JPS60114001A - Coaxial dielectric filter - Google Patents

Abstract

PURPOSE:To decrease the deterioration of Q, to reduce remarkably man-hour and to improve the mass-productivity by inserting perpendicularly a dielectric board to an open end face of resonator elements of a center conductor part of the resonator circuit elements and utilizing the surface tension of solder so as to support and fix plural resonator elements once. CONSTITUTION:Projections 7a-7f inserted to center conductors 1'-6' provided to the dielectric board 7 one side (or both sides) of which conductor regions 8- 15 are formed are inserted to the center conductors 1'-6' so as to be perpendicular to the open end face of the resonators 1-6, fixed tentatively by a fixed tool 30, after they are pre-heated sufficiently, they are dipped in a solder bath 31, the surface tension of solder 32 is utilized and the solder 32 is packed in the gap among the dielectric board 7, the center conductors 1'-6' of the plural resonator elements 1-6 and the insertion projections 7a-7f through the use of capillarity so to support and fix the projections. Furthermore, the dielectric board 7 and the plural resonator elements 1-6 fixed to them are fixed to a case 33 by solder or conductive paste. The frequency of the resonator elements 1-6 is adjusted by tightening tuning screws 34-39 so as to change the gap among the conductor regions 8-15.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides a method for opening a plurality of resonant circuit elements.
This relates to a + type dielectric filter.

Conventional structure and its problems Conventionally, in a filter using coaxial dielectric resonant elements 1 to 6 as shown in FIGS. 1a and 2, interstage coupling between the resonant elements, and There is a method of forming conductor regions 8 to 16 on one or both sides of the dielectric substrate 7 and performing input/output coupling by capacitances 16 to 22 between the conductor regions (see % Application No. 109003). The dielectric substrate 7 and the coaxial dielectric resonant elements 1 to 6 are supported and fixed by the resonant elements 1 to 6.
The middle conductor parts 1' to 6' of 6 are filled with cream solder or conductive paste 23, metal rods 24 to 29 are inserted, heat treated, and fixed. This required a lot of man-hours, was not suitable for mass production, and hindered cost reduction. Furthermore, since the dielectric substrate 7 is supported parallel to the open end surfaces of the resonant elements 1 to 6, the solder field on the open end surface side is disturbed, and the Q of the resonant elements is significantly deteriorated. .

OBJECTS OF THE INVENTION It is an object of the present invention to provide a coaxial dielectric filter having a structure with little Q deterioration and excellent mass productivity.

Structure of the Invention In order to achieve the above object, in the present invention, a dielectric substrate is inserted perpendicularly to the open end surface of the resonant circuit element into the conductor portion of a plurality of resonant circuit elements having a coaxial structure, and the solder is removed. Surface tension is used to support and fix a plurality of resonant elements to a dielectric substrate at the same time.

DESCRIPTION OF EMBODIMENTS FIGS. 3 and 4 show an embodiment of the present invention. FIG. 3 shows a dielectric with conductor regions 8 to 15 formed on one side (or both sides) of the center conductor portions 1' to 6' of a plurality of TEMλ/4 coaxial resonant elements 1 to 6 as shown in FIG. The protrusions 7a to 7f for insertion into the center conductor parts 1' to 6' provided on the body substrate 7 (for example, a Teflon glass substrate or a ceramic substrate such as an alumina substrate) are connected to the open end surfaces of the resonant elements 1 to 6. Insert it vertically into the center conductor parts 1' to 6', temporarily fix it with the fixing jig 3o as shown in Fig. 6, and after sufficient preheating, 'l'
, dip at 1131 with ff+4 and solder 320
Using surface tension, solder 32 is applied at once to the gaps between the dielectric substrate 7 and the central conductors 1' to 6' of the plurality of resonant elements 1 to 6, and the insertion protrusions 7a to 7f on the solder surface. Utilizing all the tension, it is filled by capillary action and supported and fixed. Further, the dielectric substrate 7 and the plurality of resonant elements 1 to 6 are fixed to the gold casing 33 with solder (e.g., product name: Sparkle Green STD-46) or conductive paste (e.g., product name: VH-). 17 Tamura Seisakusho). The frequency of each resonant element 1-6 is adjusted by changing the gap between the tuning screws 34-39 and the conductor regions 8-16 of the dielectric substrate 7 to change the capacitance. Figures 7 and 8 show metal rods of 4° and 4°.
6 is inserted between the center conductor portions 1' to 6' of the resonant element and the dielectric substrate 7, and is supported and fixed, and a partially enlarged view is shown in FIG. However, the same parts as in the conventional example are marked with the same numbers. FIG. 10 is an electrical equivalent circuit diagram. Table 1 shows the degradation of the Q of the resonant element and the insertion loss when constructing the filter in the conventional example and the embodiment of the present invention. (The resonant element is 10,0.

A six-stage filter was constructed using a -40 TEMλ/4 coaxial co-sensing element. ) Table 1 Figures 11, 12, 13, and 14 show other embodiments of the present invention, in which the outer diameter or one inner diameter is set by a part of the length in the direction of the coaxial line. This is an example using a resonant element whose impedance is changed. However, the same parts as before are indicated by the same numbers.

As a result, supporting and fixing the dielectric substrate 7 and the resonant elements 1 to 6, which conventionally took a lot of man-hours and was difficult to mass-produce, is now possible.
Multiple resonant elements can be supported at once by inserting the dielectric substrate 7 perpendicularly to the open end surface of the resonant element and using the surface tension of the solder to fill the space between the substrate 7 and the center conductor of the resonant element. It was possible to fix it. Furthermore, the dielectric substrate 7 is attached to the resonant elements 1 to 1 so that the first layer is exposed.
6 Since it is supported and fixed perpendicularly to the open end surface, there is little deterioration in the Q of the resonant element. When constructed into a filter, this makes it possible to provide a low-loss filter with little insertion loss.

Effects of the Invention According to the present invention, since the dielectric substrate is supported and fixed perpendicularly to the open end face of the resonant element, Q deterioration is less than in the past, and therefore a filter with low loss can be realized. It has become possible. Roughly speaking, the dielectric substrate is inserted perpendicularly to the open end surface of the resonant element to support and fix it w6, and the protrusion provided on the dielectric substrate or the metal rod provided separately and the center conductor are soldered and soldered. It becomes possible to support and fix a plurality of resonant elements to the substrate at the same time using capillary action. Therefore, compared to the conventional method, the number of man-hours can be significantly reduced, the cost can also be reduced, and a filter that can be easily mass-produced can be provided.

[Brief explanation of drawings]

Figures 1a and b are cross-sectional views and partially enlarged views of a conventional coaxial dielectric filter, Figure 2 is a cross-sectional view of Mu A' in Figure 1,
The figure is a sectional view of a coaxial dielectric filter according to an embodiment of the present invention, FIG. FIG. 6 is a side view, FIG. 6 is a perspective view showing the state immediately before fixing the dielectric substrate to the conimage element with solder dip, and FIGS. 7, 11, and 13 are views of other embodiments of the present invention. The cross-sectional views of the coaxial dielectric filter, Figs.
The figure is a partial assembly diagram of Fig. 7, and Fig. 10 is a coaxial 2 of the embodiment.
rRM? FIG. 2 is an equivalent circuit diagram of a W-tempered filter. 1 to 6... Resonant element, 1' to 6'...
Middle/b conductor section, 7...Dielectric substrate, 8-15.
...Conductor area, 16-22...Capacity, 2
4-29...metal rod, 30...fixing jig, 31...solder tank, 32...solder,
33・mountain・・casing, 3.4～39・・mountain・・tuning screw,
40-46...Metal rod. Figure 1 Figure 2 Figure 5 Figure 6 fis Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Continued from page 1

Claims (2)

[Claims] (1) Open ends (111
A dielectric substrate is vertically supported on the substrate 1, and a conductor region 4 is formed on at least one surface of the If'i' substrate,
A coaxial dielectric filter characterized by a crotch coupling, an input/output coupling, and a joint for performing input/output coupling. (2) A part of the conductor region of the dielectric substrate is inserted vertically into the open end portion of the resonant circuit element on the stage number side, and solder is filled between the dielectric substrate and the center conductor. 1. The coaxial dielectric filter according to item 1, having -ft+λ.