JPS60154988U - 発光表示装置 - Google Patents
発光表示装置Info
- Publication number
- JPS60154988U JPS60154988U JP1984043811U JP4381184U JPS60154988U JP S60154988 U JPS60154988 U JP S60154988U JP 1984043811 U JP1984043811 U JP 1984043811U JP 4381184 U JP4381184 U JP 4381184U JP S60154988 U JPS60154988 U JP S60154988U
- Authority
- JP
- Japan
- Prior art keywords
- display device
- light emitting
- emitting display
- dot matrix
- monolithic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011159 matrix material Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図はこの考案に係る発光表示装置の一実施例の構成
を略示した斜視図である。 10・・・・・・モノリシックドツトマトリックス、2
0・・・・・・半導体集積素子、30・・・・・・基板
。
を略示した斜視図である。 10・・・・・・モノリシックドツトマトリックス、2
0・・・・・・半導体集積素子、30・・・・・・基板
。
Claims (1)
- モノリシックドツトマトリクスの駆動回路を備えた半導
体素子上に、モノリシックドツトマトリクスを搭載し、
前記半導体素子とモトリシックドツトマトリクスの所定
の電極間を接続したことを特徴とする発光表示装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984043811U JPS60154988U (ja) | 1984-03-26 | 1984-03-26 | 発光表示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984043811U JPS60154988U (ja) | 1984-03-26 | 1984-03-26 | 発光表示装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60154988U true JPS60154988U (ja) | 1985-10-16 |
Family
ID=30555817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984043811U Pending JPS60154988U (ja) | 1984-03-26 | 1984-03-26 | 発光表示装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60154988U (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52134395A (en) * | 1976-05-06 | 1977-11-10 | Seiko Instr & Electronics Ltd | Led display device |
JPS5571081A (en) * | 1978-11-24 | 1980-05-28 | Oki Electric Ind Co Ltd | Light emitting indication device |
-
1984
- 1984-03-26 JP JP1984043811U patent/JPS60154988U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52134395A (en) * | 1976-05-06 | 1977-11-10 | Seiko Instr & Electronics Ltd | Led display device |
JPS5571081A (en) * | 1978-11-24 | 1980-05-28 | Oki Electric Ind Co Ltd | Light emitting indication device |
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