JPS60163469A - Sealing method - Google Patents
Sealing methodInfo
- Publication number
- JPS60163469A JPS60163469A JP59017715A JP1771584A JPS60163469A JP S60163469 A JPS60163469 A JP S60163469A JP 59017715 A JP59017715 A JP 59017715A JP 1771584 A JP1771584 A JP 1771584A JP S60163469 A JPS60163469 A JP S60163469A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum exhaust
- resin sheet
- infrared ray
- lower mold
- same time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000007789 sealing Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 5
- 238000001514 detection method Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 230000004927 fusion Effects 0.000 abstract 2
- 230000035699 permeability Effects 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
- B32B17/10972—Degassing during the lamination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
- B32B17/10816—Making laminated safety glass or glazing; Apparatus therefor by pressing
- B32B17/10871—Making laminated safety glass or glazing; Apparatus therefor by pressing in combination with particular heat treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Description
【発明の詳細な説明】
本発明は半導体ウェハーまたはベレットのような脆弱な
材料を接着封止し、電気的特性を確保する封止方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for adhesively sealing fragile materials such as semiconductor wafers or pellets to ensure electrical properties.
近年、個別半導体及び太陽電池等は素子の大容量化に伴
い、コストダウンを如伺に解決するかということでモー
ルド化技術に種々の方法の試みが行なわれた。In recent years, as the capacity of individual semiconductors, solar cells, etc. has increased, various methods have been tried in molding technology in order to reduce costs.
しかしながら、最っとも安易２方法として、モールドキ
ャステング法及びディプ法が多種少量生産に鉱用いられ
てきたが、この方法の唯一の欠点は、モールド成形時に
内部に気泡を生じ、易く素子の絶縁耐圧及びリーク電流
が生じ易く、品質管理上の歩留向上は得られないことに
ある。However, the two easiest methods, the mold casting method and the dipping method, have been used for production of a wide variety of products in small quantities, but the only drawback of this method is that air bubbles are generated inside the mold during molding, which easily reduces the dielectric strength of the device. Also, leakage current is likely to occur, making it impossible to improve yield in terms of quality control.
また大量生産方式では、ベンジェクシ１ンモールド、ホ
ットメルトモールド法等が種々の方法が試みられたが、
この方法は脆弱な半導体ウェハーｌペレットに必要以上
の機械的応力を加え、ウェハーの割れ欠は等の問題を起
し、封止層の歩留率を低下し、コストダウンを期待する
ことは出来ない。例えば太陽電池モジュールのような、
太陽電池素子を数十個を直並列に接続し接着封止する場
合は後者の方法で制止した場合は、素子が一個でも割れ
た場合によその性能を十分に発揮することが出来ないば
かりか、その歩留率としてはより低下し経済的にも１期
待出来ない。In addition, various methods have been tried for mass production, such as Vengexi 1 mold and hot melt molding.
This method applies more mechanical stress than necessary to the fragile semiconductor wafer pellets, causes problems such as cracking of the wafer, lowers the yield rate of the sealing layer, and cannot be expected to reduce costs. do not have. For example, solar modules,
If you use the latter method when tens of solar cell elements are connected in series and parallel and sealed with adhesive, if even one element breaks, you will not be able to fully demonstrate the performance of the other element. However, the yield rate is lower and cannot be expected economically.
本発明の目的はかかる欠点を解消する接着封止方法及び
装置を提供することを目的としたものである。An object of the present invention is to provide an adhesive sealing method and apparatus that eliminates such drawbacks.
次に本発明の一実施例を図面に沿って説明する。Next, one embodiment of the present invention will be described with reference to the drawings.
第１図は本発明で実施された接着封止が行なわれたとき
の温度−圧力線図を示す。また第２図はこの封着方法を
実現するために設計製作された装置の一実施例の概念図
を示す。FIG. 1 shows a temperature-pressure diagram when adhesive sealing according to the present invention is performed. Further, FIG. 2 shows a conceptual diagram of an embodiment of a device designed and manufactured to realize this sealing method.
具体的の例として実施された太陽電池モジュールのモー
ルド力法として説明すると、第２図に示すように、あら
かじめ、太陽電池素子Ｓ 、 ５／ Ｓ／／〜５ を直
並列にあらかじめインタコネクター（図示せず）にて接
続し、基板６の上に積載し、更に樹脂シート（例えばポ
リビニールブテラルまたはエチレンビニールアセテート
等を太陽電池素子を包合するのに十分な厚さを持った板
厚を有するもの）を重ね、丁形２のストッパー１０．１
０’の上に乗せる、次に軟質耐熱ゴム製ダイアフラム３
が気密に取付けられた上形１を気密に組立る。To explain the mold force method of a solar cell module implemented as a specific example, as shown in FIG. (not shown) and stacked on the substrate 6, and then a resin sheet (for example, polyvinyl buteral or ethylene vinyl acetate) with a thickness sufficient to enclose the solar cell element. 10.1 of the T-shaped 2 stopper.
0', then soft heat-resistant rubber diaphragm 3
The upper form 1, which is airtightly attached, is airtightly assembled.
このように準備された工程の後に、纂１図に示すように
真空排気管８，９により同時に真空排気を始める一方、
丁形２の下面には大部分は光透過率の高いガラス板７が
取付けられているので下型２の下方に赤外線ランプ１１
及び集光鏡１２が配線１３．１３’、１３“〜１３ の
エネルギによりガラス板７を介して、樹脂シート４を加
熱し溶融する。これと同時に、真空排気管８，９により
、上形１及び下型２の真空度をＰ。（約ＩＴｏｒｒ以下
）にする、この溶融温度が第１図に示すＴ、に達したら
、上形の真空圧力を大気圧（７６０ＴＯＷ ）に解放し
てやれは、ダイアフラム３は３′の一点鎖線に示すよう
に下降し、前述の樹脂シート４の溶融に伴い太陽電池素
子５ｔ５’５”〜５ が基板６に接着側止することが出
来る。After the preparation process as described above, as shown in Figure 1, vacuum evacuation is started simultaneously using the evacuation pipes 8 and 9.
Since a glass plate 7 with high light transmittance is attached to the lower surface of the mold 2, an infrared lamp 11 is installed below the lower mold 2.
And the condensing mirror 12 heats and melts the resin sheet 4 through the glass plate 7 by the energy of the wires 13, 13', 13" to 13. At the same time, the upper mold 1 is Then, set the vacuum degree of the lower mold 2 to P. 3 is lowered as shown by the dashed line 3', and as the resin sheet 4 is melted, the solar cell elements 5t5'5" to 5 can be adhesively fixed to the substrate 6.
ここで本実施例の特徴としては、従来この種の方法及び
装置として採用し又いた方法としては熱源が通常の電熱
ヒータ乞゛用いらン妥ため熱伝導による遅れとダイアフ
ラムによる圧力のタイムラグのずれによる太陽電池素子
の割れをきたし歩留向上を期待出来なかった。しかし、
本発明によれはこの赤外線光源を採用したため歩留向上
だけでなく、温度検出方法が容易になり、装置のタクト
タイムが向上し、その効果が太き（・ことが判明した。Here, the feature of this embodiment is that unlike conventional methods and devices of this type, a conventional electric heater is not used as the heat source, and there is a delay due to heat conduction and a time lag difference in pressure due to the diaphragm. This resulted in cracking of the solar cell elements due to this, and no improvement in yield could be expected. but,
The present invention employs this infrared light source, which not only improves the yield, but also simplifies the temperature detection method, improves the takt time of the device, and has significant effects.
第１図は封着時の温度−圧力線図を示し、ＴＩは樹脂の
溶融温度、Ｔ、、は冷却温度、’Ｉは溶融温度到達時間
、ｔ、は冷却開始温度、ｔｘｔ’ｉ冷却完了時間、ｔ４
は圧力印加開始時間、”５は圧力解放開始時間、ｔ、Ｈ
圧力解放完了時間、Ｐ、は印加圧力、ＰＯ−は解放圧力
を各々示す。
第２図は本発明の一実施例に用いる加熱炉の断面図で、
１は上型、２は下型、３，３’はダイアフラム、４は樹
脂シート、５．５’５”〜５ は太陽電池素子、６は基
板、７は透明ガラス板、８゜９は真空排気管、１０．１
０’は下型のストッパー、１１は赤外線ランプ、１２は
反射鏡、１３゜１３’〜１３“〜１３反射光線を各々示
す。
ｔ＋ ｔｔ ｔＪｔｚｔｔ ｔｙ
−一〉村１詩Ｍ
第 ｆ 区Figure 1 shows a temperature-pressure diagram during sealing, where TI is the melting temperature of the resin, T, is the cooling temperature, 'I is the time to reach the melting temperature, t is the cooling start temperature, and txt'i is the cooling completion temperature. time, t4
is the pressure application start time, 5 is the pressure release start time, t, H
In the pressure release completion time, P indicates the applied pressure and PO- indicates the release pressure, respectively. FIG. 2 is a sectional view of a heating furnace used in an embodiment of the present invention.
1 is an upper mold, 2 is a lower mold, 3, 3' is a diaphragm, 4 is a resin sheet, 5.5'5"~5 is a solar cell element, 6 is a substrate, 7 is a transparent glass plate, 8°9 is a vacuum Exhaust pipe, 10.1
0' indicates the stopper of the lower mold, 11 indicates the infrared lamp, 12 indicates the reflector, and 13°13' to 13" to 13 reflected light rays, respectively.
Claims (1)
を包合する樹脂材料を熱接着封止する方法に於いて、そ
の熱源を光熱源を用いて、各材料を加熱し真空脱泡を同
時に行い、かつ加圧を行うことを特徴とする封着方法。In a method for thermally bonding and sealing substrate materials, fragile materials such as semiconductor elements, and resin materials enclosing these materials, a light source is used as the heat source to heat each material and simultaneously perform vacuum defoaming. A sealing method characterized by applying pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59017715A JPS60163469A (en) | 1984-02-03 | 1984-02-03 | Sealing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59017715A JPS60163469A (en) | 1984-02-03 | 1984-02-03 | Sealing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60163469A true JPS60163469A (en) | 1985-08-26 |
Family
ID=11951443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59017715A Pending JPS60163469A (en) | 1984-02-03 | 1984-02-03 | Sealing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60163469A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012082943A1 (en) * | 2010-12-15 | 2012-06-21 | E. I. Du Pont De Nemours And Company | Method for fabricating a photovoltaic module using a fixture and using localized heating to heat areas of increased heating capability and module produced thereby |
-
1984
- 1984-02-03 JP JP59017715A patent/JPS60163469A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012082943A1 (en) * | 2010-12-15 | 2012-06-21 | E. I. Du Pont De Nemours And Company | Method for fabricating a photovoltaic module using a fixture and using localized heating to heat areas of increased heating capability and module produced thereby |
| WO2012082913A1 (en) * | 2010-12-15 | 2012-06-21 | E. I. Du Pont De Nemours And Company | Method for fabricating a photovoltaic module using a fixture having pressure generating members or an external force transmitting seal or sealing insert |
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