JPS60113953A - Guided missile - Google Patents
Guided missileInfo
- Publication number
- JPS60113953A JPS60113953A JP58221488A JP22148883A JPS60113953A JP S60113953 A JPS60113953 A JP S60113953A JP 58221488 A JP58221488 A JP 58221488A JP 22148883 A JP22148883 A JP 22148883A JP S60113953 A JPS60113953 A JP S60113953A
- Authority
- JP
- Japan
- Prior art keywords
- hollow sections
- parts
- hollow
- initiator
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D5/00—Devices using endothermic chemical reactions, e.g. using frigorific mixtures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B15/00—Self-propelled projectiles or missiles, e.g. rockets; Guided missiles
- F42B15/34—Protection against overheating or radiation, e.g. heat shields; Additional cooling arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Aviation & Aerospace Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の技術分野]
この発明は、冷却を必要とする電子部品を内蔵したエレ
クトロニクスモジュールを複数個搭載した誘導飛翔体の
改良に関するものであり、更に詳しくは、保守点検性、
生産性あるいは信頼性等の観点からモジュール化された
電子機器を複数個搭載した誘導飛翔体の冷却技術に関す
るものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an improvement in a guided flying object equipped with a plurality of electronics modules containing electronic components that require cooling. sex,
The present invention relates to a cooling technology for a guided flying vehicle equipped with a plurality of modularized electronic devices from the viewpoint of productivity or reliability.
近年の誘導飛翔体においては、搭載電子部品の高密度実
装化、シーカ−のアクティブ化等に伴い。In recent years, guided flying vehicles have become more densely packed with electronic components, and seekers have become more active.
電子部品の発生する熱が膨大なものとなりつつある。The amount of heat generated by electronic components is becoming enormous.
そのため、誘導飛翔体がその機能を維持あるいは改善す
るためには十分な電子部品の冷却が要求されるが、一方
では、冷却システムの小型軽量化を推進することが必要
となっている。Therefore, in order for guided flying vehicles to maintain or improve their functions, sufficient cooling of electronic components is required, but at the same time, it is necessary to promote smaller and lighter cooling systems.
[従来技術]
第1図は従来の誘導飛翔体の冷却系を示すものテ、エレ
クトロニクスモジュール(Ia)〜(In)K沿って冷
却板(2)を設け、タンク(3)、ポンプ(4)、熱交
換器(5)で構成される冷媒循環系から送られる冷媒を
上記冷却&(2)の内に流し、エレクトロニクスモジュ
ール(1a)〜(1n)を冷却するよう構成していた。[Prior Art] Figure 1 shows a conventional cooling system for a guided flying vehicle.A cooling plate (2) is provided along the electronics modules (Ia) to (In)K, a tank (3), a pump (4) , a refrigerant sent from a refrigerant circulation system comprising a heat exchanger (5) was flowed into the cooling & (2) to cool the electronics modules (1a) to (1n).
しかるに従来の誘導飛翔体においてはタンク(3)。However, in conventional guided flying vehicles, it is a tank (3).
ポンプ(4)、熱交換器(5)、配管部品、冷媒等が小
型軽量化に対する大きな阻害要因となっていた。The pump (4), heat exchanger (5), piping parts, refrigerant, etc. have been a major impediment to downsizing and weight reduction.
更には、熱交換器(4)から吐き出される熱によって誘
導飛翔体の内部温度が上昇し、熱交換能力が低下したり
、他の電子部品に悪影響を与えるという問題があった。Furthermore, there is a problem that the internal temperature of the guided flying object increases due to the heat discharged from the heat exchanger (4), resulting in a decrease in heat exchange capability and an adverse effect on other electronic components.
[発明の概要]
この発明は、このような問題を改善するためになされた
ものであり、エレクトロニクスモジュール筐体に組込ん
だ化学物質の吸熱作用を用いて電子部品を冷却するよう
冷却系を構成することで。[Summary of the Invention] The present invention has been made to improve such problems, and includes a cooling system configured to cool electronic components using the endothermic action of a chemical substance incorporated into an electronics module housing. by doing.
ポンプその他の冷媒循環装置や熱交換器等を必要とせス
又エレクトロニクスモジュール外部への熱の放出がない
軽量小型であり信頼性の冒い誘導飛翔体を提案するもの
である。The present invention proposes a lightweight, small, and reliable guided flying object that does not require pumps or other refrigerant circulation devices, heat exchangers, etc., and does not emit heat to the outside of the electronics module.
し発明の実施例]
この発明の実施例を第2図、第3図、第4図を用いて説
明する。Embodiments of the Invention] Examples of the invention will be described with reference to FIGS. 2, 3, and 4.
第2図は、この発明による誘導飛翔体に用いるエレクト
ロニクスモジュールの1例、第3図は:r−レクトロニ
クスモジュールの断面図、第4図はこの発明による誘導
飛翔体の1例である。FIG. 2 is an example of an electronics module used in a guided flying vehicle according to the present invention, FIG. 3 is a sectional view of an r-lectronics module, and FIG. 4 is an example of a guided flying vehicle according to the present invention.
第2図において、(1)はエレクトロニクスモジュール
、(6)は冷却を必要とする電子部品、 (7a)、(
7b)はエレクトロニクスモジュール(1)に設けた2
つの中空部であり第3図のエレクトロニクスモジュール
断面図を用いて、さらに詳しく説明するとfll 、
+6+。In Figure 2, (1) is an electronics module, (6) is an electronic component that requires cooling, (7a), (
7b) is 2 installed in the electronics module (1).
To explain in more detail using the cross-sectional view of the electronics module shown in FIG.
+6+.
(7a)、(7b)は第2図と同一、 (8a)、(8
b)は中空部(7a) 。(7a), (7b) are the same as in Figure 2, (8a), (8
b) is a hollow part (7a).
(7b)に収納され、混合した際には吸熱を伴う化学反
応を生ずる化学物質であり、この化学物質の例としては
、水対硝酸アンモニウムと尿素の混合物といった組合せ
がある。又(9)は中空部の仕切り壁を破壊するための
起爆剤であり、 (+1)は起爆剤(9)を動作させる
ためのエレクトロニクスモジュール(1)外部よりの信
号である。(7b) is a chemical substance that causes an endothermic chemical reaction when mixed; an example of this chemical substance is a combination such as a mixture of water, ammonium nitrate, and urea. Further, (9) is a detonator for destroying the partition wall of the hollow part, and (+1) is a signal from outside the electronics module (1) for operating the detonator (9).
次に動作原理について説明する。Next, the operating principle will be explained.
一般に誘導飛翔体においては、電子部品(6)が動作し
始めるのは、誘導飛翔体の発射後又は発射直前でありそ
れまでは電子部品(6)を冷却する必要はな(1゜
そのため、この発明による誘導飛翔体においても、冷却
は冷却を要求する信号illが発せられるまでは行なわ
れない。そして電子部品(6)が動作する等で冷却が要
求され、信号tI+1が各エレクトロニクスモジュール
(1)に発せられると、起爆剤(9)が爆破し、中空部
(7a)、’(7b)を仕切っている壁を破壊する。Generally, in guided flying vehicles, the electronic components (6) start operating after or just before the guided flying vehicle is launched, and there is no need to cool the electronic components (6) until then (1°). Also in the guided flying object according to the invention, cooling is not performed until the signal ill requesting cooling is issued. Cooling is then required due to operation of the electronic component (6), etc., and the signal tI+1 is sent to each electronics module (1). When released, the detonator (9) detonates and destroys the wall separating the hollow parts (7a) and '(7b).
この壁が破壊されることにより、化学物質(8a)と(
8b)が混合し、吸熱を伴う化学反応を生ずる。この結
果化学反応が終結するまでの間は、エレクトロニクスモ
ジュール(1)の筐体を介して電子部品(6)は冷却さ
れることになる。By destroying this wall, chemical substance (8a) and (
8b) mix, resulting in an endothermic chemical reaction. As a result, the electronic component (6) is cooled through the casing of the electronics module (1) until the chemical reaction is completed.
第4図は、上述してきたエレクトロニクスモジュール(
1)を複数個搭載した。この発明による誘導飛翔体の1
例であり、(1)及びuoは第3図と同一。Figure 4 shows the electronics module (
1) is installed. 1 of the guided flying object according to this invention
This is an example, and (1) and uo are the same as in Fig. 3.
(11)は信号ul)の発信器である。第4図において
は。(11) is a transmitter of signal ul). In Fig. 4.
信号00の発信器aυを誘導飛翔体内部に設置している
が、誘導飛翔体の外部に設置しても良いことは。Although the transmitter aυ for signal 00 is installed inside the guided flying vehicle, it may also be installed outside the guided flying vehicle.
言うまでもない。Needless to say.
[発明の効果]
この発明は以上説明したとおりに、化学物質の吸熱作用
を用いてエレクトロニクスモジュール内の電子部品を冷
却するよう冷却系を構成することで9型破が重くスペー
スをとる循環装置、熱交換器及び配管部品を必要とせず
、さらにエレクトロニクスモジュールから外部への熱の
放出がなくなるために、小型軽量で、かつ信頼性の高い
誘導飛翔体を得ることができるという効果がある。[Effects of the Invention] As explained above, the present invention provides a circulation device that is heavy and takes up space by configuring a cooling system to cool electronic components in an electronics module using the endothermic action of chemical substances. Since a heat exchanger and piping parts are not required, and furthermore, heat is not released from the electronics module to the outside, it is possible to obtain a small, lightweight, and highly reliable guided flying object.
第1図は従来の誘導飛翔体における冷却系の概略構成図
、第2図はこの発明による誘導飛翔体に用いられるエレ
クトロニクスモジュールの概略図。
第3図はエレクトロニクスモジュールの断面図。
第4図はこの発明による誘導飛翔体の一実施例を示す図
である。
図においてfl)はエレクトロニクスモシュー ル。
(2)は冷却板、(3)はタンク、(4)はポンプ、(
5)は熱交換器、(6)は冷却を必要とする電子部品、
(7)はエレクトロニクスモジュール筐体に設けた中空
部、(8)は混合すると吸熱反応を生ずる化学物質、(
9)は起爆剤、 Qlは起爆剤を動作させるための信号
、0υは信号発生器である。
なお9図中同一あるいは相当部分には同一符号を付して
示しである。
代理人大岩増雄
応 2 国FIG. 1 is a schematic diagram of a cooling system in a conventional guided flying vehicle, and FIG. 2 is a schematic diagram of an electronics module used in a guided flying vehicle according to the present invention. FIG. 3 is a cross-sectional view of the electronics module. FIG. 4 is a diagram showing an embodiment of a guided flying object according to the present invention. In the figure, fl) is an electronics module. (2) is a cooling plate, (3) is a tank, (4) is a pump, (
5) is a heat exchanger, (6) is an electronic component that requires cooling,
(7) is a hollow part provided in the electronics module housing, (8) is a chemical substance that causes an endothermic reaction when mixed, (
9) is a detonator, Ql is a signal for operating the detonator, and 0υ is a signal generator. Note that the same or corresponding parts in FIG. 9 are designated by the same reference numerals. Agent Masuo Oiwa 2 countries
Claims (1)
モジュールを複数個搭載する誘導飛翔体において、混合
すると吸熱を伴う化学反応を生ずる二つの化学物質と、
前記エレクトロニクスモジュールの筐体の前記電子部品
数り付は部に設けた前記化学物資を収納するための隣接
する2つの中空部と、前記2つの中空部を仕切る壁を破
壊するための前記エレクトロニクスモジュール外部より
の信号で動作可能な起爆剤とを備えたことを特徴とする
誘導飛翔体。In a guided flying vehicle equipped with multiple electronics modules containing electronic components that require cooling, two chemicals that cause an endothermic chemical reaction when mixed, and
Two adjacent hollow parts for storing the chemical substances provided in the electronic component numbering part of the electronics module casing, and the electronics module for destroying a wall separating the two hollow parts. A guided flying object characterized by being equipped with a detonator that can be activated by an external signal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58221488A JPS60113953A (en) | 1983-11-25 | 1983-11-25 | Guided missile |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58221488A JPS60113953A (en) | 1983-11-25 | 1983-11-25 | Guided missile |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60113953A true JPS60113953A (en) | 1985-06-20 |
Family
ID=16767494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58221488A Pending JPS60113953A (en) | 1983-11-25 | 1983-11-25 | Guided missile |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60113953A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10231360B2 (en) * | 2016-11-09 | 2019-03-12 | Lockheed Martin Corporation | Dual-mode passive thermal management system and method |
EP3524905A1 (en) * | 2018-02-12 | 2019-08-14 | MBDA France | Cooling device with endothermic chemical reaction |
-
1983
- 1983-11-25 JP JP58221488A patent/JPS60113953A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10231360B2 (en) * | 2016-11-09 | 2019-03-12 | Lockheed Martin Corporation | Dual-mode passive thermal management system and method |
EP3524905A1 (en) * | 2018-02-12 | 2019-08-14 | MBDA France | Cooling device with endothermic chemical reaction |
WO2019155155A1 (en) * | 2018-02-12 | 2019-08-15 | Mbda France | Cooling device with an endothermic chemical reaction |
FR3077871A1 (en) * | 2018-02-12 | 2019-08-16 | Mbda France | COOLING DEVICE WITH ENDOTHERMIC CHEMICAL REACTION |
US11656019B2 (en) | 2018-02-12 | 2023-05-23 | Mbda France | Cooling device with an endothermic chemical reaction |
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