JPS60103835U - 半導体用ボンデイングワイヤ−のスプ−ルケ−ス用蓋 - Google Patents

半導体用ボンデイングワイヤ−のスプ−ルケ−ス用蓋

Info

Publication number
JPS60103835U
JPS60103835U JP19607583U JP19607583U JPS60103835U JP S60103835 U JPS60103835 U JP S60103835U JP 19607583 U JP19607583 U JP 19607583U JP 19607583 U JP19607583 U JP 19607583U JP S60103835 U JPS60103835 U JP S60103835U
Authority
JP
Japan
Prior art keywords
lid
bonding wire
spool case
semiconductors
flange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19607583U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0142350Y2 (enrdf_load_stackoverflow
Inventor
昇 田島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP19607583U priority Critical patent/JPS60103835U/ja
Publication of JPS60103835U publication Critical patent/JPS60103835U/ja
Application granted granted Critical
Publication of JPH0142350Y2 publication Critical patent/JPH0142350Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP19607583U 1983-12-19 1983-12-19 半導体用ボンデイングワイヤ−のスプ−ルケ−ス用蓋 Granted JPS60103835U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19607583U JPS60103835U (ja) 1983-12-19 1983-12-19 半導体用ボンデイングワイヤ−のスプ−ルケ−ス用蓋

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19607583U JPS60103835U (ja) 1983-12-19 1983-12-19 半導体用ボンデイングワイヤ−のスプ−ルケ−ス用蓋

Publications (2)

Publication Number Publication Date
JPS60103835U true JPS60103835U (ja) 1985-07-15
JPH0142350Y2 JPH0142350Y2 (enrdf_load_stackoverflow) 1989-12-12

Family

ID=30420865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19607583U Granted JPS60103835U (ja) 1983-12-19 1983-12-19 半導体用ボンデイングワイヤ−のスプ−ルケ−ス用蓋

Country Status (1)

Country Link
JP (1) JPS60103835U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0142350Y2 (enrdf_load_stackoverflow) 1989-12-12

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