JPS60171774A - Photoelectronic device - Google Patents

Abstract

PURPOSE:To realize a photoelectronic device in a structure, wherein the connection internal and external optical fibers can be automatically performed, by a method wherein an optical element fixed on one main surface of the substrate and covered with a package having a connection surface whereto the internal optical fibers are connected and a connector plate, which is fixed on the penetrated hole part of the substrate and has holes wherein the internal optical fibers are inserted, are provided. CONSTITUTION:A connector plate 12 attached previously with external optical fibers 11 is fixed on a prescribed part of a substrate 1 consisting of a wiring plate where a penetrated hole 13 has been bored in the substrate 1, and an optical element 3 and so forth are fixed on the main surface of the substrate 1. A metallized layer 9 is formed on the surface of the package excluding the transparent part thereof for the input and output of the optical element 3 and a pad 8 for connection is formed of the transparent part and the metallized layer 9 on the peripheral edge of the transparent part. Each one end of internal optical fibers 20 is respectively fixed on both sides of the pad 8 and the internal optical fibers 20 are optically connected with the optical element 3, while the other ends of the internal optical fibers 20 are inserted in the holes of the connector plate 12 and the internal optical fibers 20 are optically connected with the external optical fibers 11. By this way, the connection of the internal optical fibers 20 with the external optical fibers 11 can be automatically performed. As a result, an upgrade of the connection precision of the optical fibers, an improvement of the producibility of the photoelectronic device and a reduction of the cost of the photoelectronic device can be attained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an optoelectronic device having a light emitting section, a light receiving section, etc.

[Background technology]

Conventionally, for example, 1 Hitachi Hyoron + Vol. 65.39-5
As described on pages 6 and 67 to 70, optical elements such as semiconductor lasers for optical communication Φ information processing, light emitting diodes, light receiving elements, and integrated optical devices have been developed.

However, the present applicant attaches optical fibers to such optical elements and related devices by manually connecting the outer periphery of optical fibers with adhesive or metallized surfaces using solder or the like.

However, since this type of work is done manually, there are limits to connection accuracy, connection failures, and performance problems.If left as is, high-integration multi-wiring devices such as original ICs (integrated optical devices), etc., would be costly and expensive. The inventors have found that there are major problems in terms of performance.

[Purpose of the invention]

The purpose of the present invention is to improve productivity by providing an optoelectronic device having a structure that allows automatic connection of optical fibers.
It is important to try to reduce costs.

The above and other objects and novel features of the present invention are as follows:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, in one aspect of the present invention, a connector plate to which external optical fibers are attached in advance is fixed to a predetermined portion of a substrate made of a wiring board. Furthermore, the optical elements and the like are fixed to the main surface pressure of the substrate. Further, in the optical element, a metallized layer is formed on the back cage surface except for the transparent part for input/output, and a connection band is formed by the transparent part and the metallized layer around the periphery thereof. One end of the internal optical fiber is fixed to the pad for optical connection with the optical element, and the other end is fixed to the connector plate for optical connection to the external optical fiber. Therefore, during assembly of this optoelectronic device, two internal optical fibers can be bonded automatically in the same manner as wire bonding in conventional semiconductor device assembly, resulting in improved optical fiber connection accuracy, improved productivity,
Cost reduction can be achieved.

〔Example〕

FIG. 1 is a perspective view showing the main parts of an optoelectronic device according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the main parts of a wiring board (substrate) on which optical elements, IC chips, external optical fibers, etc. are attached. 3 are sectional views showing the connection state of the internal optical fibers.

In this optoelectronic device, a desired number of elements 2 each having a built-in five light emitting diodes, a light emitting element such as a semiconductor laser, or a light receiving element such as a photodiode or phototransistor are fixed at a desired position on one main surface of a wiring board (substrate) 1. ing. The optical element 2 has a structure in which a dome-shaped light emitting diode 3 is enclosed in a package 4, as shown in FIG. 3, for example. The light emitting diode 3 has its electrode portion 5 fixed to a wiring provided on the main surface of the substrate 1 via a bonding material 7 such as solder. The package 4 has a cap shape with a dome structure and is made of a transparent material made of glass, plastic, etc. to transmit and receive light. The package 4 is covered with a metallized film 9 except for the optical fiber connection surface 8 which becomes the input/output part (see Fig. 2). Ultrasonic bonding on layer 10.

It is fixed by thermocompression bonding. The package 4 is formed by bonding the metallized lower end surface of the package 4 and the ring-shaped metallized main surface of the substrate 1).
It is hermetically sealed by joining with lo.

On the other hand, a connector plate 12 made of gold H4 to which the inner end of an external optical fiber 1 is connected is fixed along one side of the substrate l. A through hole 13 smaller than the connector plate 12 is pre-drilled in the substrate ↑111 to which the connector plate 12 is attached, and a metallized layer 14 is provided on the edge of the hole on the main surface side of the $ plate 1. The connector plate 12 is hermetically fixed to this metallized layer 14 via a bonding scoop 15 such as solder. The metallized layer 17 and the connector plate 12 are fitted into the holes 16 provided in the connector plate 12 from the back side and are preliminarily applied to the outer peripheral surface of the cladding (the inner core of the cladding is not shown) of the external optical fiber 11. It is fixed with a bonding material 18 such as solder. Further, the inner end surface of the external optical fiber 11 is flush with the main surface of the connector plate 12.

On the other hand, the optical element 2 and the external optical fiber 11 are optically connected by an internal optical fiber 20 whose outer peripheral surface of a cladding (the inner core of the cladding is not shown) is covered with a metallized layer 19. That is, the internal optical fiber 20 is connected at one end to the optical fiber connection surface 8 of the optical element 2 and at the other end to the connector plate 12 by melting the metallized layer by thermocompression bonding or ultrasonic bonding.

Further, on the main surface of the substrate 1, leads 21 are provided as external electrode terminals.
And an IC (integrated circuit) chip 22 for driving the optical element 2 is attached. Also.

The leads 21 and the electrodes of the IC chip 22 are connected by wires 23. Further, the IC chip 22 and each optical element 2 are electrically connected by a wiring layer 24 extending within the substrate 1 as shown in FIG. However, resin molding and glass sealing are applied to the main surface side of the substrate 1, and
IC chip 22 cap must be sealed.

〔effect〕

(1) According to the present invention, internal optical fibers can be connected to external optical fibers and elements by using optical fibers instead of wires at °C in the wire bonding method, which is a conventionally established technology. Therefore, the installation of the optical fiber (optical axis alignment) becomes highly accurate, and the effect of improving the optical transmission efficiency can be obtained.

(2) According to the present invention, as a result of high-precision connection of internal optical fibers, it is possible to improve reliability and yield.

(3) According to the present invention, the automation of optical fibers can be achieved in accordance with the above (1), so that the cost of connecting optical fibers can be reduced.

(4) According to the present invention, a connector plate to a substrate, an optical element,
Since the structure is such that the attachment of external optical fibers can be automated, it is also possible to reduce the manufacturing cost of the optoelectronic device.

(5) From the above (1) to (4), according to the present invention, a high-performance optoelectronic device can be provided at a low cost and a synergistic effect can be obtained.

Although the invention made by the present inventor has been specifically described above based on Examples, the present invention is not limited to the above Examples, and may be modified in various ways without departing from the gist thereof. Needless to say.

[Application field]

In the above explanation, the invention made by the present inventor was mainly applied to optical transmission (optical communication) technology, which is the background field of application, but the invention is not limited to this, for example, laser measurement It can also be applied to measurement techniques for equipment, etc. At least the present invention can be applied to technology that handles light.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the main parts of an optoelectronic device according to an embodiment of the present invention. Figure +A2 is a perspective view showing the main parts of the wiring board to which the optical element, IC chip, and external optical fiber are attached. FIG. 3 is a sectional view similarly showing the connection state of the internal optical fibers. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Optical element, 3... Light emitting diode, 4... Package, 5... Electrode part, 6... Wiring layer, 7... Bonding material, 8...・Optical fiber connection surface, 9
... Metallized film, 10... Metallized layer, 11
...External optical fiber, 12...Connector board, 13.
... Perforation % 14... Metallized layer, 15... Bonding material, 16... Hole, 17... Metallized layer, 18...
- Bonding material, 19... Metallized layer, 20... Internal optical fiber, 21... Lead, 22... IC chip, 23
...Wire 24...Wiring layer. Figure 1

Claims (1)

[Claims] 1. A substrate, an optical element fixed to the entire surface of the substrate and covered by a package having an optical fiber connection surface, and a connector plate fixed to the through hole of the substrate and having a hole into which the optical fiber is inserted. an internal optical fiber having one end connected to the optical fiber connection surface of the package and the other end connected to the main surface side of the connector plate, and an inner end connected to the back side of the connector plate and an outer end connected to the substrate. 1. An optoelectronic device comprising: an external optical fiber protruding from the rear side; the tips of the internal optical fiber and the external optical fiber face each other using a hole in a connector plate as a guide, and their optical axes coincide.