JPS60141570A - Thermal head - Google Patents

Abstract

PURPOSE:To eliminate the need for an image signal converting function, by a method wherein image signals inputted first into an integrated circuit are transmitted to the uppermost part of a row of heating resistors, in a thermal head for printing. CONSTITUTION:The image signals first inputted into an integrated circuit IC2 are transferred to a shift register provided at a bonding terminal T1' part, and are transmitted to a heating resistor R1' through a conductor L1''. Namely, the order of the image signals is Pm1,...Pq, Pp,...,P2, P1 in the case of an integrated circuit IC1, and the order is Pm',...,Pq', Pp',...P, P2', P1' in the case of the integrated circuit IC2. When P=P', the image signals read by a single image sensor are simply transmitted twice to the integrated circuits IC1 and IC2, whereby the thermal head functions sufficiently. Accordingly, the thermal head does not need an image signal converting function.

Description

[Detailed description of the invention] (Technical field) The present invention relates to a thermal spatula (K) for printing and recording.

(Prior Art) Conventionally, many types of printing methods have been used in printers for information processing devices, one of which is a method using a thermal head.

FIG. 1 is a plan view of essential parts of an example of a conventional thermal head for a 7real e-printer.

A pair of heating resistor rows R1 to Rm on both the left and right sides of the common terminal C
and R'1 to Rm' are reversely connected by a conductor branched into a rectangular shape. A first individual conductor group L is provided at the other end of the heating resistor.
1 to Lm and the second individual conductor group L1 to Lm are connected,
The other ends of these individual conductor groups are connected to the driving integrated circuit IC and the bonding terminals T1-Tm and T1-Tr of IC2.
It is formed to extend to be connected to n'. An insulating layer is provided on these individual conductors L1 to Lm and Li to Lm', and an integrated circuit IC is provided on top of the insulating layer as shown by dotted lines in the figure.
I and IC2 are mounted, and the electrodes of the integrated circuit and bonding terminals T1-
Tm.

Tm/ is connected.

Now, the image signal to be printed and recorded by energizing the heating resistor type ~Rm and R'l~Rm' is generally generated using an integrated circuit ICI.
, the heating resistor R1~ by the shift register in IC2
It is transferred to the part corresponding to Km, g to M and is latched by the false circuit. Based on the latched image signal, the drive circuit turns on and off, energizes the heating resistor for a required period of time, and prints the thermal image on recording paper.

Therefore, the image signal is pushed through the soft register in the integrated circuit and transferred.

Now, let this image signal be P or y, and it is transferred from the shift register corresponding to the heating resistor to the shift register corresponding to the lower left terminal, and then from the shift register corresponding to the lower right terminal to the shift register corresponding to the upper right terminal. It is assumed that the data is sequentially transferred to the register.

Here, an explanation will be given taking the integrated circuit ICI as an example.

The image signal is sent from the shift register of the Tm section "qr Tp
section and is pushed out to the shift register of section T1. Therefore, as an image signal, P+ (an image signal corresponding to the heating resistor ■t1) is first input into the ICI, then Ptk is input, and finally Pm is input.

This series of image signals is Pm,..., Pq, Pp,...
・Described as + “2 +”1. As a result, the first input image signal is transmitted to R1, which is the top of the heating resistor array P, ~ m, and the last input image signal is transmitted to Rm, which is the lowest of the heating resistor array. be done.

However, in the case of the integrated circuit IC2, the image signals are i:';, R4,..., l'q,..., Pm
must be input into the integrated circuit in the following order: That is, the first input image signal is
The image signal is transmitted to Rrn', which is the lowest level of Rrn', and the last input image signal is transmitted to the horse, which is the highest level. Therefore, like a preheating type serial head, "1"P'1
+P2 = P'2, ---, Pm = Pm', that is, when P and P' are the same image signal, the image signal input into rc2 (or IC1) is I
The order had to be converted and created from the image signal of C1 (or IC2) using a computer or the like. Therefore, the conventional printer or facsimile device using a thermal head has the drawback of being expensive. Our goal is to provide a thermal head that does not.

(Structure of the Invention) The thermal head of the present invention includes a common electrode, a pair of heating resistor rows arranged in the left-right direction of the common electrode and connected to the common electrode, and driving the pair of heating resistor rows, respectively. at least a pair of integrated circuits, one end of which is connected to the bonding terminal of one of the integrated circuits through the bottom surface of one of the integrated circuits, and the other end of which is connected to the bonding terminal of the one of the integrated circuits; a first individual conductor connected to each heat generating resistor of one of the heat generating resistor rows, and a bonding terminal of the other integrated circuit passing through the lower surface of the other integrated circuit of the pair of integrated circuits; a second individual conductor having one end connected to a part of the heating resistor and the other end connected to a part of the heating resistor of the other of the pair of heating resistor rows, and an outer edge of the other integrated circuit; and a third individual conductor whose one end is connected to the remaining bonding terminals of the other integrated circuit from the direction and whose other end is connected to the remaining heating resistors of the other row.

(Example) Next, embodiments of the present invention will be described using the drawings.

FIG. 2 is a plan view of essential parts of an embodiment of the present invention. This embodiment includes a common electrode C, a pair of heat generating resistor rows R1 to Rm and R4 to Rm/ arranged in the left and right direction of this common electrode C and connected to the common electrode C, and this pair of heat generating resistor rows. A pair of integrated circuits ICI and IC2 respectively drive
- first individual conductors L1 to Lm having one end connected to Tm and the other end respectively connecting to each heating resistor R1 to Rm of one of the pair of heating resistor rows; Some of the bonding terminals T1 to T of the other integrated circuit IC2 pass through the bottom surface of the other integrated circuit IC2 of the integrated circuits.
second individual conductors L1 to Ld whose one end is connected to p/ and whose other end is connected to a part of the heat generating resistor R1-p' of the other row of the pair of heat generating resistor rows, respectively; , one end is connected to the remaining bonding terminals 'Pq/~Tm' of the other integrated circuit IC2 through the bottom surface of the other integrated circuit IC2, and the other end is connected to the remaining heat generating resistors Rq'~Rm in the other column. and third individual conductors L q/ to Lm' respectively connected to the respective conductors L q/ to Lm'. Note that the second individual conductors L1 to L p/
The conductors Lτ to Lp", which form part of the circuit, are made of multilayer wiring with an insulating layer interposed therebetween.

In the thermal head configured in this way, the image signal first input into the integrated circuit IC2 is transferred to the shift register of the bonding terminal η section, passes through the conductor L7, and is transmitted to the heating resistor R1-. . That is, in the case of the integrated circuit ICI, the image signal order is Pm, -, Pq,
Pp , −, P, , P, asi, integrated circuit IC2
In the case of Pm', ・-, Pq', Pp', ・-
・, P′2°Pl. Therefore, in the case of P-P', the thermal head functions sufficiently by simply transmitting the image signal read by a single image sensor twice to ICI and C2, and one image signal can be transmitted. The thermal head does not require any conversion function.

In this way, the image signals that are first input into the pair of integrated circuits are transmitted to the top of the rows of heating resistors arranged in parallel. Therefore, a pair of integrated circuits IC1.

Of course, the image signals input to IC2 do not necessarily have to be equal. That is, 5 heating resistor rows ~P
Unlike the case where Lm, R', ~ m' are simply arranged in parallel (the heights are the same in the main scanning direction of the thermal head), they are arranged in staggered arrangement (the heights are different in the main scanning direction of the thermal head). (array), it can of course be set to P〆■'. Further, in the individual conductors of the integrated circuit IC2, contrary to the conventional example shown in FIG.
L p/ is formed in a single layer, and the third conductor L q/~L
Even if the door is formed using multilayer wiring technology, the effects of the present invention will not be impaired in any way. Also, the number of shift registers and the number of heating resistors in an integrated circuit do not necessarily match.
The number of heating resistors can be arbitrarily selected depending on the application.

In the above embodiment, the thermal head is used which transmits the image signal inputted into the integrated circuit to the top of the heat generating resistor array. By applying this technique, it is possible to create a thermal head that transmits the image signals that are first input into the integrated circuit to the lowest part of the heating resistor array. Furthermore, the image signal transfer direction within the integrated circuit is not necessarily Tm-+T.
It is not restricted to the direction of q→Tp−>T,
The direction can also be TI→Tp-+Tq-+Tm. In this case, the image signal that is first input into the integrated circuit becomes a thermal head that is transmitted to the lowest part of the heating resistor array.

(Effects of the Invention) As described above in detail, according to the present invention, a thermal head that does not require an image signal converter can be obtained.

[Brief explanation of the drawing]

Figure 1 is a plan view of the main parts of an example of a conventional thermal head.
FIG. 2 is a plan view of essential parts of an embodiment of the present invention. C... Common electrode, ICI, IC2 --- integrated circuit. L1~Lm, Li~L'm, Lγ~Lp"...
...Individual isoelectric body, 1 (1~Rm, R1~Rm', old...heating resistor, ``+~'L''m. U~Trn'...bonding terminal.

Claims (1)

[Claims] a common electrode, a pair of heating resistor rows arranged in the left-right direction of the common electrode and connected to the common electrode, at least a pair of integrated circuits each driving the pair of heating resistor rows; Each heating resistor of one heating resistor row of the pair of heating resistor rows has one end connected to a bonding terminal of the one integrated circuit through the bottom surface of one of the integrated circuits, and the other end connected to the bonding terminal of the one integrated circuit. first individual conductors respectively connected to the body, one end connected to a part of the bonding terminal of the other integrated circuit through the lower surface of the other integrated circuit of the pair of integrated circuits, and the other end connected to the bonding terminal of the other integrated circuit; a second individual conductor respectively connected to a part of the heating resistor of the other row of the pair of heating resistor rows; A thermal head comprising: third individual conductors having one end connected to the bonding terminal and the other end respectively connecting to the remaining heating resistors in the other row.