JPS60176187A - Semiconductor card - Google Patents

Semiconductor card

Info

Publication number
JPS60176187A
JPS60176187A JP59030333A JP3033384A JPS60176187A JP S60176187 A JPS60176187 A JP S60176187A JP 59030333 A JP59030333 A JP 59030333A JP 3033384 A JP3033384 A JP 3033384A JP S60176187 A JPS60176187 A JP S60176187A
Authority
JP
Japan
Prior art keywords
card
semiconductor
solar battery
light emitting
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59030333A
Other languages
Japanese (ja)
Inventor
Toshinobu Maeda
前田 稔展
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59030333A priority Critical patent/JPS60176187A/en
Publication of JPS60176187A publication Critical patent/JPS60176187A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Abstract

PURPOSE:To prevent a direct impression of static electricity, etc. to a conductive part by utilizing a solar battery as a power source of a semiconductor card, by executing data transmission/reception between the card and an external device by means of photo-connection and by eliminating an exposed terminal to the surface. CONSTITUTION:A semiconductor card 11 main body is constituted of a opaque resin 14, and on its surface a transparent film 15 with a small transmission loss of light is bonded. A semiconductor light emitting element 16 and a semiconductor photodetector element 17 are provided as a data I/O part 13. A solar battery 12 as a power source of a semiconductor card, a semiconductor memory and a control circuit and the like are separately burried in the card interior, and they are electrically connected respectively. The built-in semiconductor devices are driven by electric power of the solar battery 12. When the semiconductor card is connected to a card write (read) device, energy is given to the solar battery 12 from the write (read) device. A light emitting element of the write (read) device and a photodetector of said device are arranged at opposite positions of a photodetector of the card and of a light emitting element of the card, respectively, and data are transmitted and received.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、半導体カードに関し、特にカードの端子部分
の改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a semiconductor card, and more particularly to an improvement in the terminal portion of the card.

(従来例の構成とその問題点) 近年、磁気ストライプをカード上に配置したいわゆる磁
気カードに代って、新らしくカードに半導体装置を内蔵
したいわゆる半導体カードが使用されつつある。
(Conventional Structure and its Problems) In recent years, a new type of so-called semiconductor card, in which a semiconductor device is built into the card, is being used instead of a so-called magnetic card in which a magnetic stripe is arranged on the card.

従来の半導体カードは、第1図に示したように構成され
ておシ、1はカード本体、2は端子部である。半導体装
置は端子部2の裏側のカード内部に格納されている。こ
のように、カード内部の半導体メモリーにデータを書込
んだり又は読出したシするための端子(複数)がカード
の表面に導体のまま露出している。半導体カードはその
使用目的上個人が所持携帯する場合が多い。従ってそれ
を取扱う際に衣服その他の物にこのカードの端子部2が
接触するなど端子に静電気が印加される危険が多く、そ
の結果、内部の半導体装@を破壊に至らしめるという欠
点を有していた。
A conventional semiconductor card is constructed as shown in FIG. 1, where 1 is a card body and 2 is a terminal portion. The semiconductor device is stored inside the card on the back side of the terminal section 2. In this way, the terminals (plurality) for writing data to or reading data from the semiconductor memory inside the card are exposed as conductors on the surface of the card. Semiconductor cards are often carried by individuals for their intended use. Therefore, when handling the card, there is a high risk of static electricity being applied to the terminals, such as when the terminals 2 of this card come into contact with clothes or other objects, and as a result, there is a drawback that the internal semiconductor device @ may be destroyed. was.

(発明の目的及び構成) 本発明は、半導体カードが静電気等によって破壊される
恐れがあるという欠点を除去するもので、電源に太陽電
池を使用して、表面に露出する電源端子を無くシ、且つ
カードと外部機器の間のデーターの授受を光結合によっ
て行うために従来の端子部の代りに半導体の受光素子と
発光素子を配置する。これによって静電気等が半導体カ
ードの導電部分に直接印加されるのを防止することがで
きる。以下、図面によシ実絶倒を詳細に説明する。
(Objects and Structure of the Invention) The present invention eliminates the disadvantage that semiconductor cards may be destroyed by static electricity, etc., and eliminates power terminals exposed on the surface by using solar cells as a power source. Further, in order to transmit and receive data between the card and external equipment by optical coupling, a semiconductor light receiving element and a light emitting element are arranged in place of the conventional terminal section. This can prevent static electricity and the like from being directly applied to the conductive parts of the semiconductor card. Hereinafter, the actual construction will be explained in detail with reference to the drawings.

(実施例の説明) 第2図は、本発明の一実施例を示したもので、11は半
導体カード、12は太陽電池、13は半導体発光素子及
び受光素子からなるデータ入出力部である。
(Description of an Embodiment) FIG. 2 shows an embodiment of the present invention, in which 11 is a semiconductor card, 12 is a solar cell, and 13 is a data input/output section consisting of a semiconductor light emitting element and a light receiving element.

第3図は、第2図のデータ入出力部の詳細断面図である
。半導体カード11の本体は、不透明樹脂14から構成
され、その表面に、光の透過損失の小さい透明フィルム
15が接着されている。
FIG. 3 is a detailed sectional view of the data input/output section of FIG. 2. The main body of the semiconductor card 11 is made of an opaque resin 14, and a transparent film 15 with low light transmission loss is adhered to the surface thereof.

16は半導体発光素子、17は半導体受光素子である。16 is a semiconductor light emitting device, and 17 is a semiconductor light receiving device.

これら半導体発光素子16及び受光素子17はデータ入
出力部13を構成している。半導体カードの主たる半導
体メモリー及び制御回路等は別途本カード内に埋設して
あり、それぞれデータ入出力部13の半導体受光素子1
7及び半導体発光素子16と電気的に接続されている。
These semiconductor light emitting device 16 and light receiving device 17 constitute a data input/output section 13. The main semiconductor memory, control circuit, etc. of the semiconductor card are embedded separately in this card, and the semiconductor light receiving element 1 of the data input/output section 13 is embedded separately in the main card.
7 and the semiconductor light emitting device 16 .

内蔵されたこれら半導体装置は、太陽電池12の電力で
駆動され、本半導体カードをカード書込器又は読出器に
接続した時は、これら書込器(読出器)から太陽電池に
エネルギーが与えられ、内部の半導体装置に電力が供給
される。一方、これら書込器(読出器)の発光素子は本
カードの受光素子と、又これら書込器(読出器)の受光
素子は本カードの発光素子とそれぞれ相対向する位置に
配置されておシ、必要なデーターの授受がそれぞれ光を
介して行なわれる。従って、書込器(読出器)と本カー
ドとの間には、電気的接続のための物理的接触物は何も
ない。
These built-in semiconductor devices are driven by the power of the solar cell 12, and when this semiconductor card is connected to a card writer or reader, energy is given to the solar cell by the writer (reader). , power is supplied to the internal semiconductor device. On the other hand, the light-emitting elements of these writers (readers) are arranged in positions opposite to the light-receiving elements of this card, and the light-receiving elements of these writers (readers) are arranged opposite to the light-emitting elements of this card. The necessary data is exchanged via light. Therefore, there is no physical contact between the writer (reader) and the card for electrical connection.

(発明の効果) 以上説明したように、本発明によれば、導電端子が外部
に露出されていないので静電気が直接印加されることが
なく、従って静電気破壊に対して安全である。
(Effects of the Invention) As described above, according to the present invention, since the conductive terminal is not exposed to the outside, static electricity is not directly applied, and therefore, it is safe against electrostatic damage.

なお、前記実施例では、カード本体の不透明樹脂に透明
のフィルムを接着したものについて述べたが、半導体受
光素子、半導体発光素子及び太陽電池の部分のみ透明と
してもよい。また、 発光素子、受光素子、太陽電池以
外の、カード本体に埋没する半導体装置として半導体メ
モリー、演算素子の外に、リニヤ−増幅回路等を含んで
も良く、その種類について何ら制限を受けるものでない
In the above embodiment, a transparent film was bonded to the opaque resin of the card body, but only the semiconductor light receiving element, semiconductor light emitting element, and solar cell may be made transparent. In addition to the light-emitting element, light-receiving element, and solar cell, the semiconductor device buried in the card body may include a linear amplifier circuit, etc. in addition to the semiconductor memory and the arithmetic element, and there are no restrictions on the type thereof.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、従来の半導体カードの正面図、第2図は、本
発明の一実施例の半導体カードの正面図、 第3図は、同半導体カードのデーター人出力部の拡大断
面図である。 11・・・半導体カード、12・・・太陽電池、13・
・・データ入出力部、16・・・半導体発光素子、17
・・・半導体受光素子。 \ニー“r 第1図 第2図 第3図
FIG. 1 is a front view of a conventional semiconductor card, FIG. 2 is a front view of a semiconductor card according to an embodiment of the present invention, and FIG. 3 is an enlarged sectional view of the data output section of the semiconductor card. . 11...Semiconductor card, 12...Solar cell, 13.
...Data input/output section, 16...Semiconductor light emitting device, 17
...Semiconductor photodetector. \Knee“r Figure 1 Figure 2 Figure 3

Claims (1)

【特許請求の範囲】[Claims] 薄型カード内に半導体装置を埋設した半導体カードに、
太陽電池と、信号の授受のだめの半導体発光素子および
半導体受光素子を配置してなることを特徴とする半導体
カード。
A semiconductor card with a semiconductor device embedded inside a thin card,
A semiconductor card comprising a solar cell, a semiconductor light emitting element and a semiconductor light receiving element for transmitting and receiving signals.
JP59030333A 1984-02-22 1984-02-22 Semiconductor card Pending JPS60176187A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59030333A JPS60176187A (en) 1984-02-22 1984-02-22 Semiconductor card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59030333A JPS60176187A (en) 1984-02-22 1984-02-22 Semiconductor card

Publications (1)

Publication Number Publication Date
JPS60176187A true JPS60176187A (en) 1985-09-10

Family

ID=12300883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59030333A Pending JPS60176187A (en) 1984-02-22 1984-02-22 Semiconductor card

Country Status (1)

Country Link
JP (1) JPS60176187A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0332170A2 (en) * 1988-03-08 1989-09-13 Matsushita Electric Industrial Co., Ltd. Combined memory medium, drive apparatus and method therefor and playback apparatus therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0332170A2 (en) * 1988-03-08 1989-09-13 Matsushita Electric Industrial Co., Ltd. Combined memory medium, drive apparatus and method therefor and playback apparatus therefor
US5132947A (en) * 1988-03-08 1992-07-21 Matsushita Electric Industrial Co., Ltd. Combined memory medium, drive apparatus and method therefor and playback apparatus therefor

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