JPS60167351U - Display element holder - Google Patents
Display element holderInfo
- Publication number
- JPS60167351U JPS60167351U JP1984056236U JP5623684U JPS60167351U JP S60167351 U JPS60167351 U JP S60167351U JP 1984056236 U JP1984056236 U JP 1984056236U JP 5623684 U JP5623684 U JP 5623684U JP S60167351 U JPS60167351 U JP S60167351U
- Authority
- JP
- Japan
- Prior art keywords
- display element
- holder
- element holder
- tip
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１因は発光ダイオード素子の一例を示す斜視図、第２
図はそのホールダの断面図、第３図及び第４図は夫々ホ
ールダのパネルへの挿着状態を示す断面図、第５図はこ
の考案に係るホールダの一例を示す縦断面図、第６図は
他の縦断面図、第７図及び第８図はホールダのパネルへ
の挿着状態を示す断面図である。
１０はホールダ、１は発光ダイオード素子、１３はパネ
ル、１４は窓孔、２４は素子固定部、２７はテーパー、
１１は基板である。The first factor is a perspective view showing an example of a light emitting diode element, and the second factor is a perspective view showing an example of a light emitting diode element.
The figure is a sectional view of the holder, FIGS. 3 and 4 are sectional views showing how the holder is inserted into the panel, FIG. 5 is a vertical sectional view showing an example of the holder according to this invention, and FIG. 6 is a sectional view of the holder. is another longitudinal sectional view, and FIGS. 7 and 8 are sectional views showing the state in which the holder is inserted into the panel. 10 is a holder, 1 is a light emitting diode element, 13 is a panel, 14 is a window hole, 24 is an element fixing part, 27 is a taper,
11 is a substrate.
Claims (1)
の表示素子の平面がホールダの先端部より突出しないよ
うに素子固定部が設けられると共に、上記先端部の外面
には所定のテーパーが設けられた表示素子用ホールダ。 、[Claims for Utility Model Registration] In a holder for a display element to which a display element is attached, an element fixing portion is provided so that the flat surface of the display element does not protrude beyond the tip of the holder, and a predetermined portion is provided on the outer surface of the tip. A display element holder with a taper. ,
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984056236U JPS60167351U (en) | 1984-04-17 | 1984-04-17 | Display element holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984056236U JPS60167351U (en) | 1984-04-17 | 1984-04-17 | Display element holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60167351U true JPS60167351U (en) | 1985-11-06 |
Family
ID=30579639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984056236U Pending JPS60167351U (en) | 1984-04-17 | 1984-04-17 | Display element holder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60167351U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
| US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
-
1984
- 1984-04-17 JP JP1984056236U patent/JPS60167351U/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
| US8933369B2 (en) | 2000-09-13 | 2015-01-13 | Hamamatsu Photonics K.K. | Method of cutting a substrate and method of manufacturing a semiconductor device |
| US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
| US8969761B2 (en) | 2000-09-13 | 2015-03-03 | Hamamatsu Photonics K.K. | Method of cutting a wafer-like object and semiconductor chip |
| US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
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