JPS60177031A - Electrically conductive casting film - Google Patents
Electrically conductive casting filmInfo
- Publication number
- JPS60177031A JPS60177031A JP3367484A JP3367484A JPS60177031A JP S60177031 A JPS60177031 A JP S60177031A JP 3367484 A JP3367484 A JP 3367484A JP 3367484 A JP3367484 A JP 3367484A JP S60177031 A JPS60177031 A JP S60177031A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- polyurethane resin
- electrically conductive
- casting film
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Moulding By Coating Moulds (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は導電性を有するキャスティング皮膜に係り、
詳しくのべると、導電性材料を添加したポリウレタン樹
脂溶液を離型性基材上に塗工したのち乾燥あるいはさら
に架橋させることによって得られる導電性キャスティン
グ皮膜に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a casting film having conductivity,
More specifically, the present invention relates to a conductive casting film obtained by coating a polyurethane resin solution containing a conductive material on a releasable base material, followed by drying or further crosslinking.
従来から、導電性に乏しい合成樹脂等に導電性を付与し
、静電気の発生の防止や除去、不導体上への電気回路の
形成、電子機器のプラスチックハウジングの電磁波シー
ルド等を目的として多くの導電化技術が開発されている
。Conventionally, many conductive materials have been used to impart conductivity to synthetic resins that lack conductivity, to prevent or remove static electricity, to form electric circuits on non-conducting materials, to shield electromagnetic waves in plastic housings of electronic devices, etc. technology has been developed.
例えば■導電性塗料を塗工する方法、■導電性材料を合
成樹脂に練込む方法、■金属層を表面に ′設ける方法
（プラスチックメッキ、金属溶射、金属蒸着、金属箔の
貼付）などがよく知られている。For example, ■methods of applying conductive paint, ■methods of kneading conductive materials into synthetic resin, and ■methods of providing a metal layer on the surface (plastic plating, metal spraying, metal vapor deposition, pasting of metal foil), etc. Are known.
またその他にも繊維上にメッキを施した柔軟性に富んだ
導電性繊維や導電性塗料を塗工した紙などが知られてい
る。In addition, flexible conductive fibers with plating on the fibers and paper coated with conductive paint are also known.
この発明はポリウレタン樹脂溶液に金属微粉末、金属繊
維、金属フレーク、金属被覆されたマイカガラスミｌ維
、導電性カーボン、チョツプド炭素繊維などの導電材料
を添加し、必要に応じて溶剤、その他の樹脂、架橋剤等
を加えて均一に分散させ、次いで１ｊ；２泡をｈなった
後、ドクターナイフコーター等を用いて離型紙、離型性
ポリエステルフィルムなどの頭型性基祠上に塗工し、乾
燥あるいはさらに架橋させることによって得られる導電
性キャスティング皮膜を提供するものである。In this invention, a conductive material such as metal fine powder, metal fiber, metal flake, metal-coated mica glass fiber, conductive carbon, chopped carbon fiber, etc. is added to a polyurethane resin solution, and if necessary, a solvent, other resin, Add a cross-linking agent, etc. to uniformly disperse the foam, and then, after the foam has reached 1h, coat it on a head-shaped base such as release paper or release polyester film using a doctor knife coater, etc. A conductive cast film obtained by drying or further crosslinking is provided.
そしてこの発明の導電性皮膜は非常に柔軟で弾性に富む
ものから、はとんど伸びを示さない硬いものまで主剤で
あるポリウレタン樹脂を適当に選択することによって任
意に（ｑることができる。The conductive film of the present invention can be made into any desired shape, from extremely soft and highly elastic to hard and hardly elongated, by appropriately selecting the polyurethane resin as the base material.
また導電性材料の種類や量を適当に選ぶことによって導
電性をも変化さけることができる。Further, by appropriately selecting the type and amount of conductive material, changes in conductivity can also be avoided.
さらには離型性基材上に非導電性皮膜を形成させ、この
上に導電性皮膜を形成さける方法などによって多層構造
の導電性皮膜を製造することもできる。Furthermore, a multilayer conductive film can also be produced by forming a non-conductive film on a releasable base material and then forming a conductive film thereon.
このことは、導電性材料が添加された導電性皮膜が灰色
ないしは黒色を示し、外観的に単調な色彩を承りにすぎ
ないが、多層構造で表面層に任意の色彩をＩＭ′ｔｌこ
とも可能である。This means that the conductive film to which the conductive material is added exhibits a gray or black color, resulting in a monotonous appearance, but it is also possible to apply any color to the surface layer with a multilayer structure. It is.
この発明によって得られる導電性キャスティング皮膜は
、その片面あるいは両面に粘着剤やホットメルト接着剤
を塗工し、使用時に目的とする被着体に粘着接着あるい
はホットメルト接着させることができる。The conductive casting film obtained by the present invention can be coated with a pressure-sensitive adhesive or hot-melt adhesive on one or both sides, and can be adhesively bonded or hot-melt bonded to an intended adherend during use.
このようにして与えられる導電性キャスティング皮膜は
、抵抗率が１♂〜１０ｙＯｃｍの範囲内である。The conductive casting film thus provided has a resistivity within the range of 1♂ to 10 yOcm.
この発明の導電性皮膜の製造に使用する塗工液は、高粘
度の状態で使用するので、金属粉等の比重の大きな導２
ム゛祠を用いても′）ｒＩｆｌ、′ｆ間に沈降し、生成
した導電性皮膜の導電性にバラツキはほとんどない。Since the coating liquid used in the production of the conductive film of this invention is used in a high viscosity state,
Even if a mulch is used, there is almost no variation in the conductivity of the conductive film that settles between ')rIfl and 'f' and is formed.
そして従来の導電性塗料では使用中常時攪拌を続けない
といけないとされているが、この発明で用いる塗工液に
おいてはその必要はない。Although conventional conductive paints require constant stirring during use, this is not necessary with the coating liquid used in the present invention.
導電性材料を含む導電性皮膜では、一般に最低の膜厚は
１５μ程度が必要とされているが、先に述べた導電材を
練込む方法では、このような薄い皮膜を安定して製造す
ることは不可能である。For conductive films containing conductive materials, the minimum film thickness is generally required to be about 15 μm, but the method of kneading the conductive material described above does not allow stable production of such thin films. is impossible.
しかし、この発明の導電性皮膜においてはＩＦ！厚、導
電性ともにバラツキの非常に少ないものを安定して得る
ことが可能である。However, in the conductive film of this invention, IF! It is possible to stably obtain a material with very little variation in both thickness and conductivity.
この発明において使用Ｊる主剤どしてのポリウレタン樹
脂溶液は、一般の合成皮革のベース用樹脂として用いら
れているポリウレタンエラストマーでもよい。The polyurethane resin solution used as the base resin used in this invention may be a polyurethane elastomer that is used as a base resin for general synthetic leather.
しかし、耐加水分解性、耐薬品性などを要求される耐久
的な用途に対しては、ポリオール成分どしてポリテトラ
メチレンニーデルグリコール、ポリカプロラクトンジオ
ールまたはポリカーボネートジオールなどを用いるのが
好ましく、さらに必要な場合にはアミノプラスト、ポリ
イソシアナートやその他の架橋剤を用いて架橋皮膜とす
ることがより好ましい。However, for durable applications that require hydrolysis resistance, chemical resistance, etc., it is preferable to use polytetramethylene needle glycol, polycaprolactone diol, or polycarbonate diol as the polyol component; If necessary, it is more preferable to use aminoplast, polyisocyanate, or other crosslinking agent to form a crosslinked film.
次にこの発明で使用する導電性材料としては、アルミニ
ウム、銅、ニッケル、銀等の微粉末、フレーク、繊維、
表面に金属」−ト処理を施したマイカ、ガラスｓ＊ ｔ
ｒｔ、ガラスピーズ、炭素Ｉａ紺やチョツプド炭素繊維
、カーボンブラック等がある。Next, the conductive materials used in this invention include fine powders, flakes, fibers, etc. of aluminum, copper, nickel, silver, etc.
Mica and glass with metal treatment on the surface
rt, glass peas, carbon Ia navy blue, chopped carbon fiber, carbon black, etc.
かくしてこの発明で用いるポリウレタン樹脂溶液を主剤
とする塗工液はポリウレタン樹脂溶液に該樹脂の固形分
１００部に対して通常１００部以上の導電ＩＡＩ＋を加
え、さらに必要ならばアミノプラス１−やポリイソシア
ナート（ブロックィンシアナー１〜でｂよい）などの架
橋剤を加えて攪拌し、均一に分散さＵることによって得
られ、次いで、この塗工液を脱泡機にかけて脱泡したの
ちドクターナイノコーターにて離型紙や離型処理したポ
リエステルフィルムなどの離型性基材上に、予め設定さ
れｌこ乾燥膜厚どなるだりの吊を塗工し、乾燥あるいは
ざらに架橋を行なうものである。Thus, in the coating solution having a polyurethane resin solution as a main ingredient used in the present invention, 100 parts or more of conductive IAI+ is added to the polyurethane resin solution per 100 parts of the solid content of the resin, and if necessary, aminoplus 1- or polyester is added to the polyurethane resin solution. It is obtained by adding a cross-linking agent such as isocyanate (block-in cyanide 1 to 1 is good), stirring, and uniformly dispersing it.Then, this coating liquid is defoamed by a defoaming machine, and then a doctor A coating with a preset dry film thickness of 1 is applied onto a release material such as release paper or release-treated polyester film using a nanocoater, and then dried or roughly crosslinked. .
以下、実施例によりこの発明の詳細な説明りる。Hereinafter, this invention will be explained in detail with reference to Examples.
なお実施例中の部数はずべて重量部である。Note that all parts in the examples are parts by weight.
実施例１
一般合成皮革用ポリウレタン樹脂溶液（ｆｌ１度３０％
、粘度４００ボイズ／、３０℃、商品名ラックスキン２
２１４、ヒイ」−化成社製） １００部にニッケルパウ
ダー（インコ社製、タイプ２５５＞ ６０部およびメチ
ルエヂルケトン（ＭＥＫ）３０部を加え、充分攪拌した
のち、脱泡機にか【ノて脱泡を行なった。Example 1 Polyurethane resin solution for general synthetic leather (fl1 degree 30%
, viscosity 400voices/, 30℃, product name Luxkin 2
To 100 parts of nickel powder (manufactured by Inco, type 255) and 30 parts of methyl ethyl ketone (MEK) were added to 100 parts of 214, Hii'' (manufactured by Kasei Co., Ltd.), after stirring thoroughly, the mixture was placed in a defoaming machine. Defoaming was performed.
次いで閉離型紙上に乾燥膜厚が４０μとなるようにドク
ターナイフを用いて塗工し・、８０℃で２分、さらに１
４０℃で４分乾燥を行なった。Next, it was coated on the separable pattern paper using a doctor knife so that the dry film thickness was 40μ, and was heated at 80°C for 2 minutes and then for 1 hour.
Drying was performed at 40°C for 4 minutes.
その後頗型紙から塗膜を剥離りると、外観が黒色の柔軟
な導電性皮膜が得られた。When the coating film was then peeled off from the chestnut paper, a flexible conductive film with a black appearance was obtained.
そして導電性は８Ｘ１００ｃｍであった。And the conductivity was 8×100 cm.
実施例２
実施例１におけるニラクルパウダーに代えてニッケルコ
ートマイカパウダー（三菱金属社製、Ｔ）１−３００）
５０部を使用し、実施例１ど同様に処理したところ、
黒灰色の外観を示づ柔軟な、ぞし′ｃ−６３
ＸＩＯ（）ｃｍの導電性を有する皮膜を得た。Example 2 Nickel coated mica powder (manufactured by Mitsubishi Metals Co., Ltd., T) 1-300) was used instead of Niracle powder in Example 1
When 50 parts were used and treated in the same manner as in Example 1,
A flexible film having a black-gray appearance and an electrical conductivity of 2'c-63 XIO() cm was obtained.
実施例３
１．６−ヘキリーンボリカーボナートジオールを用いた
濃度３０％、粘度８００ボイズ／３０℃のスデッカー用
無黄変ポリウレタン樹脂溶液（ラックスキン８３−３、
セイコー化成社製）１００部に電解銅粉（三菱金属社製
、ＭＦＤ−２）９０部、ジメチルホルムアミド（ＤＭＦ
＞５０部を加え、充分攪拌したのら脱泡し、実施例１と
同様に処理したところ４０μ厚の乾燥皮膜を得た。そし
てこの皮膜は１×１ｏΩ。の導電性を有し“Ｃいた。Example 3 A non-yellowing polyurethane resin solution for Sdecker (Luxkin 83-3,
90 parts of electrolytic copper powder (manufactured by Mitsubishi Metals Co., Ltd., MFD-2), dimethylformamide (DMF)
>50 parts were added, thoroughly stirred, defoamed, and treated in the same manner as in Example 1 to obtain a dry film with a thickness of 40 μm. And this film is 1×1oΩ. It has a conductivity of "C".
実施例４
実施例３で用いたと同じステッカ−用無黄変ポリウレタ
ン樹脂溶液（ラックスキン８３−３） ９０部にフェノ
キシレジン（１ニオン力−バイド社製、Ｐ Ｋ ｌ−Ｉ
Ｈ）の３０％ＤＭＦ溶液５部、ニッケルフレーク（イ
ンコ社製、１−１ｃΔ−１）９０部、コロネートＩＥ
Ｈ（ロ本ポリウレタン工業社製）１．５部および１）Ｍ
Ｆ４０部を配合し、充分攪拌したのち脱泡を行な つ
ｌこ 。Example 4 90 parts of the same non-yellowing polyurethane resin solution for stickers (Luxkin 83-3) used in Example 3 was added with phenoxy resin (1N-bydo, PK I-I).
5 parts of 30% DMF solution of H), 90 parts of nickel flakes (manufactured by Inco, 1-1cΔ-1), Coronate IE
1.5 parts of H (manufactured by Rohon Polyurethane Industry Co., Ltd.) and 1) M
Add 40 parts of F, stir thoroughly, and then defoamer.
lko.
次いでドクターナイフを用いて離型紙−［に乾燥膜厚が
５０μとなるように塗工し、ｉｏｏ’ｃで３分、次いで
１５０℃で６分保持しで導電性皮膜を得た。Next, it was coated on release paper using a doctor knife so that the dry film thickness was 50 .mu., and held at IOO'C for 3 minutes and then at 150.degree. C. for 6 minutes to obtain a conductive film.
その導電性は２×１０ΩＧであった。この皮膜を４０℃
のＤＭＦ溶液に浸漬したところ僅かに膨潤するのみであ
った。Its conductivity was 2×10ΩG. This film was heated at 40°C.
When immersed in a DMF solution, only slight swelling occurred.
Claims (4)
基材上に塗工し、乾燥したことを特徴とする導電性キレ
スティング皮膜。(1) A conductive kissing film characterized by coating a polyurethane resin solution containing a conductive material on a releasable base material and drying it.
ポリカーボネートジオールであることを特徴とする特許
請求の範囲第１項記載の導電性キャスティング皮膜。(2) The conductive casting film according to claim 1, wherein the polyol component in the polyurethane resin solution is polycarbonate diol.
ノプラス１−またはポリイソシアナートの架ｉ剤を添加
した溶液を離型性基村上に塗工し、乾燥架橋させたこと
を特徴とりる導電性キャスティング皮膜。(3) Conductive material characterized by applying a solution of a polyurethane resin solution containing a conductive material and adding a crosslinking agent of aminoplus 1- or polyisocyanate to the mold release base Murakami and drying and crosslinking it. Casting film.
がポリカーボネートジオールであることを特徴とする特
許請求の範囲第３項記載の導電性キャスティング皮膜。(4) The conductive casting film according to claim 3, wherein the polyol component in the polyurethane resin solution is polycarbonate diol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3367484A JPS60177031A (en) | 1984-02-23 | 1984-02-23 | Electrically conductive casting film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3367484A JPS60177031A (en) | 1984-02-23 | 1984-02-23 | Electrically conductive casting film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60177031A true JPS60177031A (en) | 1985-09-11 |
Family
ID=12392999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3367484A Pending JPS60177031A (en) | 1984-02-23 | 1984-02-23 | Electrically conductive casting film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60177031A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2248620A (en) * | 1990-10-12 | 1992-04-15 | Kitagawa Ind Co Ltd | Plastic material for wrapping over and carrying food |
| CN111703096A (en) * | 2020-06-09 | 2020-09-25 | 浙江康润新材料有限公司 | Manufacturing process of TPU waterproof film |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55139234A (en) * | 1979-04-17 | 1980-10-30 | Sumitomo Naugatuck Co Ltd | Manufacture of resin molded product having electric conductivity |
| JPS58118852A (en) * | 1982-01-08 | 1983-07-15 | Seiko Kasei Kk | Cast film |
-
1984
- 1984-02-23 JP JP3367484A patent/JPS60177031A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55139234A (en) * | 1979-04-17 | 1980-10-30 | Sumitomo Naugatuck Co Ltd | Manufacture of resin molded product having electric conductivity |
| JPS58118852A (en) * | 1982-01-08 | 1983-07-15 | Seiko Kasei Kk | Cast film |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2248620A (en) * | 1990-10-12 | 1992-04-15 | Kitagawa Ind Co Ltd | Plastic material for wrapping over and carrying food |
| US5273817A (en) * | 1990-10-12 | 1993-12-28 | Kitagawa Industries Co., Ltd. | Plastic material for wrapping over and carrying food |
| GB2248620B (en) * | 1990-10-12 | 1994-06-08 | Kitagawa Ind Co Ltd | Plastic material for wrapping over and carrying food |
| CN111703096A (en) * | 2020-06-09 | 2020-09-25 | 浙江康润新材料有限公司 | Manufacturing process of TPU waterproof film |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3146125A (en) | Method of making printed circuits | |
| CN1867226B (en) | Method of manufacturing wiring circuit board | |
| EP0169060B1 (en) | Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them | |
| US4844784A (en) | Flexible cicuit substrate with electroconductive adhesive layer and its production | |
| CN108353497A (en) | Thermosetting property adhesive sheet, the flexible printing patch panel with enhanced portion, its manufacturing method and electronic equipment | |
| CN103391973A (en) | Electrically conductive composition | |
| JPS5950519B2 (en) | Non-impact thermal transfer printing ribbon | |
| CN107636095A (en) | Electric conductivity liquid composition | |
| JPS60177031A (en) | Electrically conductive casting film | |
| US4676854A (en) | Method for selectively bonding substrate having fine electroconductive pattern | |
| JPH09500174A (en) | Metallization method for non-conductive substrate | |
| JPH09237517A (en) | Conductive particle for anisotropic conductive adhesive film, its manufacture and anisotropic conductive adhesive film | |
| JPS61107792A (en) | Formation of circuit base fabric | |
| JPS6248784A (en) | Sheetlike electrically conductive adhesive | |
| JPH064789B2 (en) | Method for producing thin film conductive material | |
| JPH03504060A (en) | electrically conductive structures | |
| JPS6293811A (en) | Manufacture of pressure sensitive conductive sheet | |
| JPH1166956A (en) | Conductive paste | |
| JPS6251106A (en) | Manufacture of highly conducting resin film | |
| JPS60223872A (en) | Electrically conductive paint | |
| JPS60161467A (en) | Electrically conductive electrodeposition coating material | |
| JPH0247543B2 (en) | ||
| CN207671977U (en) | A kind of conductive adhesive film and products thereof with metal high-bond | |
| JPS63288093A (en) | Circuit transferring foil for injection molding and manufacture thereof | |
| JP3199509B2 (en) | Film connector |