JPS6016529U - Resin-clad capacitor - Google Patents

Resin-clad capacitor

Info

Publication number
JPS6016529U
JPS6016529U JP10120083U JP10120083U JPS6016529U JP S6016529 U JPS6016529 U JP S6016529U JP 10120083 U JP10120083 U JP 10120083U JP 10120083 U JP10120083 U JP 10120083U JP S6016529 U JPS6016529 U JP S6016529U
Authority
JP
Japan
Prior art keywords
melting point
resin
low melting
capacitor
point metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10120083U
Other languages
Japanese (ja)
Other versions
JPS6314445Y2 (en
Inventor
秀一 吉田
阿部　達雄
Original Assignee
日立コンデンサ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立コンデンサ株式会社 filed Critical 日立コンデンサ株式会社
Priority to JP10120083U priority Critical patent/JPS6016529U/en
Publication of JPS6016529U publication Critical patent/JPS6016529U/en
Application granted granted Critical
Publication of JPS6314445Y2 publication Critical patent/JPS6314445Y2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案の実施例の正面断面図を示す。 １・・・・・・コンデンサ素子、３・・・・・・絶縁基
板、４ａ。 ４ｂ・・・・・・金属箔、５・・・・・・温度ヒユーズ
、６・・・・・・低融点金属線、７・・・・・・絶縁樹
脂、１０・・・・・・コンデンサ。The figure shows a front sectional view of an embodiment of the invention. 1...Capacitor element, 3...Insulating substrate, 4a. 4b...Metal foil, 5...Temperature fuse, 6...Low melting point metal wire, 7...Insulating resin, 10...Capacitor .

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] コンデンサ素子に樹脂外装を設けた樹脂外装型コンデン
サにおいて、互いに絶縁分離されている金属箔が設けら
れ一方の該金属箔には端子が接続され他方の前記金属箔
にはコンデンサ素子が接続された絶縁基板と、低融点金
属線を該低融点金属線付近の融点を有する難燃性の絶縁
樹脂により被覆したものからなり、前記金属箔に前記低
融点金属線の一部または前記低融点金属線と同じ材質の
低融点金属を溶融して接続された温度ヒユーズとを有す
ることを特徴とする樹脂外装型コンデンサ。In a resin-clad capacitor in which a capacitor element is provided with a resin exterior, metal foils are provided that are insulated and separated from each other, one of the metal foils is connected to a terminal, and the other metal foil is connected to the capacitor element. It consists of a substrate, a low melting point metal wire coated with a flame retardant insulating resin having a melting point near the low melting point metal wire, and a part of the low melting point metal wire or the low melting point metal wire is coated on the metal foil. 1. A resin-clad capacitor characterized by having a temperature fuse connected by melting a low melting point metal of the same material.
JP10120083U 1983-06-30 1983-06-30 Resin-clad capacitor Granted JPS6016529U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10120083U JPS6016529U (en) 1983-06-30 1983-06-30 Resin-clad capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10120083U JPS6016529U (en) 1983-06-30 1983-06-30 Resin-clad capacitor

Publications (2)

Publication Number Publication Date
JPS6016529U true JPS6016529U (en) 1985-02-04
JPS6314445Y2 JPS6314445Y2 (en) 1988-04-22

Family

ID=30239076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10120083U Granted JPS6016529U (en) 1983-06-30 1983-06-30 Resin-clad capacitor

Country Status (1)

Country Link
JP (1) JPS6016529U (en)

Also Published As

Publication number Publication date
JPS6314445Y2 (en) 1988-04-22

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