JPS60106714U - Seal material installation device - Google Patents
Seal material installation deviceInfo
- Publication number
- JPS60106714U JPS60106714U JP20112383U JP20112383U JPS60106714U JP S60106714 U JPS60106714 U JP S60106714U JP 20112383 U JP20112383 U JP 20112383U JP 20112383 U JP20112383 U JP 20112383U JP S60106714 U JPS60106714 U JP S60106714U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- adhered
- elastic body
- copying
- sealing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図は本考案の一実施例のシール材の取付は装置を示し、
第1図はシール材および被接着物を配置した状態の一部
断面図、第2図は第1図における加圧状態を示す一部断
面図、第3図はシール材および被接着物等あ一部拡大断
面図である。
1・・・・・・被接着物、2・・・・・・シール材、3
・・・・・・倣い型、5・・・・・・受型、5a・・・
・・・嵌合部、9・・・・・・弾性体としてのコイルば
ね、15・・・・・・押型。The figure shows an apparatus for installing a sealing material according to an embodiment of the present invention,
Fig. 1 is a partial cross-sectional view of the sealing material and the adhered object arranged, Fig. 2 is a partial cross-sectional view showing the pressurized state in Fig. 1, and Fig. 3 is the sealing material and the adherend object, etc. It is a partially enlarged sectional view. 1...Subject to be adhered, 2...Sealing material, 3
...Copying mold, 5... Receiving mold, 5a...
... Fitting part, 9 ... Coil spring as an elastic body, 15 ... Press mold.
Claims (1)
材を添着する周縁形状を有しかつ上面を被接着物の載置
台面とした進退自在の倣い型と、この倣い型を進退自在
に嵌合部を形成した受型と、上記倣い型を上方に附勢す
る弾性体と、上記受型に上下動可能に対向し上記被接着
物を上記弾性体に抗して押圧し被接着物でシール材を加
圧し接着させる押型とを具備したことを特徴とするシー
ル材の取付は装置。A copying mold that has a peripheral edge shape for adhering the sealant to match the position shape of the sealant to be adhered to the object to be adhered, and whose upper surface is a table surface for placing the object to be adhered, and a copying mold that can move forward and backward freely. A receiving mold having a fitting portion formed therein, an elastic body that urges the copying mold upward, and an elastic body that faces the receiving mold in a vertically movable manner and presses the object to be adhered against the elastic body. A device for attaching a sealing material, characterized in that it is equipped with a press mold for pressurizing and adhering the sealing material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20112383U JPS60106714U (en) | 1983-12-27 | 1983-12-27 | Seal material installation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20112383U JPS60106714U (en) | 1983-12-27 | 1983-12-27 | Seal material installation device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60106714U true JPS60106714U (en) | 1985-07-20 |
JPS6329544Y2 JPS6329544Y2 (en) | 1988-08-09 |
Family
ID=30762611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20112383U Granted JPS60106714U (en) | 1983-12-27 | 1983-12-27 | Seal material installation device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60106714U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002364748A (en) * | 2001-06-11 | 2002-12-18 | Takenaka Seisakusho:Kk | Method of pasting string packing, method of supplying thin body and method of assembling structure |
-
1983
- 1983-12-27 JP JP20112383U patent/JPS60106714U/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002364748A (en) * | 2001-06-11 | 2002-12-18 | Takenaka Seisakusho:Kk | Method of pasting string packing, method of supplying thin body and method of assembling structure |
Also Published As
Publication number | Publication date |
---|---|
JPS6329544Y2 (en) | 1988-08-09 |
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