JPS60107874A - Light emitting element - Google Patents
Light emitting elementInfo
- Publication number
- JPS60107874A JPS60107874A JP58216639A JP21663983A JPS60107874A JP S60107874 A JPS60107874 A JP S60107874A JP 58216639 A JP58216639 A JP 58216639A JP 21663983 A JP21663983 A JP 21663983A JP S60107874 A JPS60107874 A JP S60107874A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lens
- adhesive resin
- light
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
Description
【発明の詳細な説明】
発明の技術分野
本発明は発光素子に関し、とくに光ファイバに効率よく
発光部からの光を入射させる発光素子に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a light emitting device, and more particularly to a light emitting device that allows light from a light emitting portion to enter an optical fiber efficiently.
技術の背景
たとえば元ファイバに発光ダイオードの光を効率良く入
射さ七る発光素子として、第1図α*be’に構成断面
概要を示すような発光素子が用いられている。第1図α
は、光ファイバ1へ発光ダイオード2の発光部7からの
光ろを効率良く入射させるため、光取出し面B上に球レ
ンズ4を接着材5により接着装荷した発光素子である。Background of the Technology For example, a light emitting element as shown in FIG. 1 α*be', whose cross-sectional outline is shown, is used as a light emitting element that efficiently allows light from a light emitting diode to enter an original fiber. Figure 1 α
is a light-emitting element in which a ball lens 4 is adhesively mounted on a light extraction surface B with an adhesive 5 in order to efficiently input light from a light-emitting portion 7 of a light-emitting diode 2 into an optical fiber 1.
61および62は電極を示す。第1図6は、第1図αの
発光素子において、球レンズ4の代りに半球レンズ41
を接着装荷した発光素子である。また第1図Cは第1図
α、bにおける球レンズまたは半球レンズの代りに、発
光ダイオード2自体にたとえばエツチングにより半球状
のレンズ40を形成した発光素子である。61 and 62 indicate electrodes. FIG. 16 shows a hemispherical lens 41 instead of the spherical lens 4 in the light emitting device of FIG. 1 α.
This is a light emitting device that is adhesively loaded. Further, FIG. 1C shows a light emitting element in which a hemispherical lens 40 is formed on the light emitting diode 2 itself by etching, for example, instead of the spherical lens or hemispherical lens in FIGS. 1α and 1b.
従来技術と問題点
第1図αおよびbに例示した従来の発光素子は、いずれ
もガラス製のレンズの別種の部品を必要とするため経済
的に価格高となり、また接着材の量により、周辺光に対
する焦点距離の変化が生じ、光ファイバとの光結合効率
にばらつきが生ずるといった欠点があった。第1図Cに
例示した従来の発光素子は、発光ダイオード自体にエツ
チングにより半球状のレンズを形成するもので、特別な
技術、たとえばイオンビームエツチングが必要で、制御
がむづかしく、かつ経済的に価格高となる。Prior Art and Problems The conventional light-emitting elements illustrated in Figures α and b all require different types of glass lenses, making them economically expensive. This has the disadvantage that the focal length of the light changes, resulting in variations in the optical coupling efficiency with the optical fiber. In the conventional light emitting device shown in FIG. 1C, a hemispherical lens is formed by etching the light emitting diode itself, which requires a special technique such as ion beam etching, making it difficult to control and economical. The price will be high.
発明の目的
本発明は従来の欠点を克服し、光ファイバとの光結合効
率の高い生産性に富んだ発光素子を提供することをその
目的とする。以下図について詳細に説明する。OBJECTS OF THE INVENTION It is an object of the present invention to overcome the conventional drawbacks and provide a highly productive light emitting device with high optical coupling efficiency with an optical fiber. The figures will be explained in detail below.
発明の実施例
第2図に本発明の発光素子の一実施例の構成断面概要を
示す。第1図Cと同じ符号は同じ部分を示す。21.2
2は透光性の接着性樹脂、たとえばエポキシ系光学接着
材を加熱または紫外線:二より硬化させた半球状の集光
効果を示すレンズおよび余分の接着性樹脂の部分である
。第2図に示すように本発明の発光素子は、透光性の接
着性樹脂の粘性を利用して、この接着性樹脂をレンズ状
4二形成したものである。次に本発明の発光素子を具体
的に実現する製造工程の一実施例を第3図α乃至fによ
り説明する。Embodiment of the Invention FIG. 2 shows a schematic cross-sectional configuration of an embodiment of the light emitting device of the invention. The same reference numerals as in FIG. 1C indicate the same parts. 21.2
Reference numeral 2 denotes a hemispherical light-condensing lens and an excess adhesive resin portion made of a light-transmitting adhesive resin, such as an epoxy optical adhesive, which is cured by heating or ultraviolet light. As shown in FIG. 2, the light emitting element of the present invention utilizes the viscosity of a translucent adhesive resin to form a lens shape 42 of the adhesive resin. Next, an embodiment of the manufacturing process for concretely realizing the light emitting device of the present invention will be described with reference to FIGS. 3a to 3f.
発光素子の基体10の発光部7の真上(二、正確に光取
出し面の位置に対応して、通常のフォトエツチング技術
)二より透光性接着性樹脂の屈折率で決まる必要なレン
ズ形状のフォトレジスト層11 を形成する(第6図α
)。この部分が光取出し面に相当する。本実施例では透
光性接着性樹脂としてはエポキシ系光学接着材で、屈折
率1.5〜1.8でレンズ形状は半球で100〜300
μmφである。次にケミカルエツチング、たとえばG
a A J系にはH3P0゜系、 InP系にはHCl
系により約50μ展の段差りを形成する(第6図b)。Immediately above the light emitting part 7 of the base 10 of the light emitting element (2. Accurately correspond to the position of the light extraction surface, using normal photoetching technique) 2. The necessary lens shape determined by the refractive index of the translucent adhesive resin. A photoresist layer 11 is formed (Fig. 6 α).
). This portion corresponds to the light extraction surface. In this example, the translucent adhesive resin is an epoxy optical adhesive, with a refractive index of 1.5 to 1.8 and a hemispherical lens shape of 100 to 300.
It is μmφ. Next, chemical etching, such as G
a H3P0° system for A J system, HCl for InP system
Depending on the system, a step of about 50 μm is formed (Fig. 6b).
段差を形成した基体10の面に蒸着またはスパッタ等、
たとえば真空蒸着により電極材料たとえばAuGmNi
で電極61 、65を形成する(第3図C)。次いでた
とえばリソトオソ法により、光取出し面8上の電極材料
(AtbGeNiで形成した電極)66およびフォトレ
ジスト11を除去する(第3図d)。次に光取出し面8
上に透光性接着性樹脂のエポキシ系光学接着材を滴下し
加熱または紫外線で軟硬化させ半球レンズの効果を示す
レンズ状透光性接着性樹脂21′を形成する(第3図#
)。本実施例では恒温槽中で150℃1時間(二より軟
硬化させた。22は余分の透光性接着性樹脂である。さ
らに第6図−の工程で得られた発光素子を逆にして、底
部を真空コレット23で吸着した状態で25で示すよう
に回転させると、透光性接着性樹脂の表面張力で決まる
一定した形状のレンズ21が形成される。24は真空引
きの方向を示す。Vapor deposition, sputtering, etc. on the surface of the base 10 on which the steps are formed,
For example, electrode materials such as AuGmNi can be prepared by vacuum evaporation.
Then, electrodes 61 and 65 are formed (FIG. 3C). Next, the electrode material (electrode made of AtbGeNi) 66 and the photoresist 11 on the light extraction surface 8 are removed by, for example, a lithophotographic method (FIG. 3d). Next, the light extraction surface 8
An epoxy-based optical adhesive, which is a translucent adhesive resin, is dropped on top and softened by heating or ultraviolet rays to form a lenticular translucent adhesive resin 21' exhibiting the effect of a hemispherical lens (see Fig. 3).
). In this example, the light-emitting element obtained in the process shown in Fig. 6 was turned over and hardened in a constant temperature bath at 150°C for 1 hour (2). When the bottom part is sucked by the vacuum collet 23 and rotated as shown at 25, a lens 21 with a constant shape determined by the surface tension of the translucent adhesive resin is formed.24 indicates the direction of vacuuming. show.
発明の効果
以上述べたように、本発明によると従来の発光素子のよ
うな球レンズや半球レンズが不要で、製造工程が短縮さ
れ安価となる。また従来例の一つである作りつけレンズ
のような特別な加工方法も不要となる。さらにフォトエ
ツチングにより発光部の真上に段差のある光取出し面を
形成しであるので、透光性接着性樹脂からなる半球状レ
ンズの中心を設定でき、安定な光ファイバに対する光結
合効率が得られるとともに、透光性接着性樹脂の温度、
即ち表面張力を一定にしておくことにより、常に一定形
状の半球状レンズを形成でき製造上の歩留りを向上する
ことができる利点が大きい。Effects of the Invention As described above, according to the present invention, there is no need for a ball lens or a hemispherical lens as in conventional light emitting elements, and the manufacturing process is shortened and the cost becomes low. Furthermore, there is no need for special processing methods such as a built-in lens, which is one of the conventional methods. Furthermore, since a stepped light extraction surface is formed directly above the light emitting part by photoetching, the center of the hemispherical lens made of translucent adhesive resin can be set, and stable optical coupling efficiency to the optical fiber can be achieved. At the same time, the temperature of the transparent adhesive resin,
That is, by keeping the surface tension constant, a hemispherical lens having a constant shape can be formed at all times, which has the great advantage of improving manufacturing yield.
第1図α、b、aは従来の発光素子の構成断面概要図、
第2図は本発明の構成断面概要図、第3図α乃至fは本
発明の発光素子の製造工程図である。
1・・・光ファイバ、2・・・発光ダイオード、3・・
・光、4・・・球レンズ、41・・・半球レンズ、5・
・・接着材、61.62・・・電極、7・・・発光部、
8・・・光取出し面、40・・・発光素子自体の半球状
レンズ、21・・・透光性接着性樹脂の半球状レンズ、
22・・・接着性樹脂、21′・・・レンズ状透光性接
着性樹脂、26・・・真空コレット、24・・・真空引
きの方向、25・・・回転方向特許出願人 住友電気工
業株式会社
代理人弁理士玉蟲久五部
第1図
α 第2図
第3図Figure 1 α, b, and a are schematic cross-sectional diagrams of the configuration of a conventional light emitting element;
FIG. 2 is a schematic cross-sectional view of the structure of the present invention, and FIGS. 3(a) to 3(f) are manufacturing process diagrams of the light emitting device of the present invention. 1... Optical fiber, 2... Light emitting diode, 3...
・Light, 4... Spherical lens, 41... Hemisphere lens, 5.
... Adhesive material, 61.62 ... Electrode, 7 ... Light emitting part,
8... Light extraction surface, 40... Hemispherical lens of the light emitting element itself, 21... Hemispherical lens of translucent adhesive resin,
22... Adhesive resin, 21'... Lens-shaped translucent adhesive resin, 26... Vacuum collet, 24... Vacuuming direction, 25... Rotation direction Patent applicant Sumitomo Electric Industries, Ltd. Agent Patent Attorney Co., Ltd. Tamamushiku Fifth Department Figure 1 α Figure 2 Figure 3
Claims (1)
子において、該光取出し面は該発光部の真上に外周電極
面より高い段差を備えて位置し、該光取出し面上にレン
ズ状接着性樹脂を形成してなる発光素子。In a light emitting element having a condensing lens on a surface for extracting light from a light emitting part, the light extracting surface is located directly above the light emitting part with a step higher than the outer peripheral electrode surface, and a lens-shaped lens is provided on the light extracting surface. A light emitting element made of adhesive resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58216639A JPS60107874A (en) | 1983-11-17 | 1983-11-17 | Light emitting element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58216639A JPS60107874A (en) | 1983-11-17 | 1983-11-17 | Light emitting element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60107874A true JPS60107874A (en) | 1985-06-13 |
Family
ID=16691589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58216639A Pending JPS60107874A (en) | 1983-11-17 | 1983-11-17 | Light emitting element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60107874A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007021904A1 (en) * | 2007-02-28 | 2008-09-04 | Osram Opto Semiconductors Gmbh | Housing body for opto-electronic component, has main surface with surface area and another surface area, and both surface areas are adjoined together by outer edge |
-
1983
- 1983-11-17 JP JP58216639A patent/JPS60107874A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007021904A1 (en) * | 2007-02-28 | 2008-09-04 | Osram Opto Semiconductors Gmbh | Housing body for opto-electronic component, has main surface with surface area and another surface area, and both surface areas are adjoined together by outer edge |
US8723211B2 (en) | 2007-02-28 | 2014-05-13 | Osram Opto Semiconductors Gmbh | Optoelectronic device with housing body |
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