JPS6010756U - Side cap for hollow rolls - Google Patents

Side cap for hollow rolls

Info

Publication number
JPS6010756U
JPS6010756U JP10208683U JP10208683U JPS6010756U JP S6010756 U JPS6010756 U JP S6010756U JP 10208683 U JP10208683 U JP 10208683U JP 10208683 U JP10208683 U JP 10208683U JP S6010756 U JPS6010756 U JP S6010756U
Authority
JP
Japan
Prior art keywords
side cap
hollow rolls
tip
hollow
rolls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10208683U
Other languages
Japanese (ja)
Inventor
和知　洋
輝夫 吉村
Original Assignee
株式会社トクヤマ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社トクヤマ filed Critical 株式会社トクヤマ
Priority to JP10208683U priority Critical patent/JPS6010756U/en
Publication of JPS6010756U publication Critical patent/JPS6010756U/en
Pending legal-status Critical Current

Links

Landscapes

  • Buffer Packaging (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は長尺物を巻取った中空ロールの梱包方式を示す
部分断面図、第２図は従来のサイドキャップの斜視図、
第３図は従来のサイドキャップの断面図、第４図〜第６
図は本考案のサイドキャップの代表的な態様を示す断面
図である。 図において、１はサイドキャップ、２は中空ロール、３
はフィルム、４は包装材料、５は紐、６は側板、７はガ
イド、８は送りローラ、９は筒状体、１０は鍔、１１は
傾斜面、１２はアール、１３．１３’は凸部、Ａは筒状
体の先端を夫々示す。Fig. 1 is a partial sectional view showing a packaging method for a hollow roll wound up with a long object, Fig. 2 is a perspective view of a conventional side cap,
Figure 3 is a sectional view of a conventional side cap, Figures 4 to 6
The figure is a sectional view showing a typical aspect of the side cap of the present invention. In the figure, 1 is a side cap, 2 is a hollow roll, and 3 is a side cap.
is a film, 4 is a packaging material, 5 is a string, 6 is a side plate, 7 is a guide, 8 is a feed roller, 9 is a cylindrical body, 10 is a collar, 11 is an inclined surface, 12 is a radius, 13.13' is a convex Part and A indicate the tip of the cylindrical body, respectively.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一端に鍔を有する筒状体の肉厚が先端に向って減少する
如く先端部の内径を拡大してなる中空ロール用サイドキ
ャップ。A side cap for a hollow roll, which is made of a cylindrical body having a flange at one end, and the inner diameter of the tip is enlarged so that the wall thickness decreases toward the tip.
JP10208683U 1983-07-02 1983-07-02 Side cap for hollow rolls Pending JPS6010756U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10208683U JPS6010756U (en) 1983-07-02 1983-07-02 Side cap for hollow rolls

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10208683U JPS6010756U (en) 1983-07-02 1983-07-02 Side cap for hollow rolls

Publications (1)

Publication Number Publication Date
JPS6010756U true JPS6010756U (en) 1985-01-24

Family

ID=30240793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10208683U Pending JPS6010756U (en) 1983-07-02 1983-07-02 Side cap for hollow rolls

Country Status (1)

Country Link
JP (1) JPS6010756U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610056B2 (en) * 1975-10-08 1981-03-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610056B2 (en) * 1975-10-08 1981-03-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same

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