JPS60130034U - double layer structure - Google Patents

double layer structure

Info

Publication number
JPS60130034U
JPS60130034U JP1797184U JP1797184U JPS60130034U JP S60130034 U JPS60130034 U JP S60130034U JP 1797184 U JP1797184 U JP 1797184U JP 1797184 U JP1797184 U JP 1797184U JP S60130034 U JPS60130034 U JP S60130034U
Authority
JP
Japan
Prior art keywords
layer structure
synthetic resin
resin layer
thermoplastic synthetic
double layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1797184U
Other languages
Japanese (ja)
Inventor
正 長谷川
出雲 数之
榎本 勝幸
杉江 信義
Original Assignee
アロン化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アロン化成株式会社 filed Critical アロン化成株式会社
Priority to JP1797184U priority Critical patent/JPS60130034U/en
Publication of JPS60130034U publication Critical patent/JPS60130034U/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例の部分側断面図、第2図は本考案の一実
施例の部分側断面図である。 図中、1・・・・・・導電性充填材を混合しない熱可塑
性合成樹脂、2・・・・・・導電性充填材を混合した熱
可塑性合成樹脂層、IA・・・・・・突起、2B・・・
内凹部。
FIG. 1 is a partial side sectional view of a conventional example, and FIG. 2 is a partial side sectional view of an embodiment of the present invention. In the figure, 1: thermoplastic synthetic resin without conductive filler mixed therein, 2: thermoplastic synthetic resin layer mixed with conductive filler, IA: protrusion , 2B...
Inner recess.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電性充填材を混合しない熱可塑性合成樹脂層1と、導
電性充填材を混合した熱可塑性合成樹脂一層2とからな
る二層構造において、該熱可塑性合成樹脂層1の接合面
には凹凸を形成し、該熱可塑性合成樹脂層2の接合面に
は該凹凸に対応する形状の凹凸を形成したことを特徴と
する二層構造。
In a two-layer structure consisting of a thermoplastic synthetic resin layer 1 not mixed with a conductive filler and a thermoplastic synthetic resin layer 2 mixed with a conductive filler, the joining surface of the thermoplastic synthetic resin layer 1 is provided with irregularities. and the bonding surface of the thermoplastic synthetic resin layer 2 has irregularities corresponding to the irregularities.
JP1797184U 1984-02-09 1984-02-09 double layer structure Pending JPS60130034U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1797184U JPS60130034U (en) 1984-02-09 1984-02-09 double layer structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1797184U JPS60130034U (en) 1984-02-09 1984-02-09 double layer structure

Publications (1)

Publication Number Publication Date
JPS60130034U true JPS60130034U (en) 1985-08-31

Family

ID=30506171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1797184U Pending JPS60130034U (en) 1984-02-09 1984-02-09 double layer structure

Country Status (1)

Country Link
JP (1) JPS60130034U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338112B2 (en) * 1974-10-15 1978-10-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338112B2 (en) * 1974-10-15 1978-10-13

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