JPS60146657A - Clamp copying mathod - Google Patents

Abstract

PURPOSE:To permit continuous working when portions exist which do not need copying, by stopping the feed of a tracer head when it reaches a clamp copying neglecting territory on a first clamp level and performing working with the level of a second clamp level. CONSTITUTION:A tracer head moves in the direction of +X with clamp feed speed Vc on first clamp level LCZP. When it reaches a first border line LCXN of clamp copying neglecting territory NCT, the count value N of a counter 108a becomes 3, the clamp feed of the tracer head in the direction of X axis is completed, and instead, the clamp is fed in the direction of Z axis. Next, when the tracer head descends and contacts a model MDL, said count value N becomes 4, the clamp feed in the direction of -Z axis is completed and the normal copying in the direction of surface 1 is executed. When the tracer head reaches a second clamp level LCZN, said value N becomes 5 and the copying in the direction of surface 1 is sompleted so that the tracer head is fed on a second clamp level in the direction of +X.

Description

[Detailed description of the invention]

<Industrial Application Field> The present invention interrupts the profiling process when the tracer head reaches a predetermined clamp level, and then moves the tracer head along the clamp level, so that the tracer head becomes a model. This invention relates to a clamp profiling method that restarts profiling when contact occurs. <Prior art> There is a tracing method that can be achieved by using a clamp. In this clamp tracing method, as shown in Fig. 1, a clamp level LCZ is set in advance, and when the tracer head TC reaches the clamp level, tracing is temporarily interrupted, and the tracer head is moved above the clamp level. This is a method in which the tracer head moves the model MDL by moving it (called clamp feeding) and traces the page after it comes into contact with the model MDL, and there is no need to trace the part below the clamp level, or the amount of machining is excessive. It is effective when applied to processes where the clamp level is sequentially lowered to prevent this (called a clamp tracing cycle). <Disadvantages of the Prior Art> Incidentally, there are cases in which it is not necessary to perform profiling on a portion below the clamp level in a certain area, and it is desired to perform profiling on a portion below the clamp level in another area. Referring to FIG. 2, areas AI, A
In case 2, tracing machining is not required for the portion below the clamp level LCZ, but tracing machining is necessary for the portion below the clamp level LCZ in area A3. Also, in some areas, it is not necessary to perform profile machining on the part below the clamp level, and in other areas, it is necessary to perform profile machining on the part between the clamp level and the level LCZ' below the clamp level. In the area below, it may not be necessary to carry out profile machining for the portion below the level LCZ,'. Referring to FIG. 3, in areas AI and A2, tracing machining is not required for the portions below the clamp level LCZ, and the clamp level L
This is a case in which profiling is required in areas A3 and A4 between CZ and the lower level LCZ', and profiling is not required in area A5 below level LCZ'. However, in the conventional clamp tracing method, the tracer head TC traces the model M on the clamp level LCZ in the direction of the arrow.
Since the clamp feed is carried out until it touches DL, area A3
(Fig. 2), areas A3 and A4 (Fig. 3) could not be patterned. For this reason, the first...
In the case of FIG. 2, it is necessary to follow the procedure of performing tracing machining on the portion above the clamp level LCZ and then performing tracing machining on area A3. In addition, in the case of Fig. 3, it is necessary to perform clamp pattern machining on the portion above the clamp level LCZ, and then set the clamp level to level LCZ' and perform clamp pattern machining on areas A3 and A4. I couldn't get it. For this reason, in the conventional clamp tracing method, the machining shown in FIGS. 2 and 3 must be performed twice by hand, resulting in a decrease in machining efficiency. <Object of the invention> The object of the invention is to
At the same time, a clamp tracing ignore area is set based on the first clamp level, and when the tracer head reaches the clamp tracing ignoring area while moving on the first clamp level, the tracer head reaches the clamp tracing ignoring area based on the first clamp level. To provide a clamp tracing method for performing clamp tracing machining in areas A3 and A4 in FIG. 3 by stopping clamp feeding at and performing clamp tracing machining in which the clamp level is set to a second clamp level in the clamp tracing ignored area. It is. <Summary of the Invention> FIG. 4 is a schematic explanatory diagram of the present invention. In the present invention, a first clamp level LCZP and a second clamp level LCZN lower than the first clamp level are set as clamp levels, and a clamp non-compliance ignoring area N C' T ( L C
X N -L CX P ), and monitor whether the tracer head TC has reached the clamp level ignoring region NCT while moving on the first clamp level L7C22,
When the tracer head reaches the clamp ignoring area NCT, it stops moving above the first clamp level, and then the tracer head is lowered toward the model beyond the first clamp level, and comes into contact with the model MDL to reach the apprentice 2 clamp level. When the tracer head comes into contact with the model while moving on the second clamp level, the tracer head is moved along the model until it reaches the boundary LCXP of the ignored area NCT following the clamp level. When the tracer head reaches the boundary LCXP, the movement of the tracer head foiled on the model is stopped, and then the tracer head is raised to the first clamp level LCZP, After reaching the first clamp level, the tracer head is moved over the first clamp level. <Example> FIG. 5 is a configuration diagram of a machine tool to which the present invention can be applied.
X-axis motor XM that drives table TBL in the X-axis direction
, a Z-axis motor ZM that drives the column CLM on which the tracer head TC and cutter head C1' are attached in the Z-axis direction, a Y-axis motor YM that moves the table TBLAY in the axial direction, and an X-axis motor XM that moves the column CLM by a predetermined amount. Pulse generation IPGX generates one pulse PX every time the Z-axis motor ZM rotates by a predetermined amount, pulse generation @PGZ generates one pulse Pz every time the Z-axis motor ZM rotates by a predetermined amount, and the Y-axis motor YM rotates by a predetermined amount. Pulse generation type PG that generates one pulse py every time
Y is provided. Model MDL on table TBL
and the workpiece WK are fixed, the tracer head TC contacts and follows the surface of the model MDL, and the cutter head CT processes the workpiece WK according to the model shape. As is well known, tracer head TC is xSy on the surface of model MDL. It is configured to detect the displacement εx1εy1εZ of each Z axis, and the displacement in each axial direction detected by the tracer head TC is input to the tracing control device TCC, where a well-known tracing calculation is performed to calculate the displacement in each axial direction. A velocity component of is generated. For example, if we consider surface reciprocating tracing in the x-Z plane as tracing, velocity components Vx, V
z occurs and these

[Respectively servo circuits svx and s
The signal is input to the X-axis and Y-axis motors MXSMZ via VZ, and rotates the respective axis motors XM and ZM. As a result, the cutter head CT moves relative to the workpiece WK, and the workpiece is processed according to the model shape, and the tracer head TC traces the surface of the model MDL. Moreover, each pulse generation ill P G X , P G Z
1P G Y Pulses generated from Px, Pz, Py
It is input to each axis current position register (not shown) in the trajectory control device TCC. Each axis current position register is pulse P
When x, Py, and Pz are input, the contents are counted up or down depending on the direction of movement. Then, the current position in the X-axis direction [Xa must be equal to the X coordinate value The velocity components vy and v2 are generated. The velocity component vy is input to the servo circuit SVY, and as a result, the table TBL is moved in the Y-axis direction, and the surface tracing in the Y-Z plane is performed. When the amount of movement of the table TBL in the Y-axis direction becomes equal to the preset pick feed amount P, the tracing control device TCC thereafter generates a velocity component -V x 1V z with the tracing plane as the X-2 plane, The backward tracing is performed until the current position on the X axis becomes equal to the X coordinate value x2 of the second boundary line XL2 of the tracing area. Thereafter, pick feed, surface tracing in the forward path, pick feed, and surface tracing in the return path are repeated, and when the current position in the Y-axis direction reaches the boundary point of the tracing area in the Y-axis direction, the surface reciprocating tracing ends. FIG. 6 is a block diagram of a profiling control device that implements the clamp profiling method according to the present invention. The tracing control device B includes a displacement synthesis circuit 101, an addition circuit W1.102, a speed signal calculation circuit 103.104, a direction indexing circuit 105, each axis speed calculation circuit 106, and a clamp feed speed generation circuit @10.
7. Distribution circuit i1!19108, current position register 109X, 109Y, 109Z1 position monitoring circuit 110 for each axis,
Comparison circuit 111, approach feed rate generation circuit 112,
It has an operation panel 113. The displacement synthesis circuit 101 receives the axial displacements εX, εy output from the tracer head TC (see FIG. 5). Using εZ, the following formula % formula % (1) is calculated to generate the composite displacement amount ε, and the addition circuit 102
is the difference Δε(−ε
-ε0) and input it to the speed signal calculation circuit 03.104. The speed signal calculation circuit 103 outputs a speed signal VT having a commanded tracing speed F when the difference Δε is O, and outputs a speed signal v inversely proportional to the difference when ΔC or 0.
'r (see Figure 7). Speed signal circuit 910
4 outputs a speed signal VN (see FIG. 7) proportional to the difference Δε. The direction indexing circuit 105 uses the displacement signals tX and tZ in the X-axis direction and the Z-axis direction to calculate displacement direction signals sin θ and cos θ according to the following equation 6 (2) (3). Each axis speed calculation time gl! 106 uses the speed signals VT and VN and the displacement direction signals sin θ and cos θ to form the following equation 6 % (4
) (5) Generate axial speed signals Va and Vb. Clamp feed speed signal circuit 107 generates a clamp speed signal Vc according to commanded clamp feed speed Fc. The distribution circuit 108 receives data DT such as the tracing method, tracing plane, tracing direction, and big feed direction, as well as first and second clamp levels LCZP and LCZN (see Fig. 4).
Va, Vb, and Vc are distributed to each axis based on whether the first and second boundary lines LCXN and LCXP of the clamp-like ignoring region NCT have been reached, etc. If the surface is traversed in one direction, (
al During the tracing operation before reaching the clamp level LCZ, Va is the X-axis feed speed Vx, and vb is the Z-axis feed speed V
When the fbl tracer head TC reaches the first clamp level LCZP (see Figure 4), Vz
= 0 and outputs the clamp speed signal VcltX as the transport speed Vx. Further, the distribution circuit 108 is
((+1) If the tracer head TC follows the clamp while feeding the clamp above the first clamp level, the first
When the boundary line L CX N is reached, Vx=Vy=0 and the clamp speed signal -Vc is changed to the Z transport speed V.
output as z, (dl l, laser head 'rC is V
When the tracer head descends by z and contacts the model MDL, the tracer head outputs as VaIeX-axis feed speed transport x, vbiez-axis feed speed transport z, and (el) until the tracer head reaches the second clamp level LCZN. When the clamp level LCZN is reached, yz=vy=o and the clamp feed speed is set to No. 45 Ver! ! If the tracer head contacts the model MDL while moving on the second clamp level, the X-axis transport speed is output as Vx, and Va is The axis feed speed is Vx, Vz is output as the Z transport speed Vz, and after reaching the fgl second boundary line LCXP, V x = O and the clamp speed signal V
Output c as Z transport speed Vz, (h) When the tracer head rises due to Vz and reaches the first clamp level, output it as clamp feed speed VcttX axis transport speed transport x in the same way as in (b), (i) If the l-laser head contacts the model while moving on the first clamp level LCZP, Va is the X-axis feed rate Vx, and Vb is the Z-axis feed rate V
Output as z. In addition, the distribution port 18108 transports Vale Y-axis feed speed during big feed and outputs it as Vbie Z-axis feed speed transport z, and during approach, it outputs the approach speed generated from the approach feed speed signal generator 112 - Vapie Z-axis feed speed transport. . The position monitoring circuit 110 compares the current positions Xa, Ya, and Za of each axis with the respective numerical values set from the operation panel 113, and if they match, generates a signal TDEN. Note that the position monitoring circuit 110 has two boundary lines xL1 and xL2 in the X-axis direction (transfer direction) that specify the tracing area AR.
Axis coordinate values X3, X2, Y-axis direction that specifies the tracing area (
Y-axis coordinate value y of the end point in the big feed direction), big feed amount P1 Z-axis coordinate value z of the first and second clamp levels LCZP and LCZN in the Z-axis direction (trailing direction),
z2, two boundaries L of the clamp-based ignored region NCT
CXN1LCXP17) X-axis coordinate value entry, x4 values are input. Then, position monitoring time during tracing operation #2+110
(II) Whether the tracer head TC has reached the first clamp level LCZP (Za=z,); (b) The tracer head TC has reached the first boundary line LCXN of the clamp ignoring area NCT (Xa= x3) I, Takado, (C) Tracer head TC is at second clamp level L
(d) The tracer head TC reaches the second boundary line LCxp of the ignored area NCT without clamping (3)! (X a =, x4) (e) Tracer head T C traces area A
Reaching the first boundary line X'LI of R (Xa=x, l) (f) When the tracer head is returned to the starting point by fast forwarding, the second boundary line XL2 of the tracing area AR
(Xa=x,) □, (g) Monitor whether the pick feed is completed (Y-axis direction movement amount = p), and output a signal when (a) to (g) are satisfied. TDEN
occurs. The comparison circuit 111 outputs a contact signal CDEN when the combined displacement amount ε becomes larger than a preset value εa during approach and clamp feeding. FIG. 8 is a block diagram of the distribution circuit 108, and the comparison circuit l
A sequence counter 108a that counts the contact signal CD'E'N output from the l8111 and a signal TDEN output from the position monitoring circuit 110, and a decoder 108b that decodes the count value of the sequence counter 108a.
And the decoding result and data j D T lc base tweet V
It has an analog gate circuit 11f1108c that distributes a, Vb, Vc, and Vap to each axis as Vx, Vy, and Vz. still,
If the count value of the sequence counter 108a is N, then N
' = 1 When 1, the surface 1-direction tracing operation moves towards the first clamp level LCZP, and when it is N-2, the clamp feeding operation moves along the first clamp level to the first boundary @LCXN of the ignored area NCT. , when N=3, the first boundary line LCX of the clamp ignoring area NCT
At N, the clamp feeding motion that lowers the tracer head in the -Z-axis direction is modeled, when N = 4, the surface 1 direction tracing motion toward the second clamp level LCZN is modeled, and when N = 5, the model is modeled above the second clamp level. When the clamp feeding operation moves until it touches the clamp, when N=6, the second boundary of the ignored area NCT follows the clamp! When the surface 1 direction tracing motion toward 31LcXP is N-7, the second boundary 111L
In cXP, when the clamp feed operation that raises the tracer head in the +Z-axis direction to the first clamp level is N=8, the clamp feed operation that moves the tracer head in the +X direction on the first clan i level is N=9. When N=10, the tracer head is traced in one direction toward the first boundary #IXLI of the tracing area AR, when N=10, the tracer head is returned to the starting point in fast forward motion, and when N=11, the approach motion is performed. , when N=12, a pick feed operation is executed. Now, various tracing condition data, first and second clamp levels, tracing area data, clamp tracing ignored area NCT
After setting the data for specifying the
Start approaching towards. Incidentally, when the initial approach speed - Vap is set as the Z transport speed Vz, the distribution circuit 10
Output from B. When the tracer head contacts the model, the amount of displacement εX, εy1 from the tracer head in each axial direction
ε2 occurs. The displacement synthetic concave path 101 calculates the synthetic displacement 1Cte by calculating the formula (1), the addition circuit 4102 calculates the difference Δε between the synthetic displacement amount and the reference displacement amount, and the direction indexing circuit 105 calculates the displacement direction signal cosθ. , sin θ are calculated. The speed signal calculation circuit 103 outputs a speed signal VT according to the set tracing feed speed F and the difference ΔC, and the speed signal calculation circuit 9104 outputs a speed signal VN. , speed signal ■a by +51 formula
Generates 1Vb. Further, in a comparison circuit 18111, the magnitude of the composite displacement amount C and the set level εa are compared. Therefore, when the tracer head TC contacts the model MDL and C≧εa, the comparison circuit 111 outputs the contact signal CDEN. As a result, the It value N of the sequence counter 108a of the distribution circuit 108 becomes 1. When N=1, the analog gate circuit 108c is set to use the t-copy method (assuming that the surface is oriented in one direction) and the profiling plane (x-z
Va is the X-axis feed speed based on the tracing direction (taken as the 10X direction), and vb@z-axis feed transport Vz
Output as . As a result, the tracer head moves in the +X-axis direction and in the -Z-axis direction while following the model. Then, as the tracing progresses and the tracer head reaches the first clamp level LCZP (see FIG. 4), Za=z, and the position monitoring circuit 110 outputs the signal TD.
EN occurs, and the count value N of the sequence counter 108a
becomes 2. When N=2, the analog gate circuit 108c has Vz=0.
．． Let Vx=Vc. As a result, the tracer head stops moving in the Z-axis direction, and the tracer head moves on the first clamp level LCZP at a clamp feed rate of Vc of +X.
direction (clamp feed in the X-axis direction). The tracer head moves in the +X-axis direction by clamp feeding, and the clamp tracing ignore area N (, T's first boundary line L Then, the count value N of the sequence counter 108a becomes 3. If N=3, the analog gate circuit EB108c becomes V
Let x = 0 and Vz = -Vc. As a result of (B), clamp feeding of the tray and head in the X-axis direction is completed, and clamp feeding in the -Z-axis direction is performed instead. When the tracer head descends and contacts the model MDL,
Since C≧ca, a contact signal CDEN is generated from the comparison circuit 11, and the count value N of the sequence counter 108a becomes 4. If N=4, the analog gate circuit 108c is V
Let x = V a and V z = V b. As a result, clamp feeding in the =Z-axis direction is completed, and normal surface unidirectional tracing is thereafter performed. Tracing in one direction on the surface continues, and the tracer head reaches the second clamp level Lczi.
(See FIG. 4), Za=z2, the signal TDEN is generated from the position monitoring circuit 110, and the count value N of the sequence counter 108a becomes five. If N=5, the analog Gert circuit 108'c is Vz
=Vy=0. Let Vx=Vc. As a result, the surface tracing in one direction is completed, and the tray head TC is clamped and fed in the +X direction on the second clamp level. When the tracer head contacts the model MDL by clamp feeding in the +X direction, ε>εa, a contact signal is generated from the comparison circuit 111, and the count value N of the sequence counter 108a becomes 6.
becomes. When N=6, the analog gate circuit 108C has Vx=
Let VaSVz=Vb. As a result, the clamp feeding in the +X direction on the second clamp level is completed, and normal surface unidirectional tracing is thereafter performed. When tracing continues in one direction on the surface and the tracer head reaches the second boundary line LCxP of the clamp tracing ignoring area N C1' (Xa = x, l, the signal TDEN is generated from the position monitoring circuit 110, and the sequence color: / Evening 108
The count value of a is 7. If 11J=7, the analog gate circuit 108c is Vχ
=0 and Vz=Vc. As a result, the surface tracing in one direction is completed, and then the clamp feed is performed in the +Z-axis direction. When the tracer head rises and reaches the first clamp level LCZP (Za-Z,), the signal TDEN is generated from the position monitoring group 1@110, and the count value N of the sequence counter 108a becomes 8. If N=8, the analog gate circuit 108c is Vz
= O, V x = V c . Otsu no result, +
Clamp feed in the Z-axis direction is completed, and the tray head is then clamp fed in the +X direction above the first clamp level L CZ I). When the tray head moves in the +X direction during clamp feeding in the 10X direction and comes into contact with the model MDL, ε≧ca, a contact signal CDEN is generated from the comparison port #5111, and the sequence counter 1'08
The count value N of a is 9. When N=9, the analog gate circuit 108C has V x
= V a , V z = V b) Tor. As a result, the clamp feeding in the +X direction is completed, and normal surface tracing in one direction is performed thereafter. By tracing the surface in one direction, the tracer head moves in the +X direction, and the tracing area AR
When the first boundary line XL, 1 is reached (Xa=x,), the position monitoring circuit 110 generates the signal TDEN, and the sequence counter 108a's total 1i1[(11[N becomes 10. N=10. If so, the analog gate circuit 108C distributes the fast return speed signal generated from the fast return speed signal generation circuit (not shown) to each axis and sets the tracer head to the starting point Ps.
position to. When the tracer head reaches the starting point, that is, the second boundary line XL2 of the tracing area AR (Xa=x2), the position monitoring circuit 110 outputs the signal TD E
N is generated, and the count value N of the sequence counter 108a becomes 11. If N; 11, the analog gate circuit $108C is V
Let x = 0 and V z = -V a p. As a result, the tracer head TC is sent in the −Z-axis direction at the approach speed. If the tracer head 'rC contacts the model, C≧εa, and the contact signal CD is output from the comparison circuit 111.
EN occurs and the count value N of the sequence counter 108a
becomes 12. If N=12, the analog gate circuit $108C is V
Let y = V a and V z = V b. As a result, the approach operation is completed, and the tracer head pick-feeds in the Y-axis direction while following the model MDL, and when the amount of movement in the Y-axis direction becomes equal to the preset pick-feed amount P, the position monitoring circuit A signal TDEN is generated from 110, and the count value of the sequence counter 108a becomes 1. When N=1, the pick feed is completed, and the analog Kate circuit Ri 108e starts tracing the surface in one direction with Vx=Va and Vy=Vb. From then on, the current position in the Y-axis direction reaches the end point in the Y-axis direction of the tracing area AR (Y
The above process is repeated until a = y, ). In the above explanation, the model shape is shown in FIG. 4. However, the present invention is applicable not only to this shape but also to various model shapes. Moreover, although the case where the present invention is applied to surface profiling has been described above, the present invention is not limited to this and can also be applied to manual profiling. Further, although the case where the clamp tracing ignoring area is set in the X-axis direction has been described, it can also be set in the Y-axis direction. <Effects of the Invention> As explained above, according to the present invention, the first and second clamp levels are provided as the clamp levels, and the first and second clamp levels are provided as clamp levels.
A clamp tracing ignoring area is set based on the clamp level, and when the tracer head reaches the clamp tracing ignoring area while moving on the first clamp level, clamp feeding on the first clamp level is stopped, and the clamp is moved over the first clamp level. Since the configuration is configured to perform clamp profiling with the clamp level as the second clamp level in the profiling ignored area, even if there are parts that do not require profiling above and below the part to be profiled, a series of profiling operations can be performed. By this, it is possible to continuously carry out profiling of the part to be profiled, and it is possible to improve machining efficiency.

[Brief explanation of the drawing]

Figure 1 is an explanatory diagram of the conventional clamp profile, Figures 2 and 3.
Figure 4 is an explanatory diagram of the drawbacks of the conventional clamp 4. Figure 4 is a schematic diagram of the glue clamp tracing method of the present invention. Figure 5 is a configuration diagram of a tracing machine tool to which the present invention can be applied. Figure 6 is the diagram of the present invention. Fig. 7 is a block diagram of a profiling device that realizes
FIG. 8 is a block diagram of the distribution circuit. TC...Tracer head, MDL...Model LCZP...
・First clamp level, LCZN...Second clamp level, NCT...Clamp tracing ignored area, 101...Displacement synthesis circuit, 102...Addition circuit 103.
104...Speed signal wave W rotation consultation, 105...Direction indexing circuit, 106...Each axis speed calculation circuit, 107...Clamp tracing feed speed generation circuit, 108...Distribution @ path, 110...
・Position monitoring circuit, 111...Comparison circuit, 112...Approach feed speed signal generation circuit, 113...Operation panel patent applicant Chiki Saito, agent of FANUC Co., Ltd., patent attorney Figure 1 Figure 2 Figure 3 Figure 1z violence

Claims (2)

[Claims] (1) The tracer head is used to curve the model, the tool is moved according to the movement of the tracer head, and the tool is used to process the workpiece according to the model shape, so that the tracer head is shaped in advance. In the clamp profiling method, the profiling process is stopped when the clamp level is reached, the tracer head is moved along the corresponding acid-soaked clamp level, and the profiling process is resumed when the tracer head contacts the model. By setting a first clamp level and a second clamp level below the first clamp level, a clamp ignoring area based on the first clamp level is set and the tracer head moves above the first clamp level. During the movement, it is monitored whether or not the clamp level ignored area is reached, and when the tracer head reaches the clamp level ignored area, the movement on the first clamp level is stopped, and then the tracer head is moved beyond the first clamp level. The tracer head is lowered in the direction of the model, and after contacting the model, the tracer head is moved along the model until it reaches the second clamp level, and the tracer head is moved to the second clamp level. A clamp tracing method characterized by moving on a second clamp level. (2) When the tracer head comes into contact with the model while moving above the second clamp level, the tracer head will no longer follow the clamp pattern.
The tracer head is moved along the model until it reaches the boundary of the ignored area, and the tracing process is performed. When the tracer head reaches the boundary, the movement of the tracer head along the model is stopped, and then the tracer head is moved. The clamp tracing method according to claim 1, characterized in that the tracer head is raised to a first clamp level, and after reaching the first clamp level, the tracer head is moved on the first clamp level.