JPS60180560U

JPS60180560U - warming mat

Info

Publication number: JPS60180560U
Application number: JP6853384U
Authority: JP
Inventors: 行木　清治
Original assignee: テイエヌネツト株式会社
Priority date: 1984-05-12
Filing date: 1984-05-12
Publication date: 1985-11-30

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

図面は本考案の実施例を示すものであって、第１図は第
１実施例の平面図、第２図は第１図Ｘ−Ｘ′の縦断面図
、第３図は第１図ｙ−ｙ’の縦断面図、第４図は第２実
施例の断熱材層の斜視図、第５図は第２実施例のマット
本体の斜視図、第６図は第５図ｐ−ｐ’の縦断面図、第
７図は第５図Ｑ−Ｑ′の縦断面図、第８図は第２実施例
の加温マットのシートを切り欠いた平面図、第９図は熱
半導体プラスチックヒーターの拡大平面図、第１０図は
ベンチに本考案の加温マットを敷いた状態の斜視図、第
１１図は椅子に本考案の加温マットを敷いた状態の斜視
図、第１２図は審判台に本考案の加温マットを敷いた状
態の斜視図である。２１・・・マット本体、２２・・・断熱素材層、２３・
・・保温素材層、２４・・・熱半導体プラスチックヒー
ター、２５・・・シート、２６・・・ソケット。The drawings show an embodiment of the present invention, in which FIG. 1 is a plan view of the first embodiment, FIG. 2 is a vertical sectional view taken along line X-X' in FIG. 4 is a perspective view of the heat insulating material layer of the second embodiment, FIG. 5 is a perspective view of the mat main body of the second embodiment, and FIG. 7 is a longitudinal sectional view taken along line Q-Q' in FIG. 5, FIG. 8 is a cutaway plan view of the heating mat sheet of the second embodiment, and FIG. Fig. 10 is a perspective view of the heating mat of the invention spread on a bench, Fig. 11 is a perspective view of the heating mat of the invention spread on a chair, and Fig. 12 is a perspective view of the heating mat of the invention spread on a bench. FIG. 2 is a perspective view of the heating mat of the present invention placed on a table; 21...Mat body, 22...Insulating material layer, 23.
... Heat insulation material layer, 24 ... Thermal semiconductor plastic heater, 25 ... Sheet, 26 ... Socket.

Claims

[Scope of utility model registration request]

A heat retaining material layer 23 is placed on the upper surface of the heat insulating material layer 22, and a thermal semiconductor plastic heater 24 is interposed between the upper and lower image material layers 22 and 23 so that the heater appears outward from the side peripheral surfaces of the upper and lower image material layers. The mat main body 21 is covered with a sheet 25 made of a weather-resistant and water-impermeable material, and a socket 26 for connecting the thermal semiconductor plastic heater 24 and a power source is provided in the sheet. A heating mat that features an external appearance.