JPS60152672U - striatal hot dip device - Google Patents
striatal hot dip deviceInfo
- Publication number
- JPS60152672U JPS60152672U JP3673184U JP3673184U JPS60152672U JP S60152672 U JPS60152672 U JP S60152672U JP 3673184 U JP3673184 U JP 3673184U JP 3673184 U JP3673184 U JP 3673184U JP S60152672 U JPS60152672 U JP S60152672U
- Authority
- JP
- Japan
- Prior art keywords
- hot
- molten metal
- filament
- hot dip
- inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coating With Molten Metal (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のホットディップ装置の一例を示。
す断面図、第２図ないし第４図はそれぞれ本考案のホッ
トディップ装置の実施例を示す断面図である。
１・・・・・・溶融金属、３・・・・・・線条体、７・
・・・・・ホットディップ槽、１３・・・・・・導入口
、１４・・・・・・導出口、１６．１６Ａ、１６Ｂ・・
・・・・堰板。
７ａ ７ｂ１５ 、。
９ ＋ｘ６Ａ１ｉ ＩＩ／□６Ｂ＋FIG. 1 shows an example of a conventional hot dip device. 2 to 4 are cross-sectional views showing embodiments of the hot dip apparatus of the present invention, respectively. 1... molten metal, 3... striatum, 7.
...hot dip tank, 13...inlet, 14...outlet, 16.16A, 16B...
...Weir board. 7a 7b15,. 9 +x6A1i II/□6B+
Claims (2)
ホットディップ装置において、溶融金属が連続的または
間欠的に還流する、外気と遮断さ−れたホットディップ
槽を設け、同種の一側壁の湯面下に線条体の導入口を、
相対する側壁の湯面下にメッキ層の厚さを規制する線条
体の導出口をそれぞれ設けたことを特徴とする線条体の
ホットディップ装置。(1) In a hot-dip device that performs plating by contacting and adhering molten metal to a filament, a hot-dip tank isolated from the outside air in which molten metal flows continuously or intermittently is provided, and The striatum inlet is placed below the hot water level on the side wall.
A hot dipping device for a filament body, characterized in that outlet ports for the filament body are provided below the hot water level on opposing side walls to regulate the thickness of the plating layer.
って、上記ホットディップ槽は内部に、線条体が通過す
るスリットを有する堰板を少な（とも１枚有し、その堰
板と導入口側又は導出口側の側壁との間に溶融金属のプ
ールを形成して成るもの。(2) Utility Model Registration The device according to claim 1, wherein the hot dip tank has a small number of weir plates (one in each case) each having a slit through which the filament passes. A pool of molten metal is formed between the plate and the side wall on the inlet or outlet side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3673184U JPS60152672U (en) | 1984-03-16 | 1984-03-16 | striatal hot dip device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3673184U JPS60152672U (en) | 1984-03-16 | 1984-03-16 | striatal hot dip device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60152672U true JPS60152672U (en) | 1985-10-11 |
| JPS6120030Y2 JPS6120030Y2 (en) | 1986-06-17 |
Family
ID=30542185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3673184U Granted JPS60152672U (en) | 1984-03-16 | 1984-03-16 | striatal hot dip device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60152672U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005248305A (en) * | 2004-03-08 | 2005-09-15 | Nippon Steel Corp | Device for suppressing fluttering of steel sheet |
| JP2021049552A (en) * | 2019-09-25 | 2021-04-01 | アートビーム有限会社 | Solder coating device and solder coating method |
-
1984
- 1984-03-16 JP JP3673184U patent/JPS60152672U/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005248305A (en) * | 2004-03-08 | 2005-09-15 | Nippon Steel Corp | Device for suppressing fluttering of steel sheet |
| JP4546116B2 (en) * | 2004-03-08 | 2010-09-15 | 新日本製鐵株式会社 | Steel sheet fluttering suppression device |
| JP2021049552A (en) * | 2019-09-25 | 2021-04-01 | アートビーム有限会社 | Solder coating device and solder coating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6120030Y2 (en) | 1986-06-17 |
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