JPS60140758U - 真空作業装置 - Google Patents
真空作業装置Info
- Publication number
- JPS60140758U JPS60140758U JP2817184U JP2817184U JPS60140758U JP S60140758 U JPS60140758 U JP S60140758U JP 2817184 U JP2817184 U JP 2817184U JP 2817184 U JP2817184 U JP 2817184U JP S60140758 U JPS60140758 U JP S60140758U
- Authority
- JP
- Japan
- Prior art keywords
- work equipment
- vacuum work
- vacuum
- vacuum working
- cryopump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001771 vacuum deposition Methods 0.000 description 2
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2817184U JPS60140758U (ja) | 1984-02-27 | 1984-02-27 | 真空作業装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2817184U JPS60140758U (ja) | 1984-02-27 | 1984-02-27 | 真空作業装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60140758U true JPS60140758U (ja) | 1985-09-18 |
| JPS6328203Y2 JPS6328203Y2 (enrdf_load_stackoverflow) | 1988-07-29 |
Family
ID=30525807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2817184U Granted JPS60140758U (ja) | 1984-02-27 | 1984-02-27 | 真空作業装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60140758U (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002015998A (ja) * | 2000-02-24 | 2002-01-18 | Applied Materials Inc | 半導体ウェーハ処理チャンバーから装置をシールドするための方法及び装置 |
-
1984
- 1984-02-27 JP JP2817184U patent/JPS60140758U/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002015998A (ja) * | 2000-02-24 | 2002-01-18 | Applied Materials Inc | 半導体ウェーハ処理チャンバーから装置をシールドするための方法及び装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6328203Y2 (enrdf_load_stackoverflow) | 1988-07-29 |
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