JPS60181023U - Chip type electrolytic capacitor - Google Patents
Chip type electrolytic capacitorInfo
- Publication number
- JPS60181023U JPS60181023U JP6830284U JP6830284U JPS60181023U JP S60181023 U JPS60181023 U JP S60181023U JP 6830284 U JP6830284 U JP 6830284U JP 6830284 U JP6830284 U JP 6830284U JP S60181023 U JPS60181023 U JP S60181023U
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- type electrolytic
- exterior resin
- chip type
- bend
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図A、 Bはそれぞれ本考案に係る一実施例を示す
底面図と正面図、第2図A、 Bはそれぞれ従来例を示
す側断面図と正面図である。
図中、1.IA・・・チップ形電解コンデンサ、2・・
・アルミニウムケース、3・・・コンデンサ素子、4・
・・ゴム封口体、5・・・アルミニウム電解コンデンサ
、6・・・外装樹脂層、7,8・・・リード線。1A and 1B are a bottom view and a front view, respectively, showing an embodiment of the present invention, and FIGS. 2A and 2B are a side sectional view and a front view, respectively, showing a conventional example. In the figure, 1. IA...Chip type electrolytic capacitor, 2...
・Aluminum case, 3... Capacitor element, 4.
... Rubber sealing body, 5 ... Aluminum electrolytic capacitor, 6 ... Exterior resin layer, 7, 8 ... Lead wire.
Claims (1)
込み、ゴム封口体にて封口したアルミニウム電解コンデ
ンサ全体を外装樹脂にて被覆し、ゴム封口体および外装
樹脂層を介して導出されたコンデンサ素子からのリード
線を折曲加工により外部端子としたチップ形電解コンデ
ンサにおいて、2本のリード線は外装樹脂層から導出さ
れた箇所で同電解コンデンサの周側(底面)に向けて互
にほぼ平行に第1折曲され、その周側端(底面の一側)
で互に離反する方向に第2折曲され、さらに周側(底面
)に沿い、かつ互に平行になるように周側の他端(底面
の他側)に向けて第3折曲されると共に、両リード線の
先端は周側他端(底面の他側)付近に位置してなること
を特徴としたチップ形電解コンデンサ。At least a capacitor element is assembled in an aluminum case, the entire aluminum electrolytic capacitor sealed with a rubber seal is covered with an exterior resin, and the lead wire from the capacitor element led out through the rubber seal and the exterior resin layer is folded. In chip-type electrolytic capacitors with external terminals formed by bending, the two lead wires are first bent toward the circumference (bottom) of the electrolytic capacitor at the point where they are led out from the exterior resin layer, almost parallel to each other. , its circumferential edge (one side of the bottom)
A second bend is made in the direction away from each other, and a third bend is made along the circumferential side (bottom surface) and toward the other end of the circumferential side (other side of the bottom surface) so that they are parallel to each other. A chip type electrolytic capacitor characterized in that the tips of both lead wires are located near the other end of the circumference (the other side of the bottom surface).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6830284U JPS60181023U (en) | 1984-05-10 | 1984-05-10 | Chip type electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6830284U JPS60181023U (en) | 1984-05-10 | 1984-05-10 | Chip type electrolytic capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60181023U true JPS60181023U (en) | 1985-12-02 |
JPH0214194Y2 JPH0214194Y2 (en) | 1990-04-18 |
Family
ID=30602928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6830284U Granted JPS60181023U (en) | 1984-05-10 | 1984-05-10 | Chip type electrolytic capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60181023U (en) |
-
1984
- 1984-05-10 JP JP6830284U patent/JPS60181023U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0214194Y2 (en) | 1990-04-18 |
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