JPS60117728A - Nozzle shifter - Google Patents

Abstract

PURPOSE:To move an exhaust port in a nozzle for supplying a photo-resist up to a position separate from a carrying path for a wafer by sliding a sliding member, to which the nozzle is fixed, along a guide shaft. CONSTITUTION:When a sliding member 1 is moved along a guide shaft 2 by the revolution of a lever 3 centering around a shaft 6, the position of a pin 4 is changed continuously along a long hole 5 in the lever 3 because a distance between the pin 4 fixed to the sliding member 1 and the shaft 6 is altered. The lever 3 is turned centering around the shaft 6 by operating a cylinder device 7. A positive type photo-resist supply nozzle 10 and a negative type photo-resist supply nozzle 11 are bundled by a nozzle holder 13, and extend vertically toward the surface of a wafer 12. The nozzles 10 and 11 are fixed to the sliding member 1 through a retaining fitting. Accordingly, the nozzles are moved in parallel together with a sliding along the guide shaft 2 in the direction crossing with a wafer carrying path of the sliding member 1.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a nozzle moving device, and in particular, to a coater for applying photoresist to a substrate, for moving the outlet of a photoresist supply nozzle to a position away from the wafer conveyance path. The present invention relates to a nozzle moving device.

In order to manufacture semiconductor devices such as ICs and LSIs, a scrubber/<- is used to clean the wafer, a coater is used to apply photoresist to the cleaned wafer, and the top of the wafer coated with photoresist is used. Various semiconductor manufacturing apparatuses are used, such as an aligner for transferring a circuit pattern to a wafer, and a developer for developing a substrate onto which a circuit pattern has been transferred.

Among these, in the coater, the unicorn carried by the carrier nozzle (wafer transport device) is adsorbed and held by the chuck, and then the photoresist is dropped onto the unicorn from the supply nozzle, and the chuck is rotated by the rotating shaft. , photoresist is uniformly applied on one surface of the chef. By the way, the photoresist supply nozzle is 7. Before rotating the chuck after dropping the odresist, it must be moved to a position away from Uninot. In this regard, conventionally the supply nozzle has been retracted 5 in the direction in which the photoresist-coated unit is conveyed (in the direction of the arrow in FIG. 1). For this reason, there was a fear that the retracted supply nozzle would drop the photoresist onto the surface of the wafer during transportation.

Furthermore, the photoresist near the outlet of the supply nozzle is exposed to air and may deteriorate over time. Coating such deteriorated photoresist onto the wafer surface may lead to defective semiconductor devices. This is not desirable because it leads to the production of

Another object of the present invention is to provide a nozzle moving device for moving the outlet of a photoresist supply nozzle to a position away from the wafer transport path.

Another object of the present invention is to provide a nozzle moving device for moving a photoresist supply nozzle above a photoresist reservoir away from a wafer transport path in order to discharge deteriorated photoresist in advance. It's about doing.

Preferred embodiments of the invention will now be described with reference to the accompanying drawings.

1g1 is a plan view of a nozzle moving device constructed according to the present invention, and FIG. 2 is a view taken along line A--A in FIG. 1. A lever 6 is loosely attached to the bottom of the slide member 1 with a pinch.

As shown by broken lines in FIG. 1, an elongated hole 5 is formed at the tip of the lever 6, and the pinch can move along the elongated hole 5. Therefore, when the slide member 1 moves along the guide shaft 2 due to the rotation of the lever 6 about the shaft 6,
Since the distance between the pin 4 fixed to the slide member 1 and the shaft 6 changes, the position of the pin 4 along the elongated hole 5 of the lever 6 changes (the distance of the lever 6 around the shaft 6 changes). The rotation is carried out by actuating the cylinder device 7, in which the guide shaft 2 is connected to the photoresist supply nozzle 1.
It must have a sufficient length so that the discharge ports 0 and 11 can move to a position away from the transport path of the wafer 12 (for example, the position indicated by the broken line in FIG. 1).

As is clear from FIG. 2, the side ICt of the slide member 1
'iL-shaped light shielding plate 8 is screwed. A photocoupler 9 installed close to the slide member 1 has a recess 9a formed therein so that the plate 8 can be inserted through the lotus 9.

The positive type photoresist supply nozzle 10 and the negative type photoresist supply nozzle 11 are bundled by a nozzle holder 16 at a position above the center of the Unino S12 held by a chuck (not shown). After the nozzles 10 and 11 are bundled together by the holder 13,
It extends perpendicularly towards the surface of Unino 12. Further, since the nozzles 10 and 11 are fixed to the slide member 1 via the holding fitting 14, 1 slide member 1
As they slide along the guide shaft 2 in a direction intersecting the conveyance path (indicated by the arrow in FIG. 1), they can be translated together.

Further, as shown by broken lines in FIG. 1, a photoresist reservoir 15 is installed at the vertical lower blade of the discharge port of the photoresist supply nozzles 10 and 11, which have been moved to a position away from the transport path of the wafer 12. . 111j As described above, after dropping the 7 otoresist onto the surface of the sea urchin I 12 from the supply nozzle 10 or 11, and before rotating the sea urchin 12 with a chuck (not shown),
1 by moving the slide member 1.
It can be retracted to a position away from the conveyance path of 12. nozzle 10
and 11 must remain in this retracted position until a new unit 1 is set to the photoresist application position (at this time, the photoresist near the photoresist outlet of nozzles 10 and 11 is exposed to air. Therefore, before moving the supply nozzles 1 and 11 above the center of the newly set Unino®, remove the photoresist near the discharge port where there is a risk of deterioration. It is preferable to dispose of it toward the photoresist reservoir 15~・0

[Brief explanation of the drawing]

FIG. 1 is a plan view of a nozzle moving device constructed according to the present invention, and FIG. 2 is a view taken along line A--A in FIG. 1. 1...-Slide member 2...-Guide shaft 5 @@@Renoku- 10, 11... Photoresist supply nozzle 15...
Photoresist reservoir applicant Canon Sales Co., Ltd. Canon Co., Ltd.

Claims (1)

[Scope of Claims] A slide member that is slidable along a guide shaft in a direction intersecting a wafer transport path; 1. A photoresist supply nozzle fixed to the slide member; and a means for sliding the guide shaft, and the guide shaft has a sufficient length so that the discharge port of the photoresist supply nozzle can move to a position away from the wafer transport path. A nozzle moving device characterized by: