JPS60146358U - optical coupler - Google Patents

optical coupler

Info

Publication number
JPS60146358U
JPS60146358U JP1984032864U JP3286484U JPS60146358U JP S60146358 U JPS60146358 U JP S60146358U JP 1984032864 U JP1984032864 U JP 1984032864U JP 3286484 U JP3286484 U JP 3286484U JP S60146358 U JPS60146358 U JP S60146358U
Authority
JP
Japan
Prior art keywords
light
optical coupler
substrates
emitting element
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984032864U
Other languages
Japanese (ja)
Inventor
中山　正一郎
勝 武内
三郎 中島
中野　昭一
桑野　幸徳
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP1984032864U priority Critical patent/JPS60146358U/en
Publication of JPS60146358U publication Critical patent/JPS60146358U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例を示す断面図、第２図及び第３図は本考
案の一実施例を示し、第２図ａは受光素子側から見た平
面図、第２図すは同図ａの右側面図、第２図Ｃは発光素
子側から見た平面図、第２図ｄは同図Ｃに於けるｄ−ｄ
’線断面図、第３図は分解斜視図、を夫々示している。 １０・・・発光素子、１１・・・発光素子、１２．１３
・・・第１、第２基板、１２ｂ、１３ｂ・・・支持面、
２０　ａｔ　　２０　ｂｖ　　２１　ａｔ　　２　ｌ　
ｂ”・リードフレーム。Fig. 1 is a sectional view showing a conventional example, Figs. 2 and 3 show an embodiment of the present invention, Fig. 2a is a plan view seen from the light receiving element side, and Fig. 2a is a plan view of the present invention. 2C is a plan view seen from the light-emitting element side, and 2D is a right side view of the same figure C.
Figure 3 shows a line sectional view and an exploded perspective view. 10... Light emitting element, 11... Light emitting element, 12.13
...first and second substrates, 12b, 13b...support surface,
20 at 20 bv 21 at 2 l
b”・Lead frame.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）発光素子及び受光素子と、該画素子を夫々の支持
面に於いて支持する一対の絶縁性且つ透光性の基板と、
上記発光素子及び受光素子と電気的に連なる複数のリー
ド体と、を備え、上記リード体の少くとも一つは、上記
一対の透光性基板の夫々の支持面に対し逆方向の背面側
を対向させた状態で両送光性の基板を挟持し、上記発光
素子及び受光素子を光学的に結合したことを特徴とする
光結合器。(1) a light-emitting element, a light-receiving element, and a pair of insulating and translucent substrates that support the pixel elements on their respective support surfaces;
a plurality of lead bodies electrically connected to the light-emitting element and the light-receiving element, at least one of the lead bodies having a rear side facing in an opposite direction to each supporting surface of the pair of light-transmitting substrates; An optical coupler characterized in that the light-emitting element and the light-receiving element are optically coupled by sandwiching both light-transmitting substrates in a state where they face each other. （２）上記複数のリード体は一方の基板の支持面に機械
的に固着されたリードフレームから成る実用新案登録請
求の範囲第１項記載の光結合器。(2) The optical coupler according to claim 1, wherein the plurality of lead bodies are comprised of a lead frame mechanically fixed to the support surface of one of the substrates.
JP1984032864U 1984-03-07 1984-03-07 optical coupler Pending JPS60146358U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984032864U JPS60146358U (en) 1984-03-07 1984-03-07 optical coupler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984032864U JPS60146358U (en) 1984-03-07 1984-03-07 optical coupler

Publications (1)

Publication Number Publication Date
JPS60146358U true JPS60146358U (en) 1985-09-28

Family

ID=30534774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984032864U Pending JPS60146358U (en) 1984-03-07 1984-03-07 optical coupler

Country Status (1)

Country Link
JP (1) JPS60146358U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01279382A (en) * 1988-05-02 1989-11-09 Matsushita Electric Ind Co Ltd Optical pattern detector and its manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01279382A (en) * 1988-05-02 1989-11-09 Matsushita Electric Ind Co Ltd Optical pattern detector and its manufacture

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