JPS60116274U - printed circuit board equipment - Google Patents

printed circuit board equipment

Info

Publication number
JPS60116274U
JPS60116274U JP131284U JP131284U JPS60116274U JP S60116274 U JPS60116274 U JP S60116274U JP 131284 U JP131284 U JP 131284U JP 131284 U JP131284 U JP 131284U JP S60116274 U JPS60116274 U JP S60116274U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
board equipment
lead terminal
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP131284U
Other languages
Japanese (ja)
Inventor
稲川 功
荒井 吉一
Original Assignee
株式会社田村電機製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社田村電機製作所 filed Critical 株式会社田村電機製作所
Priority to JP131284U priority Critical patent/JPS60116274U/en
Publication of JPS60116274U publication Critical patent/JPS60116274U/en
Pending legal-status Critical Current

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  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

1   第1図は本考案の一実施例を示す斜視図、第2
□゛ 図は側面図、第3図は第1および第2の絶縁基板
1  の形成方法を説明するための正面図である。 −1・・・・・・第1の絶縁基板、2・・・・・・第2
の絶縁基i 板、3・・・・・・プリント配線、3a・
・間接続端子部、4・・・・・・リード端子、4a・・
・・・・嵌合部。
1 Figure 1 is a perspective view showing one embodiment of the present invention, Figure 2 is a perspective view showing an embodiment of the present invention.
□゛ The figure is a side view, and FIG. 3 is a front view for explaining the method of forming the first and second insulating substrates 1. -1...First insulating substrate, 2...Second
Insulating board i board, 3...Printed wiring, 3a.
・Connection terminal section, 4...Lead terminal, 4a...
····Fitting portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] それぞれ表面に所定の回路を構成するプリント配線を有
しかつ裏面を相互に密着させた第1の絶縁基板と第2の
絶縁基板とを備え、両基板の少な−くとも1対の相対す
る辺部にプリイト配線の接続端子部を設け、かつ一端に
嵌合部を有するリード端子の当該嵌合部を上記辺部に嵌
合させて両基板の対応する接続端子部を相互に持続して
なるプリント基板装置。
a first insulating substrate and a second insulating substrate each having a printed wiring constituting a predetermined circuit on its surface and having their back surfaces in close contact with each other; at least one pair of opposing sides of both substrates; A connecting terminal portion of the lead terminal is provided in the lead terminal, and the fitting portion of a lead terminal having a fitting portion at one end is fitted to the side portion, so that the corresponding connecting terminal portions of both boards are mutually sustained. Printed circuit board equipment.
JP131284U 1984-01-11 1984-01-11 printed circuit board equipment Pending JPS60116274U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP131284U JPS60116274U (en) 1984-01-11 1984-01-11 printed circuit board equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP131284U JPS60116274U (en) 1984-01-11 1984-01-11 printed circuit board equipment

Publications (1)

Publication Number Publication Date
JPS60116274U true JPS60116274U (en) 1985-08-06

Family

ID=30473943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP131284U Pending JPS60116274U (en) 1984-01-11 1984-01-11 printed circuit board equipment

Country Status (1)

Country Link
JP (1) JPS60116274U (en)

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