JPS60185346U - ICs and LSIs whose entire circumference can be soldered at once - Google Patents
ICs and LSIs whose entire circumference can be soldered at onceInfo
- Publication number
- JPS60185346U JPS60185346U JP7216484U JP7216484U JPS60185346U JP S60185346 U JPS60185346 U JP S60185346U JP 7216484 U JP7216484 U JP 7216484U JP 7216484 U JP7216484 U JP 7216484U JP S60185346 U JPS60185346 U JP S60185346U
- Authority
- JP
- Japan
- Prior art keywords
- ics
- soldered
- once
- entire circumference
- whose entire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、従来の1パツケージ、と呼ばれるICの正面
図、第2図は、本案の形状をしたIC又はLSIの正面
図。
1は、リード部の中心、2は、リード部。
第3図は、本案の使用方法例。FIG. 1 is a front view of a conventional IC called a one-package, and FIG. 2 is a front view of an IC or LSI having the shape of the present invention. 1 is the center of the lead part, 2 is the lead part. Figure 3 shows an example of how to use this proposal.
Claims (1)
、リード部をもうけたIC及びLSI0IC and LSI0 with a lead part on the circumference of a circle centered on an arbitrary point on the IC or LSI
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7216484U JPS60185346U (en) | 1984-05-17 | 1984-05-17 | ICs and LSIs whose entire circumference can be soldered at once |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7216484U JPS60185346U (en) | 1984-05-17 | 1984-05-17 | ICs and LSIs whose entire circumference can be soldered at once |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60185346U true JPS60185346U (en) | 1985-12-09 |
Family
ID=30610323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7216484U Pending JPS60185346U (en) | 1984-05-17 | 1984-05-17 | ICs and LSIs whose entire circumference can be soldered at once |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60185346U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5825050B2 (en) * | 1979-07-16 | 1983-05-25 | 住友金属鉱山株式会社 | Method for producing composite copper-arsenic compound |
-
1984
- 1984-05-17 JP JP7216484U patent/JPS60185346U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5825050B2 (en) * | 1979-07-16 | 1983-05-25 | 住友金属鉱山株式会社 | Method for producing composite copper-arsenic compound |
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