JPS60127914A - Cutting method of groove - Google Patents
Cutting method of grooveInfo
- Publication number
- JPS60127914A JPS60127914A JP23551483A JP23551483A JPS60127914A JP S60127914 A JPS60127914 A JP S60127914A JP 23551483 A JP23551483 A JP 23551483A JP 23551483 A JP23551483 A JP 23551483A JP S60127914 A JPS60127914 A JP S60127914A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- groove
- work
- depth
- hard layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D1/00—Planing or slotting machines cutting by relative movement of the tool and workpiece in a horizontal straight line only
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Milling, Broaching, Filing, Reaming, And Others (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、一定の深さの溝を加工する溝加工方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a groove machining method for machining grooves of a constant depth.
工具を用いて工作物上に一定深さの擲を加工する溝加工
方法においては、工への切込量を一定に保つことが必須
条件である。従来、工具の切込量昧、第1図に示すよう
に、工具刃先11と工作物12の加工面との距離りを検
出することにより設定されていた。ところが第1図に示
すように工作物12の加工面上には、うねシが存在する
ため、従来の加工方法では、工具刃先11と工作物加工
面12との距離りが一定に保たれるように、工具10を
うねシ量りに追従させて移動させなければならず、サブ
ミクロンオーダの溝深さ精度を達成することは困難であ
った。In a groove machining method that uses a tool to form a groove of a constant depth on a workpiece, it is essential to maintain a constant depth of cut into the workpiece. Conventionally, the depth of cut of the tool has been set by detecting the distance between the cutting edge 11 of the tool and the machined surface of the workpiece 12, as shown in FIG. However, as shown in Fig. 1, there are ridges on the machined surface of the workpiece 12, so in the conventional machining method, the distance between the tool cutting edge 11 and the workpiece machined surface 12 cannot be kept constant. Therefore, the tool 10 had to be moved to follow the ridge scale, making it difficult to achieve groove depth accuracy on the order of submicrons.
本発明の目的は、このような従来の欠点を解決した溝加
工方法を提供することである。An object of the present invention is to provide a groove machining method that solves these conventional drawbacks.
本発明によれば、工具によって工作物に溝を加工する溝
加工方法におiて、硬質層の上に均一な膜厚を有する軟
質層膜を形成させた工作物上に、一定荷重を作用させた
工具を押し当てながら工作物又は、工具を移動し、硬質
層を溝深さを決定するストッパとして用−1軟質層のみ
を除去することによシ、軟質層の膜厚に等しい一定の深
さを有する溝を加工する仁とができる。According to the present invention, in the groove machining method (i) of machining a groove in a workpiece using a tool, a constant load is applied to the workpiece in which a soft layer film having a uniform thickness is formed on a hard layer. The hard layer is used as a stopper to determine the groove depth by moving the workpiece or the tool while pressing the tool, and removing only the soft layer. It is possible to machine a deep groove.
以下本発明について実施例を示す図面を参照して説明す
る。第2図は、一実施例を示す側面図である。工作物は
、軟質層膜として、o、iμmの均一な膜厚を有する金
の蒸着膜13(モース(M’ohs)がたさ2に相当)
及び硬質層として石英ガラス板14(モース(Mohs
)かたさ7に相当)により形成されており、工作物移動
台15に取シ付けられている。工具16は、第3図に示
すような刃先角θが90°のダイヤモンド工具を用いる
。第2図に示すように、ダイヤモンド工具16には自重
を利用して一定荷重Fを作用させる。The present invention will be described below with reference to drawings showing embodiments. FIG. 2 is a side view showing one embodiment. The workpiece has a gold vapor deposited film 13 (corresponding to M'ohs thickness 2) having a uniform film thickness of 0, i μm as a soft layer film.
and a quartz glass plate 14 (Mohs) as a hard layer.
) with a hardness of 7), and is attached to the workpiece moving table 15. As the tool 16, a diamond tool having a cutting edge angle θ of 90° as shown in FIG. 3 is used. As shown in FIG. 2, a constant load F is applied to the diamond tool 16 using its own weight.
金の蒸着膜13上に工具刃先17を押し当てながら工作
物移動台15をダイヤモンド工具16に作用している荷
重Fに対して直角な方向に移動させると、ダイヤモンド
工具16に作用している荷重は自重を利用しているだめ
、工作物13の加工面上のうねりに工具刃先17がプB
従することができ、一定深さく深さ01μm)の溝を金
の蒸着膜13上に加工することができる。この場合、第
4図に示すように、工具刃先17はf、!!!質層であ
る石英ガラス板14と接触し、硬質層14は溝の深さを
決定するストッパとしての機能を果している。ここでダ
イヤモンド工具16に作用させる荷重Fは、金の蒸着膜
13の膜厚がtの場合、以下のようにめられる。金の蒸
着膜13を深さtまで除去するのに必要なダイヤモンド
工具16に作用させる荷重をFlとし、金の蒸着膜16
を深さtまで除去し、さらに硬質層である石英ガラス板
14をも、極く微視的な塑性変形、あるいは、破壊に至
らしめるのに必要なダイヤモンド工具16に作用させる
荷重をF2とすると、一定深さtの溝を加工するために
ダイヤモンド工具16に作用させる荷重FitFl≦F
’<F2の範囲に設定すればよい。When the workpiece moving table 15 is moved in a direction perpendicular to the load F acting on the diamond tool 16 while pressing the tool cutting edge 17 onto the gold vapor deposited film 13, the load acting on the diamond tool 16 is Because the tool uses its own weight, the tool tip 17 is pushed by the undulations on the machined surface of the workpiece 13.
Accordingly, a groove with a constant depth (01 μm) can be formed on the gold vapor deposited film 13. In this case, as shown in FIG. 4, the tool cutting edge 17 is f,! ! ! The hard layer 14 is in contact with the quartz glass plate 14, which is a hard layer, and functions as a stopper that determines the depth of the groove. Here, the load F applied to the diamond tool 16 is determined as follows, when the thickness of the gold vapor deposited film 13 is t. Let Fl be the load applied to the diamond tool 16 necessary to remove the gold vapor deposited film 13 to a depth t, and the gold vapor deposited film 16
Let F2 be the load applied to the diamond tool 16 necessary to remove the quartz glass plate 14, which is a hard layer, to a depth t and cause extremely microscopic plastic deformation or destruction of the quartz glass plate 14, which is a hard layer. , the load FitFl≦F applied to the diamond tool 16 to machine a groove with a constant depth t.
'<F2.
本実施例においては、金の蒸着膜13の膜厚は0.1μ
mであり、Flは実験的に0.4/、F2はI−、OJ
’以上である。In this example, the thickness of the gold vapor deposited film 13 is 0.1 μm.
m, Fl is experimentally 0.4/, F2 is I-, OJ
'That's it.
したがってダイヤモンド工具16にO,4J’≦F(1
,OJ’なる範囲の荷重、F=05)を作用させること
により、深さ01μmの溝を金の蒸着膜13上に形成す
ることができだ。Therefore, the diamond tool 16 has O,4J'≦F(1
, OJ', F=05), a groove with a depth of 01 μm can be formed on the gold vapor deposited film 13.
以上説明したように、本発明によれば、工具によって工
作物に一定深さの溝を加工する方法において、硬質層の
上に、均一な膜厚を有する軟質層膜を形成させた工作物
上に、一定荷重を作用させた工具r押し当てながら工作
物又は工具を移動し、4iI!賀屑を溝aすさを決定す
るストッパとして用い、軟質層のみを除去することによ
り、軟質層の膜厚に等しい、一定の深さ分有する隣を加
工することができ、この方法では、膜厚を極めて薄く形
成することによりザブミクロンあるいはサブミクロン以
下の深さの溝を加工することも可能である。As explained above, according to the present invention, in a method of machining a groove of a constant depth in a workpiece using a tool, a soft layer film having a uniform thickness is formed on a hard layer. Move the workpiece or tool while pressing the tool r with a constant load applied, and 4iI! By using the scraps as a stopper to determine the width of the groove a and removing only the soft layer, it is possible to process the adjacent area with a constant depth equal to the thickness of the soft layer. By forming extremely thin grooves, it is also possible to process grooves with a submicron or submicron depth.
尚、本発明の実施レリで+−j、軟質層全一層としたが
、低連層を二層以上としても同様の効果がある。In the embodiment of the present invention, +-j, the soft layer is all one layer, but the same effect can be obtained even if the low continuous layer is two or more layers.
第1図は、従来の溝加工方法の概要を示す側面図、第2
図は本発明の一実施例を示す側面図、第3図fat 、
fblはそれぞれダイヤモンド工具の正面図及び側面
図、第4図は硬質層が溝深さを決定するストッパとして
の機能を果している様子を示す正面図である。
10及びio’・・・工具、11及び11’・・・工具
刃先、12・・・工作物、13・・・金の蒸着膜(軟質
層膜)、14・・・石英ガラス板(硬質層)、15・・
・工作物移動台、16・・・ダイヤモンド工具、17・
・・工具刃先をそれぞれ示す。
竿1 図
亭3 図Figure 1 is a side view showing an overview of the conventional groove machining method;
The figure is a side view showing one embodiment of the present invention;
fbl is a front view and a side view of the diamond tool, respectively, and FIG. 4 is a front view showing how the hard layer functions as a stopper that determines the groove depth. 10 and io'... Tool, 11 and 11'... Tool cutting edge, 12... Workpiece, 13... Gold vapor deposited film (soft layer film), 14... Quartz glass plate (hard layer) ), 15...
・Workpiece moving table, 16...Diamond tool, 17.
...Indicates each tool cutting edge. Rod 1 Figure 3
Claims (1)
いて、硬質層の上に均一な膜厚を有する軟質層膜を形成
させた工作物上に、一定荷重を作用させた工具を押し当
てながら工作物又は工具を移動し、硬質層を、婢深さを
決定するストッパとして用i、軟質層のみを除去するこ
とにより、軟9ILF111の膜厚に等しい一定の深さ
を有する溝を加工することを特徴とする溝加工方法。A method of machining grooves of a constant depth in a workpiece using a tool, in which a tool is pressed with a constant load onto a workpiece in which a soft layer film with a uniform thickness is formed on a hard layer. Machining a groove having a constant depth equal to the thickness of the soft 9ILF111 by moving the workpiece or tool, using the hard layer as a stopper to determine the soft depth, and removing only the soft layer. A groove machining method characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23551483A JPS60127914A (en) | 1983-12-14 | 1983-12-14 | Cutting method of groove |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23551483A JPS60127914A (en) | 1983-12-14 | 1983-12-14 | Cutting method of groove |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60127914A true JPS60127914A (en) | 1985-07-08 |
JPH0561048B2 JPH0561048B2 (en) | 1993-09-03 |
Family
ID=16987112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23551483A Granted JPS60127914A (en) | 1983-12-14 | 1983-12-14 | Cutting method of groove |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60127914A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009078486A (en) * | 2007-09-27 | 2009-04-16 | Semco Corp | Engraving stylus |
-
1983
- 1983-12-14 JP JP23551483A patent/JPS60127914A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009078486A (en) * | 2007-09-27 | 2009-04-16 | Semco Corp | Engraving stylus |
Also Published As
Publication number | Publication date |
---|---|
JPH0561048B2 (en) | 1993-09-03 |
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