be easily added to the manufacturing process.
It is also possible to further improve the adhesion.

<Test Results of the Invention> The test results for the configuration of the present invention described above will be explained using FIGS. 4 and 5.

FIG. 4 is a characteristic diagram showing the dependence of the temperature inside the heat shield case on the ambient temperature when the on-depth incubator 2 is turned on. In other words, this characteristic diagram shows that the heat shield case is installed in a thermostatic oven, and the temperature inside this thermostatic oven (hereinafter referred to as "ambient temperature") is
The temperature change inside the heat shield turret in a stable state was measured when the temperature was varied from 0 to 50°C.

The temperature inside the heat shield case is determined by the change in the pace emitter voltage vBE of the temperature monitor transistor shown by the dashed line W, which is provided near the on-chip incubator 2 in the IC 1 with an on-chip incubator in FIG. value (generally VBE is 2
．． It is believed that a change of 2 mV corresponds to a temperature change of approximately 1.0°C).

In FIG. 1, φ is in the case of the prior art, ψ is in the case of the half-duplex structure shown in FIG.
This is a characteristic curve in the case of a complete 2iJl structure shown in Figure (C). In Fig. 4, when the ambient temperature changes from 0 to 50°C, the VBE difference of the temperature monitor transistor is 5.0111V for φ, 3.31+1V for ψ, and 4.7mV for ω.
Therefore, it can be seen that the present invention has better heat insulation properties than the conventional technology.

FIG. 5 is a heat shield characteristic diagram.

In Fig. 5, the horizontal axis represents the elapsed time (seconds) ° after the on-chip incubator 2 was powered on, and the vertical axis represents the temperature difference inside the heat shield case (temperature monitor when the on-chip incubator 2 is turned off). The difference between the VBE of the transistor W and the VBE of the temperature monitor transistor when the stable temperature after the on-chip thermostat 2 is turned on, for example, when the temperature is constant at 50° C. (expressed as a percentage) is not shown.

9- Figure 5 (A) shows the case where the ambient temperature is 27°C and there is no forced convection, Figure 5 (B) shows the case where the ambient temperature is 27°C and there is forced convection, and Figure 5 (C) shows the case where the ambient temperature is 27°C and there is forced convection. The figure shows the case where there is forced convection.

Now, if we turn on the on-chip thermostat 2 and let the time required for the temperature difference in the heat shield case to reach 36.8% be expressed as φ:T=1.5 in Fig. 5(A). (seconds) ψ:T-1.0 (seconds) ω:T=1.1 (seconds), and Figure 5 (B) shows φ:T=1.8 (seconds) ψ:T=1.2 (seconds) ω:T=1.2C seconds), and in Figure 5 (C), φ:T=3.9 (seconds) ψ:T=2.1 (seconds) ω:T=2.6( seconds). As is clear from the above, it can be said that the structure of the present invention has better heat shielding characteristics than the prior art.

<Effects of the Invention> As described above in the specific examples and test results, the bottom part has a substantially flat plate structure, and the lid part has a multilayer structure such as a half-double structure or a full-double structure. The heat shield case of the present invention is characterized in that the heat shield case is assembled closely at the bottom, so that when the on-chip thermostat is turned on, the warm air inside the heat shield case escapes from the top to the outside. Since convection of internally heated air occurs smoothly, the product has good heat retention and insulation effects, and therefore has excellent thermal response.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view of a conventional heat shield device.
Fig. 2 is a sectional view of a heat shield case showing an embodiment of the present invention, Fig. 3 is a sectional view of a heat shield case showing another embodiment of the invention, and Fig. 4 shows on-depth constant temperature B2 turned on. FIG. 5 is a characteristic diagram showing the dependence of the temperature inside the heat shield case on the ambient temperature when the temperature is lowered. DESCRIPTION OF SYMBOLS 1... IC with on-depth thermostat, 3... Lower part of the main body of the heat shield case (of the prior art), 4... Upper part of the main body of the heat shield case (of the prior art), 11° 15,
19... Bottom of main body of heat shield case (of the present invention), 12.1G, 21.22... Mature shield c3-oC (of the present invention) q to 1 sun N

Claims (1)

[Claims] (1) In a heat shield case having a space for storing a heat generating source and having a structure that insulates and keeps the heat generated by the heat generating source at a constant temperature without being affected by the ambient temperature, the bottom portion has a substantially flat plate structure; , a lid part having a multi-space structure having a first space containing the heat generation source and a second space provided in the first space through at least a side wall part; A case for a heat shield, characterized in that the first space and the second space are each sealed so that the first space and the second space are sealed together with the lid part in close contact with each other at the lower part of the lid part.