JPS60135549A - Dental metallic material - Google Patents

Dental metallic material

Info

Publication number
JPS60135549A
JPS60135549A JP58240935A JP24093583A JPS60135549A JP S60135549 A JPS60135549 A JP S60135549A JP 58240935 A JP58240935 A JP 58240935A JP 24093583 A JP24093583 A JP 24093583A JP S60135549 A JPS60135549 A JP S60135549A
Authority
JP
Japan
Prior art keywords
dental
alloy
metal
metallic material
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58240935A
Other languages
Japanese (ja)
Other versions
JPS633016B2 (en
Inventor
Kengo Inage
稲毛 賢吾
Hiromi Hasegawa
博巳 長谷川
Takashi Nara
奈良 喬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuriki Honten Co Ltd
Original Assignee
Tokuriki Honten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuriki Honten Co Ltd filed Critical Tokuriki Honten Co Ltd
Priority to JP58240935A priority Critical patent/JPS60135549A/en
Publication of JPS60135549A publication Critical patent/JPS60135549A/en
Publication of JPS633016B2 publication Critical patent/JPS633016B2/ja
Granted legal-status Critical Current

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  • Dental Preparations (AREA)

Abstract

PURPOSE:To obtain a nonpoisonous dental metallic material having a low m.p. by specifying the composition of an alloy consisting of In, Sn, Ga and Ba, Cd, Sb, Mg, Ca, Li, Bi or Pd or further contg. Ag, Al, Zn, Au or Cu. CONSTITUTION:This dental metallic material used after mixing and kneading with metallic powder is a quaternary or higher multicomponent alloy having <=15 deg.C m.p. and consisting of 1-45wt% In, 1-30wt% Sn, 0.05-25wt% one or more among Ba, Cd, Sb, Mg, Ca, Li, Bi and Pd combined optionally with one or more among Ag, Al, Zn, Au and Cu, and the balance Ga. The material has a great affinity for other metal, and the corrosion resistance and mechanical characteristics can be improved by adding various metals.

Description

【発明の詳細な説明】 本発明は歯科用金属材料に関する。[Detailed description of the invention] The present invention relates to dental metal materials.

歯牙の窩洞修復用に充填する歯科用金属材料どして、従
来よりアマルガムが用いられている。これは液体のHg
に金属粉末を混入、練和するもので金属粉末としては通
常Ag+ Sn 、 A、!7 + ZnまたはA、9
十S n +Zn等が用いられている。
Amalgam has traditionally been used as a dental metal material for filling dental cavities. This is liquid Hg
The metal powder is usually mixed with Ag+Sn, A,! 7 + Zn or A, 9
10S n +Zn etc. are used.

このアマルガムは上記した如く1(Iを用いるためにそ
の毒性が問題となり、常温においても蒸気となって毒性
雰囲気を作るために歯科医等に悪い影響を与え、さらに
常時歯牙に充填されている患者にも何らかの悪い影響が
あることが考えられている。
As mentioned above, since this amalgam uses 1 (I), its toxicity becomes a problem, and it turns into vapor even at room temperature, creating a toxic atmosphere, which has a negative impact on dentists, etc., and furthermore, it has a negative impact on dentists, etc., and patients whose teeth are constantly filled with It is believed that there are some negative effects on

しかし、このアマルガムは用法が容易であるために毒性
の心配があるにもかかわらず使用がつづけられているの
が現状である。しかし、Hgに代わる金属の研究も進ん
でいる。既にGa単体やQaの二元合金が研究されてい
る。Gaは毒性が無く、融点が約30℃であるためにそ
の融点を下げるためにInを加えることにより17℃に
下げることができるが未だ使用するには融点が高く作業
性が良好でないもので広く使用されるには至っていない
However, because this amalgam is easy to use, it continues to be used despite concerns about toxicity. However, research on metals to replace Hg is also progressing. Already research has been carried out on Ga alone and binary alloys of Qa. Ga is non-toxic and has a melting point of about 30°C, which can be lowered to 17°C by adding In to lower the melting point, but it is still too high for use and does not have good workability, so it is not widely used. It has not yet been used.

本発明は毒性が無くしかも15℃以下の融点を有する歯
科用合金材料を得ることを目的とし、Gaを含む四元以
上の多元合金より成り、他の金属との親和性が良くしか
も各種金属の添加により耐食性および機械的特性などが
向上する歯科用金属材料としたことを特徴とする特 以下に本発明の詳細な説明する。
The purpose of the present invention is to obtain a dental alloy material that is non-toxic and has a melting point of 15°C or less, which is made of a multi-component alloy of quaternary or higher elements containing Ga, has good affinity with other metals, and is compatible with various metals. The present invention will be described in detail below, which is characterized in that it is a dental metal material whose corrosion resistance and mechanical properties are improved by addition.

本発明はGa−In−8nの三元素にBa、cd、Sl
、Sb1M1/、 Ca、 T、i、 Bi、 Pdの
一元もしくは二元以上を微少添加するもので、さらに場
合に応じてAg、 Al、 Zn。
The present invention uses Ba, cd, and Sl in the three elements of Ga-In-8n.
, Sb1M1/, Ca, T, i, Bi, Pd or more are added in small amounts, and Ag, Al, and Zn depending on the case.

Au、Cuを一元もしくは二元以上加えた多元合金とす
ることにより15℃以下の融点を有する金属となった。
By creating a multi-component alloy containing one or more elements of Au and Cu, the metal has a melting point of 15° C. or lower.

上記したGa−In−8nの三元合金でも上記した従来
の欠点を解決するに充分であるが本発明によると、Qa
−In−8nに対し拡散の速度が遅く、常温付近におい
て液体のGa−In−8n K Ba、 cd、 S 
i、 sb、 Ml。
Although the above-mentioned ternary alloy of Ga-In-8n is sufficient to solve the above-mentioned conventional drawbacks, according to the present invention, Qa
-Ga-In-8n has a slower diffusion rate than In-8n and is liquid at around room temperature.Ba, cd, S
i, sb, Ml.

Ca、 Li、 Bi、 Pbの一元もしくは二元以上
を添加したとき、速やかな凝固温度の変化は起らずにQ
a−In−8nの中で添加物の本来の組織が存続し、G
a−In−SnとBa、 Cd、 S i、 sb、 
Mfl、 Ca、 Li、 Bi、 Pdの一元または
二元以上の金属の添加物の混在した状態が現われる。こ
の状態はこの混在した系のものを加熱もしくは長時間放
置すればGa−In−8nに対して添加元素の固溶限界
まで拡散して合金となる。
When one or more of Ca, Li, Bi, and Pb are added, Q.
The original structure of the additive remains in a-In-8n, and G
a-In-Sn and Ba, Cd, Si, sb,
A state in which additives of one or more metals such as Mfl, Ca, Li, Bi, and Pd are mixed appears. In this state, if this mixed system is heated or left for a long time, the additive element will diffuse into Ga-In-8n to the solid solubility limit and form an alloy.

すなわちGa−In−8nに上記添加元素を添加するこ
とにより、経時的にその組織が変化する金属を得ること
ができることに々る。
That is, by adding the above additive elements to Ga-In-8n, it is possible to obtain a metal whose structure changes over time.

そこで、Ga 58W%、 In 24w%、 Sn 
8W% とした基合金に対してアトマ・イズ製法で得ら
れたアンチモン粉末を基合金の20%の重量となるよう
に添加し、よく練和したものを約180℃の恒温槽に入
れ、3時間後出したところ固化しており、冷却後圧縮試
験機にて圧縮強さを測定したところ約1に2/、、lI
で破砕した。
Therefore, Ga 58W%, In 24w%, Sn
Antimony powder obtained by the Atoma-Izu manufacturing method was added to the base alloy with a concentration of 8W% to give a weight of 20% of the base alloy. When taken out after a period of time, it had solidified, and after cooling, the compressive strength was measured using a compression testing machine, and the compressive strength was approximately 1 to 2/, lI
It was crushed with

次に、Ga 68W%、 In 24W%、5n8W%
とした基合金にAg66W% S n 25 W % 
t Zn9 W%の合金の250メツシユのアトマイズ
粉を基合金と同重量配合してよく練和したものを約40
℃の恒温槽に入れ3時間後出して圧縮試験を行なったと
ころ約12Kか−となり圧縮変形した。
Next, Ga 68W%, In 24W%, 5n8W%
Ag66W% Sn25W% in the base alloy
Approximately 40 mesh of atomized powder of tZn9W% alloy was blended with the same weight as the base alloy and kneaded well.
When it was placed in a constant temperature bath at 0.degree. C. for 3 hours and then taken out and subjected to a compression test, the temperature was about 12K, resulting in compression deformation.

さらに実験の結果、In 1〜45W%、 Sn 1〜
30W%にBa、 Cd、 S i、 sb、 Ml、
 Ca、 Li、 Bi、 Pdの一元もしくは二元以
上の添加元素群、および場合に応じて上記添加元素群に
19. A、l、 ZIT、 Au、 Cuを一元もし
くは二元以上加え7j0.05〜25w係残部をGa3
− とすることにより15℃以下の融点を有する歯科用金属
とすることができる。
Furthermore, as a result of the experiment, In 1~45W%, Sn 1~
30W% contains Ba, Cd, Si, sb, Ml,
19. Additive element group of one or more elements of Ca, Li, Bi, Pd, and depending on the case, to the above additive element group. A, l, ZIT, Au, Cu is added in one or two or more elements, and the remaining part of 7j0.05~25w is Ga3
- By setting it as such, a dental metal having a melting point of 15°C or lower can be obtained.

以上の四元以上の多元合金による金属は従来のHLfと
同様に、使用に際してこれを金属粉末と混合、混和して
歯科用材料として用いるものであるが、本金属は合金で
あるために従来歴がAll”+Sn。
The above-mentioned metals made of quaternary or higher multi-component alloys are used as dental materials by mixing them with metal powder when used, just like conventional HLf, but since this metal is an alloy, there is no conventional history. is All"+Sn.

AP + Z nまだはA?+Sn+Zn等の二元以上
の金属粉末と混合していたのに対しこれらの金属粉末は
熱論のことAj? 、 S nまたはZnの単体粉末と
混合しても充分に歯科用材料として使用可能である。
AP + Z n Still A? While it was mixed with metal powders of two or more elements such as +Sn+Zn, these metal powders are heat-resistant. , Sn or Zn alone can be sufficiently used as a dental material.

一般にある温度における液体はその融点が低いほど自由
エネルギーが大きい。従って本発明はGa単体やGa−
In二元系に比べてもある金属や合金に対する拡散速度
は増大する。
Generally, the lower the melting point of a liquid at a certain temperature, the greater its free energy. Therefore, the present invention is applicable to Ga alone or Ga-
The diffusion rate for certain metals and alloys is increased compared to the In binary system.

また、本発明は四元以上の多元合金としたことにより表
面張力を下げることができ、他金属等へのぬれ性を向上
させ、さらに多元系であることにより他金属または合金
への拡散を増大させることができる。
In addition, by using a multi-component alloy of quaternary or higher elements, the present invention can lower surface tension, improve wettability to other metals, etc., and furthermore, because it is a multi-component alloy, diffusion to other metals or alloys is increased. can be done.

従って歯科用金属粉末と混和し、充填固化させ4− るに際しては上記理由によりGa単体やGa−Inの二
元系に比べて非常にすぐれた歯科用金属として利用する
ことができる。
Therefore, when mixed with dental metal powder and filled and solidified, it can be used as a dental metal that is much better than Ga alone or a binary system of Ga-In for the above reasons.

以上の本発明によるとGa−In−8nの三元合金にB
a、 Cd、 Si、 Sb、 Ml、 Ca、 Li
、 Bi、 Pdの一元もしくは二元以上を微少添加し
たもので、さらに場合に応じて上記元素群にA 9 +
 A I+ Zn 、 A u、 Cuを一元もしくは
二元以上加えた多元合金としたことにより、歯質および
他の金属に対してすぐれたぬれ性を有し、歯牙の窩洞充
填に用いたときに歯質との間に隙間が生ずることもなく
、しかも融点が低いために使用に際しても作業性は極め
て良好となる。
According to the present invention, B is added to the Ga-In-8n ternary alloy.
a, Cd, Si, Sb, Ml, Ca, Li
A 9 +
By making it a multi-component alloy containing one or two or more of Zn, Au, and Cu, it has excellent wettability to tooth substance and other metals, and when used for filling tooth cavities, it Since there are no gaps between the materials and the material, and the melting point is low, the workability is extremely good during use.

また、生体反応における毒性は全く無く、歯科用金属と
して適するもので、単に窩洞修復のみならず義歯の修復
および歯科用の鋳造金属床の修復に用いて有用である。
In addition, it has no toxicity in biological reactions and is suitable as a dental metal, and is useful not only for cavity repair but also for denture repair and dental cast metal floor repair.

特許出願人 株式会社徳力本店 代理人 弁理士 金 倉 喬 二Patent applicant: Tokuriki Honten Co., Ltd. Agent Patent attorney Takashi Kanekura

Claims (1)

【特許請求の範囲】[Claims] 1 金属粉末を混入、練和して用いる歯科用金属材料に
おいて、In1〜45W%、 Sn 1〜30W%とB
a、 ca、 sb、 M9. Ca、 Li、 Bi
、 paの一元もしくは二元以上さらにこれに場合に応
じてA、9. A4゜Zn、 Au、 Cuを一元もし
くは二元以上の元素を加えた0、05〜25W%および
残部Gaとしたことにより15℃以下の融点を持った四
元以上の多元合金としたことを特徴とする歯科用金属材
料。
1 In a dental metal material used by mixing and kneading metal powder, In 1 to 45 W%, Sn 1 to 30 W% and B
a, ca, sb, M9. Ca, Li, Bi
, one or two or more elements of pa, and A, 9. depending on the case. A4゜A multi-element alloy of quaternary or higher elements with a melting point of 15°C or lower by adding 0.05 to 25 W% of Zn, Au, and Cu with one or more elements and the balance being Ga. dental metal materials.
JP58240935A 1983-12-22 1983-12-22 Dental metallic material Granted JPS60135549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58240935A JPS60135549A (en) 1983-12-22 1983-12-22 Dental metallic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58240935A JPS60135549A (en) 1983-12-22 1983-12-22 Dental metallic material

Publications (2)

Publication Number Publication Date
JPS60135549A true JPS60135549A (en) 1985-07-18
JPS633016B2 JPS633016B2 (en) 1988-01-21

Family

ID=17066830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58240935A Granted JPS60135549A (en) 1983-12-22 1983-12-22 Dental metallic material

Country Status (1)

Country Link
JP (1) JPS60135549A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006144112A (en) * 2004-10-20 2006-06-08 Dainippon Printing Co Ltd Ga-BASE ALLOY AND ORGANIC FUNCTION ELEMENT USING THE SAME
CN115537624A (en) * 2022-09-30 2022-12-30 中国航发北京航空材料研究院 Material for precision forming of flexible body, matched mould and preparation method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020250811A1 (en) 2019-06-13 2020-12-17 福田金属箔粉工業株式会社 Copper powder for laminate shaping, laminate shaped body, method for manufacturing laminate shaped body, and laminate shaping apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5017092A (en) * 1973-06-20 1975-02-22
JPS5060421A (en) * 1973-09-29 1975-05-24
JPS5346418A (en) * 1976-10-08 1978-04-26 Seiko Epson Corp Low melting point alloy

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5017092A (en) * 1973-06-20 1975-02-22
JPS5060421A (en) * 1973-09-29 1975-05-24
JPS5346418A (en) * 1976-10-08 1978-04-26 Seiko Epson Corp Low melting point alloy

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006144112A (en) * 2004-10-20 2006-06-08 Dainippon Printing Co Ltd Ga-BASE ALLOY AND ORGANIC FUNCTION ELEMENT USING THE SAME
CN115537624A (en) * 2022-09-30 2022-12-30 中国航发北京航空材料研究院 Material for precision forming of flexible body, matched mould and preparation method
CN115537624B (en) * 2022-09-30 2023-11-21 中国航发北京航空材料研究院 Material for precision forming of flexible body, matched die and preparation method

Also Published As

Publication number Publication date
JPS633016B2 (en) 1988-01-21

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