JPS60131138A - Lead wire bender - Google Patents

Lead wire bender

Info

Publication number
JPS60131138A
JPS60131138A JP58240114A JP24011483A JPS60131138A JP S60131138 A JPS60131138 A JP S60131138A JP 58240114 A JP58240114 A JP 58240114A JP 24011483 A JP24011483 A JP 24011483A JP S60131138 A JPS60131138 A JP S60131138A
Authority
JP
Japan
Prior art keywords
lead wire
slide
bending
data
pulse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58240114A
Other languages
Japanese (ja)
Inventor
Shinichi Aono
Akira Hirai
Takeshi Kuribayashi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP58240114A priority Critical patent/JPS60131138A/en
Publication of JPS60131138A publication Critical patent/JPS60131138A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0473Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board

Abstract

PURPOSE:To perform the bending work of a lead wire in a proper manner according to thickness in a printed circuit board, by installing a mechanism, which makes a lead wire bending mechanism body slide to the PCB side, and a device, which controls the slide stroke, both in a lead wire bender. CONSTITUTION:When NC date is inputted out of a control panel 8, an NC controller 13 converts this NC data into the specified pulse number, transmitting it to a motor driver 14, and the pulse number is amplified, thereby driving a pulse motor 16. Rotation of this pulse motor 16 is transmitted to a screw 18 via a transducer 17. Since a screw thread is cut in this screw 18, a slide mechanism 19 moves as much an extent as proportionate to the number of revolutions. As a result, a lead wire bending mechanism body 7 contacting the slide mechanism 19 from a fixed part 20 through a spring 21 moves up or down as much as necessary in consequence. That is to say, NC data is set up according to thickness in a printed circuit board 3, and this data is transmitted to the NC controller 13 whereby the bending mechanism body 7 is thus set up at an optimum position.
JP58240114A 1983-12-20 1983-12-20 Lead wire bender Pending JPS60131138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58240114A JPS60131138A (en) 1983-12-20 1983-12-20 Lead wire bender

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58240114A JPS60131138A (en) 1983-12-20 1983-12-20 Lead wire bender

Publications (1)

Publication Number Publication Date
JPS60131138A true JPS60131138A (en) 1985-07-12

Family

ID=17054693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58240114A Pending JPS60131138A (en) 1983-12-20 1983-12-20 Lead wire bender

Country Status (1)

Country Link
JP (1) JPS60131138A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103379820A (en) * 2013-07-16 2013-10-30 吴江市博众精工科技有限公司 Automatic alignment part installation mechanism
CN104889289A (en) * 2015-06-08 2015-09-09 上虞市舜兴电力有限公司 Single-core lead bending device
US20170099738A1 (en) * 2014-05-20 2017-04-06 Fuji Machine Mfg. Co., Ltd. Lead component mounting machine and lead component mounting method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683095A (en) * 1979-12-11 1981-07-07 Matsushita Electric Ind Co Ltd Apparatus for treating lead wire of part
JPS58102598A (en) * 1981-12-15 1983-06-18 Fuji Electric Co Ltd Automatic lead cutting device for printed board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683095A (en) * 1979-12-11 1981-07-07 Matsushita Electric Ind Co Ltd Apparatus for treating lead wire of part
JPS58102598A (en) * 1981-12-15 1983-06-18 Fuji Electric Co Ltd Automatic lead cutting device for printed board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103379820A (en) * 2013-07-16 2013-10-30 吴江市博众精工科技有限公司 Automatic alignment part installation mechanism
CN103379820B (en) * 2013-07-16 2015-12-23 吴江市博众精工科技有限公司 A kind of automatic aligning parts mount mechanism
US20170099738A1 (en) * 2014-05-20 2017-04-06 Fuji Machine Mfg. Co., Ltd. Lead component mounting machine and lead component mounting method
US10617013B2 (en) * 2014-05-20 2020-04-07 Fuji Corporation Lead component mounting machine and lead component mounting method
CN104889289A (en) * 2015-06-08 2015-09-09 上虞市舜兴电力有限公司 Single-core lead bending device

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