JPS60185346U - ICs and LSIs whose entire circumference can be soldered at once - Google Patents

ICs and LSIs whose entire circumference can be soldered at once

Info

Publication number
JPS60185346U
JPS60185346U JP7216484U JP7216484U JPS60185346U JP S60185346 U JPS60185346 U JP S60185346U JP 7216484 U JP7216484 U JP 7216484U JP 7216484 U JP7216484 U JP 7216484U JP S60185346 U JPS60185346 U JP S60185346U
Authority
JP
Japan
Prior art keywords
ics
soldered
once
entire circumference
whose entire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7216484U
Other languages
Japanese (ja)
Inventor
太田　栄一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP7216484U priority Critical patent/JPS60185346U/en
Publication of JPS60185346U publication Critical patent/JPS60185346U/en
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来の１パツケージ、と呼ばれるＩＣの正面
図、第２図は、本案の形状をしたＩＣ又はＬＳＩの正面
図。 １は、リード部の中心、２は、リード部。 第３図は、本案の使用方法例。FIG. 1 is a front view of a conventional IC called a one-package, and FIG. 2 is a front view of an IC or LSI having the shape of the present invention. 1 is the center of the lead part, 2 is the lead part. Figure 3 shows an example of how to use this proposal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＩＣ又はＬＳＩ上の任意の点を中心とする円の円周上に
、リード部をもうけたＩＣ及びＬＳＩ０IC and LSI0 with a lead part on the circumference of a circle centered on an arbitrary point on the IC or LSI
JP7216484U 1984-05-17 1984-05-17 ICs and LSIs whose entire circumference can be soldered at once Pending JPS60185346U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7216484U JPS60185346U (en) 1984-05-17 1984-05-17 ICs and LSIs whose entire circumference can be soldered at once

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7216484U JPS60185346U (en) 1984-05-17 1984-05-17 ICs and LSIs whose entire circumference can be soldered at once

Publications (1)

Publication Number Publication Date
JPS60185346U true JPS60185346U (en) 1985-12-09

Family

ID=30610323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7216484U Pending JPS60185346U (en) 1984-05-17 1984-05-17 ICs and LSIs whose entire circumference can be soldered at once

Country Status (1)

Country Link
JP (1) JPS60185346U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825050B2 (en) * 1979-07-16 1983-05-25 住友金属鉱山株式会社 Method for producing composite copper-arsenic compound

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825050B2 (en) * 1979-07-16 1983-05-25 住友金属鉱山株式会社 Method for producing composite copper-arsenic compound

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