JPS60106326U - Assembly structure of electronic parts - Google Patents
Assembly structure of electronic partsInfo
- Publication number
- JPS60106326U JPS60106326U JP19757583U JP19757583U JPS60106326U JP S60106326 U JPS60106326 U JP S60106326U JP 19757583 U JP19757583 U JP 19757583U JP 19757583 U JP19757583 U JP 19757583U JP S60106326 U JPS60106326 U JP S60106326U
- Authority
- JP
- Japan
- Prior art keywords
- assembly structure
- electronic parts
- thin wall
- fitted
- fitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案に係る電子部品の組立構造を適用する一
具体例である部品の部分断面図、第2図は各構成部材を
孔嵌着する場合の透孔を示す断端面図、第3図は各構成
部材を孔嵌着した状態の組立構造を示す拡大断面図であ
る。
1.2:構成部材、3:嵌合せ透孔、4:薄肉部。FIG. 1 is a partial cross-sectional view of a component that is a specific example of applying the electronic component assembly structure according to the present invention, and FIG. 2 is a cross-sectional view showing through holes when each component is fitted into the holes. FIG. 3 is an enlarged sectional view showing the assembled structure in which each component is fitted into the holes. 1.2: Component, 3: Fitting through hole, 4: Thin wall portion.
Claims (1)
状の薄肉部を突設し、その薄肉部を相互の嵌合せで押倒
し湾曲させて対向面に密接偏位することにより互いを緊
密に嵌着したことを特徴とする電子部品の組立構造。A small number of structural members that are fitted and fixed together (both have a par-shaped thin wall protruding from one side, and when the thin wall parts are fitted together, are pushed down and curved, and are closely offset to the opposing surfaces, so that they can be tightly connected to each other) An assembly structure for electronic parts characterized by fitting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19757583U JPS60106326U (en) | 1983-12-22 | 1983-12-22 | Assembly structure of electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19757583U JPS60106326U (en) | 1983-12-22 | 1983-12-22 | Assembly structure of electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60106326U true JPS60106326U (en) | 1985-07-19 |
Family
ID=30755943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19757583U Pending JPS60106326U (en) | 1983-12-22 | 1983-12-22 | Assembly structure of electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60106326U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020088034A (en) * | 2018-11-19 | 2020-06-04 | 日本ケミコン株式会社 | Electronic component and manufacturing method thereof |
-
1983
- 1983-12-22 JP JP19757583U patent/JPS60106326U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020088034A (en) * | 2018-11-19 | 2020-06-04 | 日本ケミコン株式会社 | Electronic component and manufacturing method thereof |
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