JPS60170295A - Method of producing multilayer circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention 1] The present invention relates to a method for manufacturing a multilayer circuit board, and particularly to a method for manufacturing a multilayer circuit board, and particularly a conductive base with excellent adhesion. The present invention relates to a method for manufacturing a multilayer circuit board having a jumper-width V circuit.

[Technical background of the invention and its problems] In recent years, with the miniaturization of electrical and electronic components and the aging of society, the number of multilayer printed wiring boards is increasing.

Among these, multilayer circuit boards in which jumper wire circuits are formed using silver paste are increasing. The silver paste for this purpose consists of an organic binder, silver powder, and other necessary materials such as -C solvent, inorganic filler, and S-electrode! (J) 1-Nor resin is used as an organic binder. (There is.

However, jumper wire circuit boards using conventionally known silver pastes based on these resins have the disadvantage that the adhesion between the silver paste and the conductor (copper foil) is poor, and silver migration is likely to occur.

As a result, the multilayer circuit board covering the jumper Y-V circuit has a drawback of poor reliability.

[Object of the invention 1 The object of the present invention has been made in view of the above-mentioned drawbacks,
The present invention aims to provide a method for manufacturing a highly reliable multilayer circuit board using a conductive paste that has excellent adhesion to conductive copper foil and is resistant to silver migration.

[Summary of the Invention] As a result of intensive research to achieve the above object, the present invention has been made to manufacture a multilayer circuit board in a predetermined process using a conductive paste with excellent adhesion, which will be described later, as a jumper wire circuit. It has been found that if the above-mentioned objective is achieved/achieved.

That is, the present invention provides an insulating substrate on which a conductor circuit is formed.

A first step of coating and curing a thermosetting or ultraviolet curable resin on all or a part of the top, and a jumper using a specific conductive paste on all or a part of the insulating substrate subjected to the first step. It is characterized by comprising a second step of forming and curing a wire circuit, and a third step of further applying and curing a thermosetting or ultraviolet curable resin on all or part of the insulating substrate subjected to the second step. This is a method for manufacturing multilayer circuit boards.

The conductive paste used herein has (A) a modified resin consisting of polyparahydroxystyrene and an epoxy resin, and (3) monoconductive powder as its main components.

Polyparahydroxystyrene, which is a component of the (Δ) modified resin used in the present invention, is represented by the general formula, and for example, there is Marukubi Oil Co., Ltd.'s Marugen Resin M (trade name). fa is 3,000 to 8,000, and the number of hydroxyl groups is approximately 120.

(A> As the epoxy resin which is the other component of the modified resin, for example, the following bisphenol dieboxides may be mentioned, and these may be used alone or in combination of two or more kinds.

Manufactured by Shell Chemical Co., Ltd.: Epikote 82
7.828.834.1001.1002.1 004
, 1007, 1009 Manufactured by Dow Chemical Company: l) E R330, 331,
332, 334, 335, 336, 337, 660, 6
61, 662, 667, 668, 69 Made by Ziba Geigy: Araldite
) GY250.260.280.6071.6084.
6097.6099 Manufactured by Jones Dabney: Epi-Rez
510, 101 Manufactured by Dainichi Ink Chemical Industry Co., Ltd.: Epicron 810.100
0.1010.3010 (All of the above are trade names) Furthermore, by using and covering the epoxy resin with an average number of epoxy groups of 3 or more, such as a novolak epoxy resin, it is possible to further improve the adhesion after solder immersion. The novolak epoxy resin used is
Those with a molecular weight of 500 or more are suitable, and examples include the following, which may be used alone or in combination of two or more.

Manufactured by Ciba Geigy: Araldite (Δral-dit
e) EPN 1138.1139, ECN1273.
1280.1299 Manufactured by Dow Chemical Company: DEN431.438 Manufactured by Citrus Chemical Company: Epicote 152.154 Manufactured by Union Carbide Company: ERR-0100゜ERR
B-0447, ERLB-0448 Manufactured by Tsukuto Kasei Co., Ltd.: Y
D CN 701.702.703.704, YDP
N638.601, 02 Nikki Kayakusha: EOCN103.103S (all of the above are trade names) (A) The two components of the modified resin, polyparahydroxystyrene and epoxy resin, are blended in the near future. If the blending ratio is too far from this range, one of the two will remain unreacted during curing, which will weaken the adhesion strength of the heated part and increase the heating loss, which is undesirable. From polyparahydroxystyrene and epoxy resin The modified resin may be obtained by simply dissolving and mixing the two, or may be partially bonded to each other by heating reaction if necessary. Polyvara hydroxystyrene and epoxy resin may be simply dissolved and mixed. In this case, they may be added to the solvent and dissolved at the same time, but it is preferable to first dissolve the epoxy resin in the solvent and then dissolve and mix the polyvarahydroxystyrene.
In addition, the solvents used here include dioquilene,
Hexadi, benzene, toluene, solvent naphtha, industrial gasoline, cellosolve acetate, ethyl cellosolve acedate, butyl seron rub acedate, butyl rubitol acetate, dimethyl formamide, dimethyl are(-amide), N-methyl pyrrolidone, etc. These can be used alone or in combination of two or more.

Used as another component of conductive paste (3)
Examples of conductive bamboo powder include Ag powder, copper powder with a Δg plating layer on the surface, and N with a Δg plating layer on the surface.
Examples include i powder, Ag-plated synthetic resin powder, and the like, and these may be used alone or in combination of two or more.

The conductive paste used in the present invention is (A>modified resin consisting of polyvara hydroxystyrene, epoxy resin, and resin) and (B
) Conductive powder as the main component, and if necessary, antifoaming agent, 7J bubbling agent, etc. are added.

The thermosetting or ultraviolet curable resin used in the present invention includes all commonly used resins. Examples include epoxy resin, phenolic resin, alkyd resin, polyester resin, urethane resin, (2) phoxy acrylate resin, urethane acrylate resin, and oligoacrylic ester resin.

Next, a method for manufacturing a multilayer circuit board according to the present invention will be explained with reference to the drawings. As seen in FIG. 1, a conductor circuit 2 is formed on an insulating substrate 1. Various types of substrates are used as the insulating substrate 1, such as a resin substrate, an aluminum substrate having an insulating layer, a ceramic substrate, etc., and a conductor circuit 2 is formed on this insulating substrate by a method such as tweezing or additive. Next, as shown in FIG. 2, a thermosetting or ultraviolet curable resin 3 is applied to all or part of the insulating substrate 1 on which the conductive circuit 2 is formed by screen printing or the like. Uru. After that, as shown in Figure m3, the above-mentioned hardening l
Screen-print coating Tlr using conductive paste 4 on all or part of the insulating substrate surface on which the resin has been formed, and form the conductive paste I to 4 by heating. .

Next, as shown in FIG. 4, a thermosetting or ultraviolet curable resin 3' is applied to all or part of the cured dielectric resin 3' by screen printing or the like, and then heat or ultraviolet irradiation is applied. After curing, a multilayer circuit board with jumper 941 circuits can be manufactured.

Effects of the Invention 1 As described above, the present invention forms a C-A-Simber-W-V circuit using a conductive paste that has poor adhesion and is unlikely to cause silver migration, making it possible to manufacture a highly reliable multilayer circuit board. I can do it.

"Embodiments of the Invention" The present invention will be described below with reference to Examples, but the present invention is not limited to these Examples.

In the following Examples and Comparative Examples, "part" means "part by weight"
The meaning is covered.

Examples 1 to 3 Manufacture of conductive paste (a) Epi:] 37.5 parts of -1-1001 and 10 parts of MaruC Resin M were mixed in 1-103 parts of Butyl Calbi - Luarete at a temperature of 100°C. A dissolution reaction was carried out for 1 hour to obtain a viscous brown modified resin. 22 parts of this modified resin and 1 of the amine lj form of boron trifluoride as a catalyst.
．． 0 parts and 57 parts of silver powder to make a conductive paste (
a) was produced.

(1+)-[Bi'-1 828 <7) 15.8 parts and Nlupine resin MIO part are converted into butyl L? 1] A dissolution reaction was carried out in 1-56 parts of solve acetate at a temperature of 100° C. for 1 hour to obtain a viscous brown modified resin. This modified resin 2
2 parts of silver powder and 57 parts of silver powder are mixed to form a conductive paste (b
) was manufactured.

(c) EOCN103S (trade name manufactured by B Kokuyaku Co., Ltd.)
After dissolving 66 parts in a solvent of 1-147 parts of butyl carby 1-hel acetate at 80°C, 34 parts of Maruzen Resin M were added.
0.6 part of an amine complex of boron trifluoride was added as a catalyst, and the reaction was continued at 80° C. for 3 hours to obtain a viscous and transparent modified resin. 22 parts of this modified resin and 57 parts of silver powder
A conductive paste (C) was prepared by mixing the following parts.

A multilayer circuit board was manufactured using conductive bases (a) (+3), (C) and a commercially available epoxy resin-based conductive base for circuits ((1° comparative example). Properties, printability, volume resistivity, and silver migration tests were conducted, and the results are shown in Table 1.

Table 1

[Brief explanation of the drawing]

FIGS. 1 to 4 are diagrams for explaining the manufacturing process of the present invention, and are sectional views showing the state of the board in each manufacturing process of the multilayer circuit board. 1... Insulating substrate, 2... Conductor circuit, 3.3'.
・・Thermosetting or ultraviolet curable resin, 4・・−17
Wire circuit. Figure 1 Figure 2 Figure 3 Figure 41! !

Claims (1)

[Claims] 1. A thermosetting or ultraviolet curable resin is coated on all or part of the insulating substrate on which a conductor circuit is formed.
7 culms and all or a part of the insulating substrate on which the first culm is applied are coated with (Δ) a modified resin consisting of polyparahydroxystyrene and coniboxy resin and (B) conductive powder as main components. In the second step of forming and curing a jumper wire circuit using the conductive f1 paste, a thermosetting or ultraviolet curable resin is further applied and cured on all or part of the insulating substrate that has been subjected to the second step. A method for manufacturing a multilayer circuit board characterized by including a second step.