JPS60162571A - Cavity housing and soldering treatment thereof - Google Patents

Abstract

PURPOSE:To perform surely soldering and to enable satisfaction in beauty by providing spaces between a frame and partition plates or bottom plates or to the contact parts to be soldered in the stage of assembling the same so that the cpaces form slits. CONSTITUTION:Partition plates 102-109 made of metals to delineate a frame 101 formed of a metal into a frame shape are disposed in the frame 101. A metallic plate body 141 is disposed so as to close at least one side in the space parts between the plates 102-109 or between said plates and the frame 101. Slits 142 are interposed between the end edge of the body 141 positioned at one edge on the outermost edge in the soldering parts between said body 141 and the frame 101 or the plates 102-109 and the frame 101 or the plates 102-109. The entire part thereof is dipped in solder and the assembly is pulled up diagonally so as have the body 141 in the lowermost or uppermost position in the stage of pulling up the assembly from the solder soln.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention provides a cavity housing and its solder suitable for application to CA'l'V, SHF receiver converter tuners, general television receiver tuners, etc. Regarding processing method.

[Technical background of the invention and its problems]

Conventional tuners for general television receivers or CATV converter tuners popular in the United States and other countries consist of a high frequency amplifier circuit, a local oscillation circuit, a mixing circuit, a tuning circuit, a filter circuit, etc., and these circuits are installed in a cavity housing. is housed within. This housing has a metal frame and a metal partition plate for partitioning the inside of the frame and shielding each circuit function or circuit element. The aforementioned circuits are three-dimensionally wired within such a housing, or the circuits are connected to each other via a printed wiring board attached to the frame. In order to shield the entire housing assembled in this manner, both openings of the frame are shielded by lids. In order to omit one side of this lid, when forming the frame in advance, a metal plate (hereinafter simply referred to as the bottom plate) that serves as the bottom plate is attached to the frame either integrally with the frame or separately. Generally, the fixing and electrical connection between the frame and the partition plate, the frame and the bottom plate, or the partition plate is done by soldering. A method of soldering is used by passing the solder through.This manual soldering method requires soldering to be applied to all the joints that require soldering. Soldering requires a lot of time for items with a large number of soldering surfaces.In addition, the soldering part is subject to heat exposure, making it difficult to achieve uniform soldering and requiring skill. If this is not done uniformly, especially in high-frequency circuits, the distance from the soldering surface to the circuit element will not be constant, resulting in unstable impedance and a disadvantage that it will not be possible to obtain a chainer with constant performance.Furthermore, the quality of the surface treatment will change. There are also disadvantages that impair the aesthetic appearance.This is because tin plating is applied to metal plates such as frames, partition plates, bottom plates, etc. to make it easier for solder to adhere, but because the melting temperatures of this tin plating and the solder are close to each other, soldering is difficult. The tin plating melts and recrystallizes when cooled, causing discoloration, which poses no problem in terms of performance, but seriously impairs the aesthetics.Also, because the tin plating is done by hand, the housing near the cavity, etc. For example, when soldering in a narrow area, it often happens that the soldering iron comes into contact with the periphery of the frame and unnecessary solder adheres to the frame. When putting the lid on the frame, a gap is created between the frame and the lid, making it impossible to achieve a sufficient shielding effect.

On the other hand, in the case of soldering in a furnace, it is necessary to supply the necessary solder to all the points that require soldering, making it difficult to perform efficient soldering work, and it is difficult to obtain even soldering. It is. For this reason, correction work is often required to achieve uniform soldering, resulting in the above-mentioned drawbacks.

Furthermore, the cored solder used for soldering is expensive, resulting in an increase in costs.

In any case, both manual soldering and furnace soldering have their advantages and disadvantages, and at present there is no method or structure that is reliable, satisfies electrical performance, and is simple to perform the work.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a cavity housing which has a simple structure, can be soldered reliably, and has an appearance that is aesthetically satisfactory, and a soldering method therefor.

[Summary of the invention]

In the present invention, a gap is provided between the frame, the partition plate, or the bottom plate, or in the contact area to be soldered when these are combined, and this gap forms a slit, and the soldering is performed through the slit. The soldering method includes a cavity housing in which solder is applied to the inside of the slit by dipping the entire housing with solder while the slit is provided, and a method for soldering the same.

[Embodiments of the invention]

The present invention will be described below based on specific examples.

The circuit shown in FIG. 1 shows an example of an up-down converter tuner suitable for application to the present invention, and shows the circuit configuration included in the cavity housing, which will be briefly described below. A cable television signal sent from a cable broadcasting station is added to the terminal (10). This television signal is considered to be US channel 55-45.
0 Mn2 frequency. This television signal passes through a bandpass filter (11) and transmits only the necessary frequency band to the output side. The output of this filter (11) is supplied to a first mixer (12), to which is also added an output from a first local oscillator (13). The frequency of this oscillator (13) is varied by the channel selection voltage and can be switched from 660 to 1060M[(Z), and the frequency corresponding to the desired broadcast channel is selected.

The output of this first local oscillator (13) and the bandpass filter (1
1) is mixed in the first mixer (12) to obtain an output of 612 MHz on the output side of the mixer (12).

This output is a first intermediate frequency band filter (14), a first intermediate frequency band filter (15), and a first intermediate frequency band filter (15).
16) to the second mixer (17). This second mixer (17) is also supplied with an output from a second local oscillator (18). The second local oscillator (18) oscillates at a local excavation frequency corresponding to the designated channel when supplying the television signal to the receiver.1 For example, when set to 2 channels, it oscillates at a fixed oscillation frequency of 667 MHz. ing. Similarly, 674MH for 3 channels
z.

The frequency is set at 680 MHz for 4 channels and 690 MHz for S channel, and these frequencies cannot generally be switched by the consumer, but are preset at the time of shipment from the factory.

Therefore, the oscillation frequency can be changed by replacing the oscillation frequency determining element with an element having a different constant, such as an inductor or capacitor or a surface wave filter. The second local oscillator (18) set in this way
The missed output is supplied to the second mixer (17), where it is mixed with the output of the first intermediate band filter (16) and becomes the output of the second mixer (17). When set to 2 channels, an output signal of 55.75 MHz can be obtained. As mentioned above, the output of the mixer (17) differs depending on the set channel, 61ρ5M1 (Z for 3 channels, 67.25 MHz for 4 channels, 77 MHz for 5 channels).
．． An output of 25 MHz is produced. This second mixer (17
) output is passed through a second bandpass filter (19) and an amplifier (20
) and is supplied to an output terminal (21) which is supplied to the antenna input terminal of a television receiver, for example, and by setting the receiver's china to 2 channels, for example, a cable television signal can be reproduced. . The tuner device is constructed in this way, and cable television signals can be reproduced on a normal general television receiver.

The first mixer (12) has diodes (31) (32) (
33) It is a balanced modulation type mixing circuit (1G) using four (34), and the input from the band filter (11) is supplied via the transformer (35). The oscillation signal from the first local oscillator (13) is supplied to the midpoint of the output winding of the diodes (35) via the terminal (36).
The mixed output at (34) is made into a single output by a transformer (37), and is supplied from a terminal (38) to a first intermediate frequency band filter (14) at the next stage. Figure 3 is the first
This shows the local oscillator (13) and the oscillation transistor (
41), amplification transistors (42) (43), and amplification transistors (42) (43).
) is a terminal for amplifying the oscillation signal and outputting it (44) (44”
), the output of the terminal (44) is supplied to the aforementioned terminal (36), and the output of the terminal (44') is supplied to other circuits to be used. Oscillation transistor (41)
A resonant inductor (45) and a voltage variable capacitance diode (46) are connected to the collector of the diode (
The terminal voltage of 46) is changed by the channel selection voltage from the terminal (47) to adjust it to a desired oscillation frequency, and the channel is configured to be selectable. FIG. 4 shows a first intermediate frequency band filter (14), a first intermediate frequency amplifier (15), and a first intermediate frequency band filter (16), in which the output of the mixer (12) from the terminal (38) is ′
The output is supplied to the input inductor (51) and tuned to the tuning inductor, and the output is sent to the junction field effect transistor (51).
56). The signal amplified by this transistor (56) is further band-corrected by the 1st 'C1'ff frequency band filter (16) consisting of an inductor (57058) and capacitors (59) (60), and then sent to the output clapper (61). supplied to FIG. 5 shows the second mixer (17) and the second bandpass filter (19).

An intermediate frequency signal, which is the output of the first intermediate frequency bandpass filter (16), is supplied from the terminal (71), and an oscillation output, which is the output of the second local oscillator (18), is supplied from the terminal (72). Signals from both terminals (71) and (72) are supplied to the first gate of a mixing field effect transistor (73), and a signal representing the difference between the two signals, which is a mixed output, is taken out from the drain. The second gate of this transistor (73) is constant biased.

The output of the transistor (73) is connected to the surface wave filter element (7
The filter circuit configured in step 4) performs band correction and outputs only the necessary signal band to the terminal (75). The circuit shown in FIG. 6 shows the second local oscillator (18), which is mainly composed of a junction field effect transistor (81) and a surface wave filter element (82), and is capable of obtaining the above-mentioned oscillation output. There is. In this embodiment, the oscillation frequency is changed by converting the surface wave filter element (82).

This oscillation output is provided to a terminal (84) via an amplifying transistor (83). Note that this transistor (83) is inserted to compensate for a decrease in gain due to the use of the surface wave filter element (82). A tuner device having such a circuit configuration is built into the housing. This example is shown in FIG. 7, and the same parts as those explained in FIGS. 1 to 6 will be explained using the same names and symbols.

The metal tuner housing has a frame-like frame (101
)have. Inside this frame (101), approximately in the center thereof, there are two parallel partition plates (102) spaced apart from each other.
(103). This partition plate (102
) and the frame (101) accommodates, for example, an up circuit section, and a section separated by the partition plate (103) and the frame (101) accommodates a down circuit section.
The circuit portion is accommodated therein. Partition plate (102)
And the space part of the frame (101) is further divided into six partition plates (
104) to (109) into seven independent subdivisions. For convenience, this frame (101) and each partition plate (102) (104) to (103)
The space section divided by 01) is further divided into six independent small sections by five partition plates (117) to (121), and similarly the divided section is divided into 8th to 13th partitions.
They are called chambers (122) to (127). This 8th to 1st
A chassis plate (128) is provided on one side of the opening of the first chambers (122) to (125). Therefore, this eighth
- In the eleventh chambers (122) to (125), respective circuits are three-dimensionally wired.

In the other chambers, a printed wiring board (not shown) incorporating a predetermined circuit is disposed on a side surface in the same direction as the chassis plate (128). And in the first chamber (110) -
An input terminal (10) is provided in the frame (101) on the side, and the frame (101) on the negative side of the thirteenth chamber (127)
) is provided with an output returner (21). Various terminals (129) such as power supply terminals are similarly arranged on the side surface of the frame (ioi). In front of the first chamber (11
A bandpass filter (11) connected to the input terminal (10) is arranged in the third chamber (112), and the fourth chamber (112) is connected to the input terminal (10).
A first local oscillator (13) is disposed in the chamber 13), and an amplifier circuit portion constituting the first local oscillator (13) is disposed in the fifth chamber (114). Furthermore, the 6th room (115)
A circuit such as a prescaler is accommodated. 7th house (o6
) is provided with an ε1 mixer (12), and the output of this first mixer (12) is connected to the feedthrough capacitors and feedthrough terminals (not shown) installed across the partition plates (102) (103). ) to the mixer (12) output to the eighth chamber (122
). This eighth chamber (122) and ninth chamber (
123) is provided with a first intermediate frequency band filter χ14), and a partition plate (118) between the two chambers (122) and (123) is provided with a cutout (130).

Further, the tenth chamber (124) includes a first intermediate frequency amplifier (1
5), the 11th chamber (125) is provided with a first intermediate frequency band filter (16), and the 12th chamber (125) is provided with a first intermediate frequency band filter (16), respectively.
6), the second local oscillator (18) is located in the thirteenth chamber (12
7) includes a second mixer (17) and a second band filter (1
9) and an amplifier (20) are provided, respectively.
) is supplied to the output terminal (21). The housing containing these circuits is closed and shielded by a lid (not shown).

Here, the part that requires soldering is the frame - (101)
The butt part of the frame (101) and the butt part of the partition plates (102) to (109), or the butt part of the frame (101) and the partition plate (102) to
(109) The mutual abutting portions require soldering. As shown in FIG. 8, if a bottom plate (141) is required, this bottom plate (141) and the frame (101)
) or between the partition plates (102) to (109) also require soldering. This bottom plate (141) can be formed integrally with the frame (101), bent and soldered only at the necessary parts, and in the case shown in FIG. 8, the partition plates (102) to (109) are Illustrations are omitted to simplify the explanation. A case where the bottom plate (141) is provided as shown in FIG. 8 will be explained below. This bottom plate (141
) and the frame (101) have a slit part (
142). It is best to form this slit (142) over the entire negative side of the frame (101), but if you want the solder to adhere reliably and approximately evenly, make it discontinuous so that the middle part comes into contact with the frame (101). It may also be a slit portion (142). Slit part (142)
If the bottom plate (141) is formed over the entire negative side, the length of the bottom plate (141) may be shortened in advance, and the gap created by the missing portion may be used as the slit portion (142). The bottom plate (14) provided with the slit portion (142) in this way
1) , frame (101) and partition plate (102) - (
109) are placed in a predetermined position, respectively, and then solder-dipped as shown in FIG.

This solder dip is applied to the aforementioned frame (101) and partition plates (102) to (10) in the solder liquid of molten solder (151).
9).

A slit TJ (142) is formed at each location where the bottom plate (141) is to be soldered, and the entire bottom plate (141) is immersed. After being immersed for a period of time 2, for example 5 seconds, in which soldering can be performed, it is pulled out of the solder solution with the slit section (142) provided in the bottom plate (141) at an angle as shown by the arrow in FIG. 9 so that it is at the bottom. As a result, the unnecessary solder flows toward the bottom of the frame (101) etc. in order to pull it up diagonally.
101) and the bottom plate (141), but since the slit (142) is provided, the solder (151') that tends to accumulate there also mixes with the solder (151) in the solder solution. By pulling up the frame (tol) diagonally, the solder that accumulates inside the frame (101) due to the surface tension of the solder (151) is transferred to the solder (151) side of the solder tank as shown by the arrow in the figure. It will be pulled. Then, when the frame (101) and the like are pulled up, all unnecessary excess solder is pulled into the solder (151) of the solder tank and does not remain in the frame (101). At this time, the solder adheres to the inside of the slit (142), and the remaining slit (142) is completely covered by the solder, so that the shielding effect is not adversely affected in any way. In this way, the fluidity and surface tension of the molten solder are used to solder the necessary parts, and the excess solder is removed from the frame (101
) etc. that can be leaked out.

The interval of this gap part (142) is 1 for soldering and distribution.
From the current point of view, it is best to have a size of about 0.5 mounds.The size is not limited to this value only, but any size and width that satisfies both solderability and distribution will be fine. . In addition, the frame (101) and the partition plates (102) to (10
9) and the bottom plate (141) and are integrally soldered together, although not shown, since they are pulled up diagonally as shown in Figure 9, the bottom plate (141) is In other words, if the partition plates (102) to (109) are arranged so as to prevent the flow of solder in the direction in which the slit portion (142) is provided, the bottom plate (141) or the frame (101) and partition plate (102)
) - (1o9) It is necessary to provide a slit part (not shown) similar to the slit part (142) provided in the bottom plate (141) at the abutting part. It is possible to pour solder and close the slit with solder. An example of providing this slit portion is shown in Figure 10.
- (109) and between the partition plates (102) - (109), and between the partition plates (102) - (109) and the bottom plate (141).
) between the slit parts (14
2')% (142''). Even in this case, the interval between each slit part (102) to (109) is 0.
．． Approximately 5 cabinets is desirable. In this way, all the parts that require soldering are soldered, and by dipping the solder, the frame (101) and the partition plate (102)
Solder (151) can be applied over the outer surface metal of (109) and the bottom plate (141).

For joints that do not require soldering, the spacing between the slits is set to a width of one inch or more, so that solder does not adhere. This is because if the surface tension of the solder is increased to 1 m+ or more, K will remain open until the slit is closed.

Also, if it is less than 0.5cm, the speed at which the frame (101) etc. are pulled out of the solder solution (151) must be slowed down, otherwise the solder will not pass through completely and a solder pool will occur, so consider mass production. It has been found that a spacing of about 0.06 dew is good, but if the speed is slowed down, there is no problem in use with a spacing of 0-5 mm or less. Furthermore, by providing a bent part on the partition plate, etc. in the direction of solder flow, it is more reliable to arrange the bent part of the partition plate as shown in FIG. 10 parallel to the solder flow direction. Can be soldered. J can also be used when only the frame and partition plate are fixed. In this case, there is no problem even without the bottom plate, and the bottom plate is provided only in a part,
There may be cases in which a printed wiring board is used with other parts, or in the case where only the frame and partition plate are used, a printed wiring board may be used over the entire surface for wiring.

Furthermore, temporarily fixing the partition plate and frame before soldering.

For example, a pair of protrusions may be provided from the frame and the frame may be engaged between the protrusions, or a number of holding methods may be used, such as a fitting method, a pressure welding method, or locking with a jig. The above explanation describes the case where the bottom plate is used to dip the solder from the lower plate side, but it is also possible to flip the bottom plate so that it is on the top and dip the solder from the direction of the partition plate. Without it, the air inside the frame would not flow out to the outside, which would not only prevent reliable soldering, but also create air bubbles and require rotating movements to release the air. By dipping the solder so that the slit is at the top, the air inside the frame not only flows out through the slit in the bottom plate.

Gas generated during soldering can also be released to the outside. Various other applications and modifications are possible.

The process shown in FIG. 11 shows an example of such a soldering procedure. There is no need to refer to FIG. 11, and this is also mentioned in the above description, so a brief explanation will be provided. First, in order to create a metal plate into a predetermined shape, there is a china frame press and bending step (201), in which a frame-like frame is formed.

Next, a step (202) for assembling the partition plate and frame that has been assembled in advance is heated with light oil and a step (203) is performed for further assembling the bottom plate. The process of holding frames etc. assembled in this way with a jig in order to solder them (20
4) and then sent to a heating step (205) for preheating. This heating step (205) can be omitted if unnecessary. The frame, etc. that has gone through this heating process (205) is immersed in a solder bath in a solder dip process (206) to be dipped in solder, and then is diagonally pulled up in a process (207).
Pull up the frame etc. as described above. After soldering, the cavity housing is cooled in a cooling process (208J) to complete the housing.
) After passing through the housing, predetermined parts are assembled into the housing (21
0) and completed as a chainer. It should be noted that each step is shown as an example, and the order can be changed or omitted, and it goes without saying that various modifications and applications are possible as long as the above explanation is not exempted.

〔Effect of the invention〕

As described above, according to the present invention, parts that require soldering can be soldered in a short time and all at once, making it possible to save labor and automate the process. It can be made approximately uniform, stable performance characteristics can be obtained, and the appearance can be made beautiful. Furthermore, it is possible to obtain an even more beautiful finished state by cleaning the entire surface, and by properly pre-treatment for soldering (in particular, rust-prone materials such as iron plates that do not undergo surface treatment for soldering). It is possible to cover the entire outer surface with solder, even if the frame is made of a stable material.It has excellent anti-fog properties and also functions as a contact part with the lid, and it is also possible to eliminate the need for special plating treatment. becomes.

Furthermore, it is also possible to form the frame and the partition plate or the bottom plate integrally or partially integrally, and in such a case, the number of parts can be reduced and the construction can be made at low cost. Furthermore, after soldering, it is possible to almost eliminate manual work such as corrections, etc., which is extremely useful in practice.

[Brief explanation of the drawing]

FIG. 1 is a circuit configuration diagram showing the circuit configuration of a cheese device according to the present invention, FIGS. 2 to 6 are circuit diagrams for explaining each circuit of the circuit configuration shown in FIG. 2 is a perspective view showing an example of a housing for accommodating the circuit configuration shown in FIG. 1. FIG. Figure 8 is a sectional view showing a part of the housing (Figure 8 is shown in Figure 7), Figure 9 is an explanatory diagram schematically showing the soldering method, and Figure 10 is a part of the housing. The perspective view and FIG. 11 are schematic process diagrams for explaining the solder processing method according to the present invention. 101...Frame 102-109...Partition plate 141...Metal plate body (bottom plate) 142, 142', 142", 142"'...
...Slit part 151... Handa's representative patent attorney Kensuke Norichika (and one other person) IF diagram Figure 2 Figure 1 Figure 3 4 Figure 4 Figure 5 Figure 7 6 Figure/1B Fig. 7 129 114 Fig. 8 141 142 Fig. 9

Claims (6)

[Claims] (1) A frame formed in the shape of a metal frame, a metal partition plate arranged within the frame to partition the inside of the frame, and soldering between the partition plate and the frame or between the frames. A cavity housing comprising a slit portion formed in the portion and a solder located within the slit portion for soldering both the solder portions. (2) A frame formed in the shape of a metal frame, a metal partition plate arranged within the frame to partition the frame, and at least the partition plate or the partition plate and the frame. A metal plate that closes one side of the space, and a soldered portion between the metal plate and the frame or partition plate, and a space between the edge of the metal plate and the frame or partition plate located at the outermost edge of the metal plate and the frame or partition plate. A cavity housing comprising: a slit portion formed in the slit portion; and a solder located within the slit portion for soldering both the solder portions. (3) The cavity housing according to claim 1 or 2, wherein the interval between the slit portions is set to be one degree or less. (4) The cavity housing according to claim 2, wherein the slit portion is formed in a portion of the partition plate facing the bottom plate located in the same direction as the slit portion provided in the Ale bottom plate. (5) A metal partition plate is arranged in a frame formed in the shape of a metal frame so as to partition the frame, and a slit is formed in the soldered part of either or both of the frames, and the slit is 1. A method for soldering a capacitance housing, characterized in that the entire frame and partition plate formed with the capacitance housing are dipped in solder. (6) Partition plates made of metal (4) are arranged in a frame formed in the shape of a metal frame to divide the frame, and the resulting space between the partition plates or between the frames is minimally shared. A metal plate is arranged so as to close the − side,
A slit portion is interposed between the edge of the metal plate and the frame or partition plate located at the outermost edge of the soldered portion of the metal plate and the frame or partition plate, and the whole is dipped in solder. A method for soldering a capity housing, characterized in that when the whole is pulled up from a solder solution, it is pulled up obliquely so that it is at the lowest or highest position with respect to the metal plate.